| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/18/1999 | US5904776 Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck |
| 05/18/1999 | US5904771 Stable evaporation rate |
| 05/18/1999 | US5904770 Crystallization; catalysis with metal silicide; radiating with laser light |
| 05/18/1999 | US5904769 Epitaxial growth method |
| 05/18/1999 | US5904768 Adjusting gas pressure; aspirating vapors and particles away from melt |
| 05/18/1999 | US5904767 Irradiation of singls crystal into phosphorus isotope |
| 05/18/1999 | US5904766 Process for preparing bismuth compounds |
| 05/18/1999 | US5904576 Method of forming wiring structure |
| 05/18/1999 | US5904575 Method and apparatus incorporating nitrogen selectively for differential oxide growth |
| 05/18/1999 | US5904574 Process of making semiconductor device and improved semiconductor device |
| 05/18/1999 | US5904573 PE-TEOS process |
| 05/18/1999 | US5904572 Wet etching station and a wet etching method adapted for utilizing the same |
| 05/18/1999 | US5904570 Method for polymer removal after etching |
| 05/18/1999 | US5904569 Method for forming self-aligned vias in multi-metal integrated circuits |
| 05/18/1999 | US5904568 Method of manufacturing a semiconductor wafer |
| 05/18/1999 | US5904567 Layer member forming method |
| 05/18/1999 | US5904566 Reactive ion etch method for forming vias through nitrogenated silicon oxide layers |
| 05/18/1999 | US5904565 Low resistance contact between integrated circuit metal levels and method for same |
| 05/18/1999 | US5904564 Method for fabricating MOSFET having cobalt silicide film |
| 05/18/1999 | US5904562 Method of metallizing a semiconductor wafer |
| 05/18/1999 | US5904561 Method for forming a barrier metal film with conformal step coverage in a semiconductor intergrated circuit |
| 05/18/1999 | US5904560 Cleaning step which improves electromigration performance of interlayer connection in integrated circuits |
| 05/18/1999 | US5904559 Three dimensional contact or via structure with multiple sidewall contacts |
| 05/18/1999 | US5904558 Fabrication process of semiconductor device |
| 05/18/1999 | US5904557 Method for forming multilevel interconnection of semiconductor device |
| 05/18/1999 | US5904556 Method for making semiconductor integrated circuit device having interconnection structure using tungsten film |
| 05/18/1999 | US5904555 Method for packaging a semiconductor device |
| 05/18/1999 | US5904554 Method for fabricating ohmic electrode and multi-layered structure for ohmic fabricating electrode |
| 05/18/1999 | US5904553 Fabrication method for a gate quality oxide-compound semiconductor structure |
| 05/18/1999 | US5904552 Method of resistless patterning of a substrate for implantation |
| 05/18/1999 | US5904551 Process for low energy implantation of semiconductor substrate using channeling to form retrograde wells |
| 05/18/1999 | US5904550 Method of producing a semiconductor device |
| 05/18/1999 | US5904549 Methods for growing semiconductors and devices thereof from the alloy semiconductor GaInNAs |
| 05/18/1999 | US5904548 Trench scribe line for decreased chip spacing |
| 05/18/1999 | US5904547 Apparatus for dicing a semiconductor device substrate and a process therefor |
| 05/18/1999 | US5904546 Method and apparatus for dicing semiconductor wafers |
| 05/18/1999 | US5904545 Apparatus for fabricating self-assembling microstructures |
| 05/18/1999 | US5904544 Method of making a stable high voltage semiconductor device structure |
| 05/18/1999 | US5904543 Method for formation of offset trench isolation by the use of disposable spacer and trench oxidation |
| 05/18/1999 | US5904542 Performing a semiconductor fabrication sequence within a common chamber and without opening the chamber beginning with forming a field dielectric and concluding with a gate dielectric |
| 05/18/1999 | US5904541 Method for fabricating a semiconductor device having a shallow trench isolation structure |
| 05/18/1999 | US5904540 Method for manufacturing shallow trench isolation |
| 05/18/1999 | US5904539 Semiconductor trench isolation process resulting in a silicon mesa having enhanced mechanical and electrical properties |
| 05/18/1999 | US5904538 Method for developing shallow trench isolation in a semiconductor memory device |
| 05/18/1999 | US5904537 Method of manufacturing a crown-fin-pillar capacitor for high density drams |
| 05/18/1999 | US5904536 Self aligned poly emitter bipolar technology using damascene technique |
| 05/18/1999 | US5904535 Method of fabricating a bipolar integrated structure |
| 05/18/1999 | US5904533 Metal salicide-CMP-metal salicide semiconductor process |
| 05/18/1999 | US5904532 Semiconductor processing method of providing dopant impurity into a semiconductor substrate |
| 05/18/1999 | US5904531 Method of increasing the area of a buried contact region |
| 05/18/1999 | US5904530 Method of making LDD structure spaced from channel doped region |
| 05/18/1999 | US5904529 Method of making an asymmetrical IGFET and providing a field dielectric between active regions of a semiconductor substrate |
| 05/18/1999 | US5904528 Method of forming asymmetrically doped source/drain regions |
| 05/18/1999 | US5904527 Fabricating method for a ROM device using a shockly diode |
| 05/18/1999 | US5904526 Method of fabricating high density semiconductor read-only memory device |
| 05/18/1999 | US5904525 Fabrication of high-density trench DMOS using sidewall spacers |
| 05/18/1999 | US5904524 Method of making scalable tunnel oxide window with no isolation edges |
| 05/18/1999 | US5904523 Process for device fabrication in which a layer of oxynitride is formed at low temperatures |
| 05/18/1999 | US5904522 Method of fabricating a semiconductor memory device having a capacitor |
| 05/18/1999 | US5904521 Method of forming a dynamic random access memory |
| 05/18/1999 | US5904520 Method of fabricating a CMOS transistor |
| 05/18/1999 | US5904519 Method of manufacturing Bi-CMOS |
| 05/18/1999 | US5904518 Method of manufacturing a semiconductor IC device having single transistor type nonvolatile memory cells |
| 05/18/1999 | US5904517 Ultra thin high K spacer material for use in transistor fabrication |
| 05/18/1999 | US5904516 Transistor structure and method for fabricating the same |
| 05/18/1999 | US5904515 Method for fabricating a thin film transistor with the source, drain and channel in a groove in a divided gate |
| 05/18/1999 | US5904514 Method for performing anodic oxidation |
| 05/18/1999 | US5904513 Method of forming thin film transistors |
| 05/18/1999 | US5904512 Method of making SRAM cell having single layer polysilicon thin film transistors |
| 05/18/1999 | US5904511 Method of forming a liquid crystal device |
| 05/18/1999 | US5904510 Power transistor device having ultra deep increased concentration region |
| 05/18/1999 | US5904509 Method of manufacturing a thin film transistor using anodic oxidation |
| 05/18/1999 | US5904508 Semiconductor device and a method of manufacturing the same |
| 05/18/1999 | US5904506 Semiconductor device suitable for testing |
| 05/18/1999 | US5904505 Process for producing encapsulated semiconductor device having metal foil material covering and metal foil |
| 05/18/1999 | US5904504 Die attach method and integrated circuit device |
| 05/18/1999 | US5904503 Method of forming flat inner lead tips on lead frame |
| 05/18/1999 | US5904502 Multiple 3-dimensional semiconductor device processing method and apparatus |
| 05/18/1999 | US5904501 Hollow package manufacturing method |
| 05/18/1999 | US5904499 Package for power semiconductor chips |
| 05/18/1999 | US5904497 Method and apparatus for semiconductor assembly which includes testing of chips and replacement of bad chips prior to final assembly |
| 05/18/1999 | US5904494 Fabrication process for solid-state image pick-up device with CCD register |
| 05/18/1999 | US5904490 Method of measuring electron shading damage |
| 05/18/1999 | US5904488 Semiconductor integrated circuit device |
| 05/18/1999 | US5904486 Method for performing a circuit edit through the back side of an integrated circuit die |
| 05/18/1999 | US5904478 Semiconductor processing furnace heating subassembly |
| 05/18/1999 | US5904301 Spraying device |
| 05/18/1999 | US5904288 Wire bond clamping method |
| 05/18/1999 | US5904286 Capillary holding structure for an ultrasonic horn |
| 05/18/1999 | US5904169 Apparatus for and method of treating substrate |
| 05/18/1999 | US5904164 Arrangement for treatment of wafer-shaped articles, particularly silicon wafers |
| 05/18/1999 | US5904156 Dry film resist removal in the presence of electroplated C4's |
| 05/18/1999 | US5904154 Method for removing fluorinated photoresist layers from semiconductor substrates |
| 05/18/1999 | US5904136 Wire saw and slicing method thereof |
| 05/18/1999 | US5903977 Method and an apparatus for manufacturing heatsink devices |
| 05/18/1999 | CA2127948C Surface mount solder assembly of leadless integrated circuit packages to substrates |
| 05/14/1999 | WO1999023704A1 Semiconductor component |
| 05/14/1999 | WO1999023702A1 Monolithic inductor |
| 05/14/1999 | WO1999023699A2 Polygon representation in an integrated circuit layout |
| 05/14/1999 | WO1999023698A1 Titanium nitride contact plug formation |