Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1999
03/23/1999US5885365 Cleaning using pure water, followed by warming with warm pure water heated to at least about 50 degrees c. and then drying in clean air; used to melt material for pulling a semiconductor single crystal by a czochralski method
03/23/1999US5885362 Method for treating surface of substrate
03/23/1999US5885361 Introducing mixture of hydrogen gas and water vapor into apparatus, generating plasma, directing downstream along gas flow path having inner wall of silicon oxide to remove contaminants
03/23/1999US5885360 Flowing a cleaning solution downwardly through a tank containing wafer cassette, removing cassette from tank at thesame time while flowing the cleaning solution upwardly through the tank to rinse wafers
03/23/1999US5885358 Gas injection slit nozzle for a plasma process reactor
03/23/1999US5885356 Method of reducing residue accumulation in CVD chamber using ceramic lining
03/23/1999US5885355 Semiconductor fabrication apparatus with a handler
03/23/1999US5885354 Method and apparatus for processing a specimen
03/23/1999US5885353 Thermal conditioning apparatus
03/23/1999US5885352 Vapor phase processing apparatus
03/23/1999US5885346 Silicon semiconductor crystal and a method for manufacturing it
03/23/1999US5885142 Device for cleaning a liquid crystal panel
03/23/1999US5885138 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
03/23/1999US5885135 CMP wafer carrier for preferential polishing of a wafer
03/23/1999US5885134 Polishing apparatus
03/23/1999US5885054 Carrying device for semiconductor wafers
03/23/1999US5885052 Transferring apparatus and robot arm
03/23/1999US5885051 Workpiece transfer equipment in dicing machine
03/23/1999US5885045 Integrated wafer pod-load/unload and mass-transfer system
03/23/1999US5884917 Thermal processing apparatus
03/23/1999US5884835 Ultrasonic bonding method and ultrasonic bonding apparatus
03/23/1999US5884834 Multi-frequency ultrasonic wire bonder and method
03/23/1999US5884831 Ultrasonic vibration bonding chip mounter
03/23/1999US5884830 Capillary for a wire bonding apparatus
03/23/1999US5884644 Quartz tank for wet semiconductor wafer processing
03/23/1999US5884640 Method and apparatus for drying substrates
03/23/1999US5884398 Mounting spring elements on semiconductor devices
03/23/1999US5884397 Method for fabricating chip carriers and printed circuit boards
03/23/1999US5884392 Automatic assembler/disassembler apparatus adapted to pressurized sealable transportable containers
03/19/1999CA2247586A1 Polycrystalline silicon
03/18/1999WO1999013545A2 Vaporization and deposition apparatus and process
03/18/1999WO1999013513A1 Non-volatile memory cell
03/18/1999WO1999013512A1 Semiconductor component with a drift zone
03/18/1999WO1999013507A1 Cmos processing employing removable sidewall spacers for independently optimized n- and p-channel transistor performance
03/18/1999WO1999013506A1 High density plasma oxide gap filled patterned metal layers with improved electromigration resistance
03/18/1999WO1999013505A1 In-situ deposition of stop layer and dielectric layer during formation of local interconnects
03/18/1999WO1999013504A1 A load-lock mechanism and processing apparatus
03/18/1999WO1999013503A1 Method for avoiding deadlock of object to be processed and processor
03/18/1999WO1999013502A1 Method of manufacturing epitaxial semiconductor substrate, and semiconductor device
03/18/1999WO1999013501A1 Borderless vias with cvd barrier layer
03/18/1999WO1999013499A2 In-situ acceptor activation in group iii-v nitride compound semiconductors
03/18/1999WO1999013498A2 Combined cmp and wafer cleaning apparatus and associated methods
03/18/1999WO1999013497A1 Transfer device for semiconductor wafers
03/18/1999WO1999013496A1 Transfer assembly for semiconductor wafers
03/18/1999WO1999013495A2 Sealed cabinet for storage of semiconductor wafers
03/18/1999WO1999013489A2 Apparatus for improving etch uniformity and methods therefor
03/18/1999WO1999013488A1 Method and apparatus for controlling a workpiece in a vacuum chamber
03/18/1999WO1999013342A1 Capacitive micro-flow sensor, method for manufacturing the same, and fixture for externally attaching the same
03/18/1999WO1999013126A1 Multiple edge deposition exclusion rings
03/18/1999WO1998059098A3 Method and device for producing electrically conductive continuity in semiconductor components
03/18/1999WO1998059087A3 Method for bias sputtering
03/18/1999WO1998053330A3 Test head structure for integrated circuit tester
03/18/1999WO1998048449A3 Flip chip and chip scale package
03/18/1999DE19840989A1 Object wet cleaning method for e.g. semiconductor wafer
03/18/1999DE19840836A1 Vapor phase crystal growth apparatus has a narrow chamber connection
03/18/1999DE19819253A1 Test circuit board for semiconductor device
03/18/1999DE19817748A1 Control method for transport equipment of a store
03/18/1999DE19817127A1 Nonvolatile semiconductor memory device especially an EEPROM or a flash-memory
03/18/1999DE19815887A1 Semiconductor memory device for portable computer
03/18/1999DE19740904A1 Oxygen impurities are removed from a crucible-grown silicon wafer
03/18/1999DE19740055A1 Electric component casing
03/18/1999DE19739500A1 Low ohmic connection generation method for chip card safety element
03/18/1999DE19736113A1 Verfahren und Vorrichtung zur Ermittlung einer Kenngröße für ein Metallisierungsbad Method and apparatus for determining a characteristic quantity for a metallizing
03/18/1999CA2247709A1 Four mirror euv projection optics
03/17/1999EP0902610A1 Arrangement of an ordered array of balls of solder alloy on respective pads of a baseplate of a BGA device
03/17/1999EP0902487A2 A semiconductor device and method of fabrication thereof
03/17/1999EP0902482A1 SOI-MOSFET and fabrication process thereof
03/17/1999EP0902481A2 Thin film transistor with reduced parasitic capacitance
03/17/1999EP0902478A1 Multi-level memory array with channel bias algorithm
03/17/1999EP0902477A1 Dual mode memory with embedded rom
03/17/1999EP0902476A1 MOS system and methods of use
03/17/1999EP0902475A2 A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor
03/17/1999EP0902474A2 Improved laser fuse links and methods therefor
03/17/1999EP0902471A2 Semiconductor integrated circuit device and package structure for the same
03/17/1999EP0902469A2 Cooling device for electrical or electronic devices
03/17/1999EP0902467A1 Isolation for semiconductor memory cell structures and processes for making them
03/17/1999EP0902466A1 Method for manufacturing a native MOS P-channel transistor with a process manufacturing non-volatile memories
03/17/1999EP0902465A1 Process for manufacturing semiconductor integrated electronic memory devices having a virtual ground cells matrix
03/17/1999EP0902464A2 Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
03/17/1999EP0902463A1 Method for forming a plurality of parallel floating gate regions by avoiding poly stringers formation
03/17/1999EP0902462A1 A method for manufacturing a capacitor lower electrode of a semiconductor memory device
03/17/1999EP0902461A2 Process for forming structures with high aspect ratio
03/17/1999EP0902460A2 Minimising watermarks on silicon substrates
03/17/1999EP0902459A1 An apparatus for fabricating a semiconductor device and a method for fabricating a polysilicon film using the same
03/17/1999EP0902456A2 Corrosion-resistant system and method for a plasma etching apparatus
03/17/1999EP0902438A1 Methods of erasing a memory device and a method of programming a memory device for low-voltage and low-power applications
03/17/1999EP0902436A2 Microcomputer with flash memory programmable via external terminal
03/17/1999EP0902433A2 Synchronous dynamic random access memory
03/17/1999EP0902329A1 Catadioptric reduction optical system
03/17/1999EP0902326A2 Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin
03/17/1999EP0902034A2 Very large scale immobilized peptide synthesis
03/17/1999EP0901637A1 Method for testing electronic components
03/17/1999EP0857357A4 A silicide agglomeration fuse device
03/17/1999EP0839391A4 Method and apparatus for monolithic optoelectronic integrated circuit using selective epitaxy
03/17/1999EP0792524A4 Polycrystalline ferroelectric capacitor heterostructure employing hybrid electrodes
03/17/1999EP0763255A4 Substrate anchor for undercut silicon on insulator microstructures
03/17/1999EP0680662B1 Method for chemical surface passivation for in-situ bulk lifetime measurement of silicon semiconductor material
03/17/1999EP0659298B1 Ohmic contact structure between platinum and silicon carbide
03/17/1999EP0507773B1 Processing systems with intelligent article tracking
03/17/1999CN1211084A Semiconductor device having LDD structure and method for producing the same
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