Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/1999
04/06/1999US5892203 Apparatus for making laminated integrated circuit devices
04/06/1999US5892200 Transfer port system
04/06/1999US5892179 Solder bumps and structures for integrated redistribution routing conductors
04/06/1999US5892095 Cyano group-containing oxime sulfonate compounds
04/06/1999US5891810 Process for supplying ozone (O3) to TEOS-O3 oxidizing film depositing system
04/06/1999US5891809 Manufacturable dielectric formed using multiple oxidation and anneal steps
04/06/1999US5891807 Formation of a bottle shaped trench
04/06/1999US5891805 Method of forming contacts
04/06/1999US5891804 Process for conductors with selective deposition
04/06/1999US5891803 Rapid reflow of conductive layers by directional sputtering for interconnections in integrated circuits
04/06/1999US5891802 Method for fabricating a metallization stack structure to improve electromigration resistance and keep low resistivity of ULSI interconnects
04/06/1999US5891800 Method for depositing a flow fill layer on an integrated circuit wafer
04/06/1999US5891799 Method for making stacked and borderless via structures for multilevel metal interconnections on semiconductor substrates
04/06/1999US5891798 Method for forming a High dielectric constant insulator in the fabrication of an integrated circuit
04/06/1999US5891797 Method of forming a support structure for air bridge wiring of an integrated circuit
04/06/1999US5891796 Method for wire-bonding a covered wire
04/06/1999US5891795 High density interconnect substrate
04/06/1999US5891794 Oxygen-doped in-situ doped amorphous silicon multilayer gate structures
04/06/1999US5891793 Transistor fabrication process employing a common chamber for gate oxide and gate conductor formation
04/06/1999US5891792 Electrostatic discharge
04/06/1999US5891791 Contamination free source for shallow low energy junction implants
04/06/1999US5891789 Method for fabricating isolation layer in semiconductor device
04/06/1999US5891788 Locus isolation technique using high pressure oxidation (hipox) and protective spacers
04/06/1999US5891787 Semiconductor fabrication employing implantation of excess atoms at the edges of a trench isolation structure
04/06/1999US5891785 Process for forming self-aligned silicide
04/06/1999US5891784 Transistor fabrication method
04/06/1999US5891783 Method of reducing fringe capacitance
04/06/1999US5891782 Method for fabricating an asymmetric channel doped MOS structure
04/06/1999US5891781 Method for coding mask read-only memory
04/06/1999US5891780 Method of fabricating mask ROM using junction isolation
04/06/1999US5891779 Method of fabricating tetra-state mask read only memory
04/06/1999US5891778 Method of fabricating a semiconductor read-only memory device based on a silicon-on-insulation structure
04/06/1999US5891777 Method of making a ROM diode
04/06/1999US5891776 Methods of forming insulated-gate semiconductor devices using self-aligned trench sidewall diffusion techniques
04/06/1999US5891775 Method of making nonvolatile semiconductor device having sidewall split gate for compensating for over-erasing operation
04/06/1999US5891774 Method of fabricating EEPROM using oblique implantation
04/06/1999US5891773 Non-volatile semiconductor storage apparatus and production thereof
04/06/1999US5891772 Structure and manufacturing method for DRAM capacitors
04/06/1999US5891771 Recessed structure for shallow trench isolation and salicide process
04/06/1999US5891770 Method for fabricating a high bias metal oxide semiconductor device
04/06/1999US5891769 Method for forming a semiconductor device having a heteroepitaxial layer
04/06/1999US5891768 Method of forming a capacitor
04/06/1999US5891766 MIS semiconductor device and method of fabricating the same
04/06/1999US5891765 Method of fabricating a gate array semiconductor integrated circuit device
04/06/1999US5891764 Laser processing apparatus and laser processing process
04/06/1999US5891763 Damascene pattering of SOI MOS transistors
04/06/1999US5891762 Dynamic random access memory
04/06/1999US5891761 Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform
04/06/1999US5891758 Semiconductor device and method for manufacturing semiconductor device
04/06/1999US5891757 Method for forming a field-effect transistor having difference in capacitance between source and drain with respect to shield layer
04/06/1999US5891756 Process for converting a wire bond pad to a flip chip solder bump pad and pad formed thereby
04/06/1999US5891754 Method of inspecting integrated circuit solder joints with x-ray detectable encapsulant
04/06/1999US5891753 Method and apparatus for packaging flip chip bare die on printed circuit boards
04/06/1999US5891752 Method for making charge coupled device with all electrodes of transparent conductor
04/06/1999US5891749 Process for forming photoresist pattern in semiconductor device
04/06/1999US5891745 Test and tear-away bond pad design
04/06/1999US5891744 Method of monitoring a process of manufacturing a semiconductor wafer including hemispherical grain polysilicon
04/06/1999US5891743 Method of forming buried oxygen layer using MeV ion implantation
04/06/1999US5891605 Stress resistance for devices used in optical lithography
04/06/1999US5891596 Multilayer mask with light shield, ultrasonic cleaning
04/06/1999US5891595 Method of fabricating composite piezo-electric members and a mask used for the fabrication of the same
04/06/1999US5891543 Apparatus and method for screening using electrostatic adhesion
04/06/1999US5891529 Radiation-curable, silicon-containing resin compositions that can be used to fabricate films used as dielectric films in semiconductor devices
04/06/1999US5891513 Semiconductors
04/06/1999US5891404 Exhaust gas treatment unit
04/06/1999US5891384 Method of operating a molding machine with release film
04/06/1999US5891377 Dambarless leadframe for molded component encapsulation
04/06/1999US5891366 Anisotropically conducting adhesive, and process for producing an anisotropically conducting adhesive
04/06/1999US5891354 Methods of etching through wafers and substrates with a composite etch stop layer
04/06/1999US5891353 Polishing agent used for polishing semiconductor wafers and polishing method using the same
04/06/1999US5891352 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
04/06/1999US5891350 Adjusting DC bias voltage in plasma chambers
04/06/1999US5891349 Plasma enhanced CVD apparatus and process, and dry etching apparatus and process
04/06/1999US5891348 Process gas focusing apparatus and method
04/06/1999US5891298 Method and apparatus for peeling protective adhesive tape from semiconductor wafer
04/06/1999US5891265 Manufacturing an soi (silicon on insulator) substrate
04/06/1999US5891257 Tools for removing protective coatings fron printed circuits
04/06/1999US5891256 Immersing wafer in a water, providing a substantially particle free environment adjacent to said front face as said liquid is being removed, introducing a cleaning enhancement substance, introducing a drying substance
04/06/1999US5891250 Injector for reactor
04/06/1999US5891234 Alkoxysilane; germanium compound, trialkyl phosphate and/or trialkyl borate
04/06/1999US5891205 Chemical mechanical polishing composition
04/06/1999US5890644 Apparatus and method of clamping semiconductor devices using sliding finger supports
04/06/1999US5890599 Tray for integrated circuits
04/06/1999US5890598 Substrate cassette
04/06/1999US5890597 Wafer retaining mechanism
04/06/1999US5890502 Apparatus and method for cleaning semiconductor devices without leaving water droplets
04/06/1999US5890501 Oxidizer, fluorine compound
04/06/1999US5890390 Method and apparatus for mounting, inspecting and adjusting probe card needles
04/06/1999US5890367 Air conditioning system for semiconductor clean room including a chemical filter downstream of a humidifier
04/06/1999US5890283 Apparatus and method for mounting electrically conductive balls
04/06/1999US5890269 Semiconductor wafer, handling apparatus, and method
04/06/1999US5890251 Method and apparatus for scrubbing work in running wash liquid
04/06/1999CA2249421A1 Method for adhering a metallization to a substrate
04/06/1999CA2126873C Method and apparatus of an improved heat sink
04/06/1999CA2121301C Multilayer glass ceramic substrate and method of fabricating the same
04/01/1999WO1999016132A2 Method for producing a plastic composite body and plastic composite body
04/01/1999WO1999016131A1 Method for wiring semi-conductor components in order to prevent product piracy and manipulation, semi-conductor component made according to this method and use of said semi-conductor component in a chip card
04/01/1999WO1999016126A1 Method for producing a grooved semiconductor structure with mis-transistors
04/01/1999WO1999016125A1 Method for making a groove structure with a silicium substrate
04/01/1999WO1999016124A2 Method for producing insulations grooves in a substrate