| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/27/1999 | US5897711 Method and apparatus for improving refractive index of dielectric films |
| 04/27/1999 | US5897710 Substrate processing apparatus and substrate processing method |
| 04/27/1999 | US5897706 Methods for crucible attachment to support base of single crystal pulling apparatus and support base assembly apparatus and support base employed therein |
| 04/27/1999 | US5897705 Process for the production of an epitaxially coated semiconductor wafer |
| 04/27/1999 | US5897425 Vertical polishing tool and method |
| 04/27/1999 | US5897381 Method of forming a layer and semiconductor substrate |
| 04/27/1999 | US5897380 Method for isolating a susceptor heating element from a chemical vapor deposition environment |
| 04/27/1999 | US5897379 Low temperature system and method for CVD copper removal |
| 04/27/1999 | US5897378 Method of monitoring deposit in chamber, method of plasma processing, method of dry-cleaning chamber, and semiconductor manufacturing apparatus |
| 04/27/1999 | US5897377 Semiconductor device manufacturing method with use of gas including acyl-group-containing compound |
| 04/27/1999 | US5897376 Method of manufacturing a semiconductor device having a reflection reducing film |
| 04/27/1999 | US5897375 Improved throughput; reduced corrosion; pitting, performance yield; interconnects in integrated circuits, |
| 04/27/1999 | US5897374 Vertical via/contact with undercut dielectric |
| 04/27/1999 | US5897373 Method of manufacturing semiconductor components having a titanium nitride layer |
| 04/27/1999 | US5897372 Formation of a self-aligned integrated circuit structure using silicon-rich nitride as a protective layer |
| 04/27/1999 | US5897371 Alignment process compatible with chemical mechanical polishing |
| 04/27/1999 | US5897370 High aspect ratio low resistivity lines/vias by surface diffusion |
| 04/27/1999 | US5897369 Method for forming interconnection of a semiconductor device |
| 04/27/1999 | US5897368 Method of fabricating metallized vias with steep walls |
| 04/27/1999 | US5897366 Directing patterned light onto natural oxide layer to define masked and unmasked portions, etching away masked portions |
| 04/27/1999 | US5897365 Removal of titanium oxide layer through an evaporation of titamium fluoride covered from the titanium oxide |
| 04/27/1999 | US5897364 Method of forming N- and P-channel transistors with shallow junctions |
| 04/27/1999 | US5897363 Shallow junction formation using multiple implant sources |
| 04/27/1999 | US5897362 Bonding silicon wafers |
| 04/27/1999 | US5897361 Semiconductor device and method of producing same |
| 04/27/1999 | US5897360 Manufacturing method of semiconductor integrated circuit |
| 04/27/1999 | US5897359 Integrated circuit which is not limited in thickness and not affected by the size and density of its pttern |
| 04/27/1999 | US5897358 Forming fluorine barrier layer between active regions, then forming dielectric layer over barier, forming gate electrode over dielectric |
| 04/27/1999 | US5897357 Method of forming a field effect transistor and method of forming CMOS integrated circuitry |
| 04/27/1999 | US5897356 Methods of forming field oxide and active area regions on a semiconductive substrate |
| 04/27/1999 | US5897354 Method of forming a non-volatile memory device with ramped tunnel dielectric layer |
| 04/27/1999 | US5897353 Method of forming dielectric film of semiconductor memory device |
| 04/27/1999 | US5897352 Method of manufacturing hemispherical grained polysilicon with improved adhesion and reduced capacitance depletion |
| 04/27/1999 | US5897350 Memory cell structure for semiconductor memory device and fabricating method thereof |
| 04/27/1999 | US5897349 Method for fabricating a capped gate conductor |
| 04/27/1999 | US5897348 Low mask count self-aligned silicided CMOS transistors with a high electrostatic discharge resistance |
| 04/27/1999 | US5897347 Semiconductor, semiconductor device, and method for fabricating the same |
| 04/27/1999 | US5897346 Heating silicon semiconductor film after introduction of hydrogen ions by plasma doping; solves problems of off current and interface levles |
| 04/27/1999 | US5897345 Semiconductor device and process for fabricating the same |
| 04/27/1999 | US5897344 Method of making a thin film semiconductor device |
| 04/27/1999 | US5897343 Method of making a power switching trench MOSFET having aligned source regions |
| 04/27/1999 | US5897342 Multilayer interconnection technique |
| 04/27/1999 | US5897341 Forming solid state diffusion bond between component aluminum bonding pad and metal-coated substrate bonding pad |
| 04/27/1999 | US5897338 Method for encapsulating an integrated semi-conductor circuit |
| 04/27/1999 | US5897337 Process for adhesively bonding a semiconductor chip to a carrier film |
| 04/27/1999 | US5897336 Direct chip attach for low alpha emission interconnect system |
| 04/27/1999 | US5897335 Flip-chip bonding method |
| 04/27/1999 | US5897334 Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards |
| 04/27/1999 | US5897333 Method for forming integrated composite semiconductor devices |
| 04/27/1999 | US5897331 Using low quality non-crystalline substrates and low processing temperature |
| 04/27/1999 | US5897327 Method of evaluating a semiconductor wafer |
| 04/27/1999 | US5897326 Method of exercising semiconductor devices |
| 04/27/1999 | US5897311 Support boat for objects to be processed |
| 04/27/1999 | US5897309 Sequential step belt furnace with individual concentric cooling elements |
| 04/27/1999 | US5897290 Lead frame magazine handling device |
| 04/27/1999 | US5897193 Semiconductor wafer |
| 04/27/1999 | US5897049 Method for wire-bonding a covered wire |
| 04/27/1999 | US5897048 Radial wire bonder and selectable side view inspection system |
| 04/27/1999 | US5896877 Support for wafer-like objects |
| 04/27/1999 | US5896875 Equipment for cleaning, etching and drying semiconductor wafer and its using method |
| 04/27/1999 | US5896874 Apparatus for controlling resist stripping solution |
| 04/27/1999 | US5896870 Method of removing slurry particles |
| 04/27/1999 | US5896869 Semiconductor package having etched-back silver-copper braze |
| 04/27/1999 | US5896729 Two-piece tube |
| 04/27/1999 | US5896674 Dry cleaner for wafer carriers |
| 04/27/1999 | CA2160630C Protein-based semiconductor integrated circuit |
| 04/24/1999 | CA2251438A1 Process for producing thin-film transistors |
| 04/22/1999 | WO1999019913A1 Memory device having a crested tunnel barrier |
| 04/22/1999 | WO1999019910A1 Porous silicon oxycarbide integrated circuit insulator |
| 04/22/1999 | WO1999019906A2 Method and apparatus for packaging high temperature solid state electronic devices |
| 04/22/1999 | WO1999019905A1 Semiconductor device having fuse and fabrication method thereof |
| 04/22/1999 | WO1999019904A1 Borderless vias with hsq gap filled patterned metal layers |
| 04/22/1999 | WO1999019903A1 Oxide etch process using a mixture of a fluorine-substituted hydrocarbon and acetylene that provides high selectivity to nitride |
| 04/22/1999 | WO1999019902A1 Method of manufacturing a semiconductor device by low temperature cvd |
| 04/22/1999 | WO1999019901A1 Method and apparatus for dispensing materials in a vacuum |
| 04/22/1999 | WO1999019900A2 Method of forming an electronic device |
| 04/22/1999 | WO1999019898A2 Method and apparatus to produce large inductive plasma for plasma processing |
| 04/22/1999 | WO1999019880A1 Nonvolatile pmos two transistor memory cell and array |
| 04/22/1999 | WO1999019818A1 System for logic extraction from a layout database |
| 04/22/1999 | WO1999019777A1 Automated substrate processing systems and methods |
| 04/22/1999 | WO1999019544A1 Copper metallization of silicon wafers using insoluble anodes |
| 04/22/1999 | WO1999019537A1 Dual frequency excitation of plasma for film deposition |
| 04/22/1999 | WO1999019536A1 Introducing process fluid over rotating substrates |
| 04/22/1999 | WO1999019535A1 Method to improve adhesion of dielectric on metal |
| 04/22/1999 | WO1999019533A1 Method of depositing an amorphous fluorocarbon film using hdp-cvd |
| 04/22/1999 | WO1999019531A1 Method to improve adhesion of dielectric on metal |
| 04/22/1999 | WO1999019530A1 A vacuum processing system having improved substrate heating and cooling |
| 04/22/1999 | WO1999019527A2 Apparatus and method for utilizing a plasma density gradient to produce a flow of particles |
| 04/22/1999 | WO1999019526A2 Apparatus and method for adjusting density distribution of a plasma |
| 04/22/1999 | WO1999019447A1 Ammonium borate containing compositions for stripping residues from semiconductor substrates |
| 04/22/1999 | WO1999019139A1 Bumped substrate assembly |
| 04/22/1999 | WO1999019107A1 Quality control method |
| 04/22/1999 | WO1999019048A1 Semiconductor manufacturing system with getter safety device |
| 04/22/1999 | WO1999004606A3 Compact microwave downstream plasma system |
| 04/22/1999 | WO1999000530A9 Low temperature chemical vapor deposition process for forming bismuth-containing ceramic thin films useful in ferroelectric memory devices |
| 04/22/1999 | WO1998005059A3 Automatic semiconductor part handler |
| 04/22/1999 | DE19848147A1 Semiconductor wafer carrier |
| 04/22/1999 | DE19844717A1 Large scale integrated circuit (LSI) with external coupling electrode on chip |
| 04/22/1999 | DE19837516A1 Thin film is formed by a combined sputter and vapor deposition process |
| 04/22/1999 | DE19827938A1 Integrated semiconductor circuit module with internal circuit |