Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1999
03/24/1999EP0903779A2 Manufacture of field effect transistors
03/24/1999EP0903778A1 Etchants
03/24/1999EP0903777A1 Pattern forming method
03/24/1999EP0903776A2 Titanium polycide stabilization with a porous barrier
03/24/1999EP0903775A2 Drying treatment method and apparatus
03/24/1999EP0903774A2 Substrate plating apparatus
03/24/1999EP0903769A2 Spatially uniform gas supply and pump configuration for large wafer diameters
03/24/1999EP0903754A2 Nonvolatile semiconductor memory
03/24/1999EP0903738A2 Optical disc recording apparatus and computer readable recording medium
03/24/1999EP0903639A2 Process of making patterned protective and insulating layers
03/24/1999EP0903638A1 Process for manufacturing microstructured bodies
03/24/1999EP0903637A2 Electron beam resist
03/24/1999EP0903635A2 Light exposure pattern mask and production method of the same
03/24/1999EP0903605A2 Four mirror EUV projection optics
03/24/1999EP0903586A2 Design for testability method selectively employing two methods for forming scan paths in a circuit
03/24/1999EP0903429A2 Process for producing heavily doped silicon
03/24/1999EP0903386A1 Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith
03/24/1999EP0903210A1 Bar for mounting crystal for sawing and method of wire sawing wafers from crystal
03/24/1999EP0902976A1 High frequency microelectronics package
03/24/1999EP0902975A1 Microelectronics package
03/24/1999EP0902974A1 Conductors for integrated circuits
03/24/1999EP0902972A1 Method of high density plasma metal etching
03/24/1999EP0902971A1 A method and an apparatus for manufacturing heat-sink devices
03/24/1999EP0902970A1 Method and apparatus for misted liquid source deposition of thin films with increased yield
03/24/1999EP0902969A1 Radial multiple chamber microelectronics processing apparatus and process of making and using the apparatus
03/24/1999EP0902968A1 STABILIZATION OF THE INTERFACE BETWEEN TiN AND A1 ALLOYS
03/24/1999EP0902967A1 High flown vacuum chamber including equipment modules such as plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support
03/24/1999EP0902966A1 Non-contact holder for wafer-like articles
03/24/1999EP0902962A1 Apparatus for plasma jet treatment of substrates
03/24/1999EP0902961A1 Method for treating articles with a plasma jet
03/24/1999EP0902960A1 Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support
03/24/1999EP0902915A1 Photolithography mask using serifs and method thereof
03/24/1999EP0902843A1 Method for making a thin film of solid material, and uses thereof
03/24/1999EP0866735A4 USE OF PALLADIUM IMMERSION DEPOSITION TO SELECTIVELY INITIATE ELECTROLESS PLATING ON Ti AND W ALLOYS FOR WAFER FABRICATION
03/24/1999EP0853600A4 A method of biaxially aligning crystalline material
03/24/1999EP0840664A4 Compositions for polishing silicon wafers and methods
03/24/1999EP0839387A4 Method for forming high resistance resistors for limiting cathode current in field emission displays
03/24/1999EP0804713A4 Optical wafer positioning system
03/24/1999EP0797753B1 Rapid thermal processing apparatus and method
03/24/1999EP0781186B1 Method of applying solder to connection surfaces, and method of producing a solder alloy
03/24/1999EP0757884A4 Method of forming a fluorinated silicon oxide layer using plasma chemical vapor deposition
03/24/1999EP0698285B1 Masking method used in salicide process
03/24/1999CN1211831A Structuring method
03/24/1999CN1211827A Ferroelectric memory transistor with resistively couple floating gate
03/24/1999CN1211825A Semiconductor ingrated circuit and its manufacturing method
03/24/1999CN1211824A Composite lase bafer read-only memory and its manufacture method
03/24/1999CN1211822A Fuse device for semiconductor memory element
03/24/1999CN1211820A Method for manufacturing capacitor lower electrode of semiconductor memory device
03/24/1999CN1211818A Aperture apparatus used for photolithography and manufacturing method thereof
03/24/1999CN1211817A Alignment marks of semiconductor substrate and manufacturing method thereof
03/24/1999CN1211816A Method of manufacturing semiconductor device
03/24/1999CN1211815A Fabrication process of semiconductor devices
03/24/1999CN1211814A Method of forming semiconductor device
03/24/1999CN1211813A Light exposure pattern mask and production method of the same
03/24/1999CN1211801A Semiconductor memory
03/24/1999CN1211797A Semiconductor memory device with reduced power consumption and stable operation in data holding state
03/24/1999CN1211730A Method and apparatus for pre-processing of semiconductor substrate surface analysis
03/24/1999CN1211487A Polishing machine with improved polishing pad structure
03/24/1999CN1211467A System for diluting ultrapure chemicals which is intended for microelectronics industry
03/24/1999CN1042680C Electronic units with semiconductor slugs
03/24/1999CA2248030A1 Method of reducing circuit area by grouping compatible storage devices
03/23/1999USRE36159 Semiconductor integrated circuit device having built-in voltage drop circuit
03/23/1999US5886942 Word line driver and semiconductor device
03/23/1999US5886939 Semiconductor memory device having sub dummy bit line and sub dummy word line
03/23/1999US5886938 Semiconductor memory device having sense amplifiers with offset latch transistors and interleaved gate fingers
03/23/1999US5886937 Semiconductor read only memory and a method for reading data stored in the same
03/23/1999US5886932 Composite mode substrate voltage generation circuit for dynamic random access memory
03/23/1999US5886928 Non-volatile memory cell and method of programming
03/23/1999US5886924 Nonvolatile semiconductor memory having sub-arrays formed within pocket wells
03/23/1999US5886919 Multi-port semiconductor memory device with reduced coupling noise
03/23/1999US5886917 Semiconductor integrated circuit device
03/23/1999US5886909 Defect diagnosis using simulation for IC yield improvement
03/23/1999US5886906 Method and apparatus of simulating semiconductor circuit
03/23/1999US5886905 Method of determining operating conditions for a nonvolatile semiconductor memory
03/23/1999US5886877 Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
03/23/1999US5886867 Ferroelectric dielectric for integrated circuit applications at microwave frequencies
03/23/1999US5886866 Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing
03/23/1999US5886865 Method and apparatus for predicting failure of an eletrostatic chuck
03/23/1999US5886864 Substrate support member for uniform heating of a substrate
03/23/1999US5886863 Wafer support member
03/23/1999US5886761 Process for producing actively addressing substrate, and liquid crystal display
03/23/1999US5886616 High-voltage variable resistor unit
03/23/1999US5886565 Reference voltage generating circuit having an integrator
03/23/1999US5886558 Semiconductor unit
03/23/1999US5886535 Wafer level burn-in base unit substrate and assembly
03/23/1999US5886515 Power semiconductor devices with a temperature sensor circuit
03/23/1999US5886488 Swing support apparatus
03/23/1999US5886473 Surface wave plasma processing apparatus
03/23/1999US5886415 Anisotropic conductive sheet and printed circuit board
03/23/1999US5886411 Semiconductor device using dual damascene technology and method for manufacturing the same
03/23/1999US5886410 Low dielectric constant
03/23/1999US5886409 Electrode structure of wiring substrate of semiconductor device having expanded pitch
03/23/1999US5886407 Heat-dissipating package for microcircuit devices
03/23/1999US5886405 Semiconductor device package having inner leads with slots
03/23/1999US5886399 Lead frame and integrated circuit package
03/23/1999US5886398 Molded laminate package with integral mold gate
03/23/1999US5886395 Semiconductor device having bipolar transistor with unique ratio of base gummel number to impurity concentration of collector region
03/23/1999US5886394 Device comprising an integrated coil
03/23/1999US5886392 One-time programmable element having controlled programmed state resistance
03/23/1999US5886391 Antireflective structure
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