Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1999
03/31/1999EP0905565A1 Improved deep ultraviolet photolithography
03/31/1999EP0905540A2 Beam homogenizer, laser illumination apparatus and method, and semiconductor device
03/31/1999EP0905502A2 A probe apparatus and a method for polishing a probe
03/31/1999EP0905495A1 Protective coating for integrated circuit devices and fabrication process thereof
03/31/1999EP0905491A2 Device for the analysis of wavelength dispersion of fluorescent rays
03/31/1999EP0905476A2 Method of end point detection for a wet etch process
03/31/1999EP0905288A1 Process for preparing semiconductor monocrystalline thin film
03/31/1999EP0905287A2 Method and apparatus for fabricating compound semiconductor epitaxial wafer by vapour phase growth
03/31/1999EP0905278A1 Method of manufacturing a ceramic coating
03/31/1999EP0905277A1 Process for making a Bi-containing ceramic layer like strontium-bismuth-tantalate
03/31/1999EP0905276A2 Apparatus for vaporizing and supplying a material
03/31/1999EP0905275A2 Apparatus for coating an essentially flat, disc-shaped substrate
03/31/1999EP0905106A2 Aluminum nitride sintered body, electronic functional material, and electrostatic chuck
03/31/1999EP0904923A1 Method and system for molding
03/31/1999EP0904895A2 Substrate polishing method and apparatus
03/31/1999EP0904893A2 Inspection of wafer edge after grinding
03/31/1999EP0904826A2 An air intake apparatus for semiconductor fabricating equipment
03/31/1999EP0904604A1 Fabrication of high-density trench dmos using sidewall spacers
03/31/1999EP0904603A2 Transistor having a vertical channel
03/31/1999EP0904601A1 Electronic devices and their manufacture
03/31/1999EP0904600A1 Method of making a contact to a diamond
03/31/1999EP0904599A1 METHOD FOR ENGRAVING THE GATE IN MOS TECHNOLOGY USING A SiON BASED HARD MASK
03/31/1999EP0904598A1 Device and method for fixing and protecting semiconductor wafers
03/31/1999EP0904597A1 Multi-level substrate processing apparatus
03/31/1999EP0904588A1 A device and method for multi-level charge/storage and reading out
03/31/1999EP0904568A1 Metal ion reduction of aminochromatic chromophores and their use in the synthesis of low metal bottom anti-reflective coatings for photoresists
03/31/1999EP0904559A1 Short wavelength pulsed laser scanner
03/31/1999EP0904185A1 Device for separating and transporting moulding material parts and device and method for grouping, positioning and transporting moulding material parts
03/31/1999EP0904164A1 Device for treatment of substrates in a fluid container
03/31/1999EP0904163A1 Method for cleaning electronic hardware components
03/31/1999EP0904159A1 Process to modify work functions using ion implantation
03/31/1999EP0838086B1 Semiconductor wafer processing adhesives and tapes
03/31/1999EP0737364B1 Semiconductor device comprising a ferroelectric memory element with a lower electrode provided with an oxygen barrier
03/31/1999EP0733284B1 Power switch protected against overcurrents
03/31/1999EP0428681B1 Improved electrical connectors and ic chip tester embodying same
03/31/1999CN1212787A Bipolar SOI device having tilted PN-junction, and method for producing such device
03/31/1999CN1212786A Semiconductor device and process for producing the same
03/31/1999CN1212768A Three-dimensional etching process
03/31/1999CN1212767A Light-absorbing antireflective layers with improved performance due to refractive index optimization
03/31/1999CN1212734A Misted precursor deposition apparatus and method with improved mist and mist flow
03/31/1999CN1212601A Multilayer wiring substrate and method for producing the same
03/31/1999CN1212471A Miniaturization of semiconductor chip
03/31/1999CN1212470A Digital switch circuit in MOS technology
03/31/1999CN1212468A Self-aligned drain contact PMOS flash memory and process for making same
03/31/1999CN1212467A Semiconductor integrated circuit device including memory device
03/31/1999CN1212466A Nonvolatile semiconductor storage apparatus and production method of same
03/31/1999CN1212465A Design for testability method selectively employing two methods for forming scan paths in circuit
03/31/1999CN1212462A Semiconductor device and manufacturing method thereof
03/31/1999CN1212461A 球栅阵列半导体封装 A ball grid array semiconductor package
03/31/1999CN1212460A Semiconductor device having function blocks with obliquely arranged signal terminals connected through two-dimensionally extensible signal lines
03/31/1999CN1212459A Semiconductor device which improves heat reliability
03/31/1999CN1212458A Method for making charge storage structure
03/31/1999CN1212457A Improved techniques for forming electrically blowable fuses on integrated circuit
03/31/1999CN1212456A Plasma processing method and apparatus
03/31/1999CN1212455A Formation of bottle shaped trench
03/31/1999CN1212454A High reliable trench capacitor type memor cell
03/31/1999CN1212453A Method of maximizing chip yield for semiconductor wafers
03/31/1999CN1212434A Ferroelectric random access memory device with reference cell array blocks
03/31/1999CN1212432A Dimension programmable fusebanks and methods for making the same
03/31/1999CN1212382A Process for manufacturing microstructured bodies
03/31/1999CN1212363A Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
03/31/1999CN1212230A Lead frame transfer device and wire bonding apparatus comprising the same
03/31/1999CN1212171A Cryogenic rectification system for recovery of fluorine compounds
03/31/1999CN1042777C Production method for semiconductor units
03/31/1999CN1042776C Method for forming resist patterns
03/31/1999CN1042775C Method of using Ge for silicon/silicon link and preparing silicon components lining chip
03/30/1999USRE36169 Semiconductor memory device
03/30/1999US5889787 Circuit including structural testing means with no dedicated test pad for testing
03/30/1999US5889758 Reflection type mask structure and exposure apparatus using the same
03/30/1999US5889722 Hybrid integrated circuit device and method of fabricating the same
03/30/1999US5889718 Dynamic type semiconductor memory device
03/30/1999US5889705 Method for erasing electrically erasable and programmable memory cells
03/30/1999US5889704 Load and leave memory cell
03/30/1999US5889696 Thin-film capacitor device and RAM device using ferroelectric film
03/30/1999US5889687 Simulator, simulation and fabrication methods of semiconductor device and storage medium storing program for executing the simulation method
03/30/1999US5889686 Profile simulation method
03/30/1999US5889682 Clock routing design method using a hieraichical layout design
03/30/1999US5889681 Method of generating layout of semiconductor integrated circuit
03/30/1999US5889680 Device simulation method for use in numerical analyses of a semiconductor device
03/30/1999US5889678 Topography simulation method
03/30/1999US5889674 Method and system for generating product performance history
03/30/1999US5889657 Surface-mounting structure and method of electronic devices
03/30/1999US5889580 Scanning-slit exposure device
03/30/1999US5889573 Thin film transistor substrate, manufacturing method thereof, liquid crystal display panel and liquid crystal display equipment
03/30/1999US5889567 Illumination system for color displays
03/30/1999US5889531 Graphic processing apparatus
03/30/1999US5889452 Miniature device for executing a predetermined function, in particular microrelay
03/30/1999US5889427 Voltage step-up circuit
03/30/1999US5889335 Semiconductor device and method of manufacturing the same
03/30/1999US5889334 Semiconductor integrated circuit and fabrication method therefor
03/30/1999US5889332 Area matched package
03/30/1999US5889331 Dielectric spacer exposes part of the conductive layer, allowing thicker silicide on the conductive layer while maintaining the thickness of the silicide layer in the junction at a conventional depth
03/30/1999US5889330 Semiconductor device whose flattening resin film component has a controlled carbon atom content
03/30/1999US5889328 Refractory metal capped low resistivity metal conductor lines and vias
03/30/1999US5889326 Structure for bonding semiconductor device to substrate
03/30/1999US5889323 Semiconductor package and method of manufacturing the same
03/30/1999US5889321 Stiffeners with improved adhesion to flexible substrates
03/30/1999US5889320 Tape application platform and processes therefor
03/30/1999US5889315 Semiconductor structure having two levels of buried regions
03/30/1999US5889314 Mixed-mode IC having an isolator for minimizing cross-talk through substrate and method of fabricating same
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