Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1999
05/19/1999EP0916955A2 Test head manipulator
05/19/1999EP0916748A1 Single crystal layers of lanthanum magnesium aluminate (LMA), process for their growth by liquid phase epitaxy and optical components comprising these layers
05/19/1999EP0916711A2 Conductive paste of high thermal conductivity and electronic part using the same
05/19/1999EP0916452A2 Method and apparatus for polishing semiconductor wafers
05/19/1999EP0916451A2 Method and apparatus for polishing semiconductor wafer
05/19/1999EP0916450A1 Method and apparatus for polishing semiconductor wafers
05/19/1999EP0916186A1 Programmable switch, adjustable capacitance and resonant circuit effected by means of such a switch
05/19/1999EP0916162A1 Method of operating a storage cell arrangement
05/19/1999EP0916161A1 Non-volatile storage cell
05/19/1999EP0916160A1 Silicon carbide metal-insulator semiconductor field effect transistor
05/19/1999EP0916159A1 Static memory cell
05/19/1999EP0916158A1 Low dielectric constant material for use as an insulation element in an electronic device
05/19/1999EP0916157A1 Thin film ferroelectric capacitors having improved memory retention through the use of essentially smooth bottom electrode structures
05/19/1999EP0916156A1 Method of manufacturing a semiconductor device having "shallow trench isolation"
05/19/1999EP0916155A1 Reflector cover for a semiconductor processing chamber
05/19/1999EP0916154A1 Double window exhaust arrangement for wafer plasma processor
05/19/1999EP0916138A1 Method of operating a storage cell arrangement
05/19/1999EP0915919A1 Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
05/19/1999EP0763989A4 Triple zone mascara brush
05/19/1999EP0673023B1 Vacuum-clamping device using ceramic vacuum-clamping board
05/19/1999EP0348018B1 Method of manufacture of a resin encapsulated semiconductor device
05/19/1999CN1216866A Semiconductor device with no step between well regions
05/19/1999CN1216865A Charge transferring device and charge thansferring method which can reduce floating diffusion capacitance
05/19/1999CN1216864A Static memory cell with pair of transfer MOS transitors, and pair of load elements
05/19/1999CN1216863A Vertical transistor
05/19/1999CN1216862A Semiconductor memory device and method of fabricating the same
05/19/1999CN1216861A Semiconductor storage apparatus
05/19/1999CN1216860A CMOS semiconductor device and method of fabricating the same
05/19/1999CN1216859A Automatic arrangement of wiring putterns in semiconductor device
05/19/1999CN1216858A Method of and apparatus for aligning bonding head of bonder or pick and place machine
05/19/1999CN1216727A Lapping method
05/19/1999CN1043414C Process for metal surface treatment for mfg. electronic device
05/18/1999US5905938 Method of manufacturing a semiconductor substrate material
05/18/1999US5905850 Method and apparatus for positioning substrates
05/18/1999US5905737 Test circuit
05/18/1999US5905685 Dynamic memory
05/18/1999US5905679 Semiconductor memory device clamping the overshoot and undershoot of input signal by circuit with PN junction
05/18/1999US5905676 Semiconductor memory apparatus
05/18/1999US5905675 Biasing scheme for reducing stress and improving reliability in EEPROM cells
05/18/1999US5905674 Nonvolatile memory and method of programming the same
05/18/1999US5905670 ROM storage cell and method of fabrication
05/18/1999US5905669 Hierarchical routing method to be implemented in a layout system for a semiconductor integrated circuit and medium on which the hierarchical routing program is stored
05/18/1999US5905656 Method and apparatus for dispensing a liquid
05/18/1999US5905654 Method and device for designing layout of milliwave or microwave integrated circuit
05/18/1999US5905650 Failure analyzer
05/18/1999US5905636 Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
05/18/1999US5905634 Semiconductor package having a heat slug
05/18/1999US5905626 Electrostatic chuck with ceramic pole protection
05/18/1999US5905614 Device for protection against electrostatic discharges on the terminals of a MOS integrated circuit
05/18/1999US5905577 Dual-laser voltage probing of IC's
05/18/1999US5905569 Illuminance measuring method, an exposure apparatus using the method, and a device manufacturing method
05/18/1999US5905566 Laser ablation top surface reference chuck
05/18/1999US5905548 Liquid crystal display device with large aperture ratio
05/18/1999US5905427 Integrated circuit resistor array
05/18/1999US5905402 Voltage pump circuit having an independent well-bias voltage
05/18/1999US5905400 Circuit configuration for generating a boosted output voltage
05/18/1999US5905399 CMOS integrated circuit regulator for reducing power supply noise
05/18/1999US5905384 Method for testing semiconductor element
05/18/1999US5905383 Multi-chip module development substrate
05/18/1999US5905382 Universal wafer carrier for wafer level die burn-in
05/18/1999US5905308 Bond pad for integrated circuit
05/18/1999US5905307 Semiconductor device incorporating multilayer wiring structure
05/18/1999US5905306 Metal contact to a novel polysilicon contact extension
05/18/1999US5905305 Condensed memory matrix
05/18/1999US5905303 Method for manufacturing bump leaded film carrier type semiconductor device
05/18/1999US5905302 Loadlock cassette with wafer support rails
05/18/1999US5905298 Semiconductor device having an insulation film of low permittivity and a fabrication process thereof
05/18/1999US5905297 Semiconductor integrated circuit using monolayer epitaxial growth
05/18/1999US5905296 Resistive structure for integrated circuits
05/18/1999US5905294 High rated voltage semiconductor device with floating diffusion regions
05/18/1999US5905293 Semiconductor device
05/18/1999US5905292 Semiconductor device in which an increase in threshold voltage, resulting from back-gate bias effect is mitigated, and method of manufacturing the same
05/18/1999US5905291 MISFET semiconductor integrated circuit device
05/18/1999US5905290 Single event upset hardened memory cell
05/18/1999US5905289 Planarized metallurgy structure for a semiconductor and process of fabrication
05/18/1999US5905287 Semiconductor device with high voltage protection
05/18/1999US5905286 Semiconductor device
05/18/1999US5905285 Ultra short trench transistors and process for making same
05/18/1999US5905284 Semiconductor device with a particular DMISFET structure
05/18/1999US5905283 Semiconductor device
05/18/1999US5905281 Draw cell with a fork-shaped capacitor
05/18/1999US5905280 Capacitor structures, DRAM cell structures, methods of forming capacitors, methods of forming DRAM cells, and integrated circuits incorporating capacitor structures and DRAM cell structures
05/18/1999US5905279 Low resistant trench fill for a semiconductor device
05/18/1999US5905278 Semiconductor device having a dielectric film and a fabrication process thereof
05/18/1999US5905277 Field-effect transistor and method of manufacturing the same
05/18/1999US5905274 Thin-film transistor and method of making same
05/18/1999US5905267 Electron beam exposure apparatus and method of controlling same
05/18/1999US5905256 Imaging device including output amplifier circuit having variable GAIN BANDWIDTH PRODUCT
05/18/1999US5905063 Remover solution composition for resist and method for removing resist using the same
05/18/1999US5905019 Exposure and development of photoresists
05/18/1999US5905016 Resist pattern forming method and resist material
05/18/1999US5905005 X-ray mask and method of fabricating the same
05/18/1999US5904955 Composite plastic having two materials placed in sequential locations in reservoir; injection molding into cavity without turbulence; semiconductor integrated circuit dies
05/18/1999US5904892 Forming aqueous slip comprising binder and silicon carbide ceramic powder, tape casting to produce green sheet, evaporating water
05/18/1999US5904872 Heating plate formed of silica for semiconductor vapor deposition process
05/18/1999US5904860 Hydrogen bonding surface of the first body and surface of the second body to each other without requiring use of high temperature or high pressure
05/18/1999US5904859 Applying etchant solution to metal layer, said etchant solution having a ph of at least 11, and comprising an alkali ferricyanide to etch the copper and chromium, the etchant solution also containing copper complexing agent
05/18/1999US5904791 Use of preceramic polymers as electronic adhesives
05/18/1999US5904779 Wafer electrical discharge control by wafer lifter system
05/18/1999US5904778 Silicon carbide composite article particularly useful for plasma reactors
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