Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/1999
08/05/1999WO1999023691A3 Improved low mass wafer support system
08/05/1999WO1999021021A9 Semiconductor material characterizing method and apparatus
08/05/1999WO1999019900A3 Method of forming an electronic device
08/05/1999WO1999019898A3 Method and apparatus to produce large inductive plasma for plasma processing
08/05/1999WO1999010916A3 Copper electroless deposition on a titanium-containing surface
08/05/1999WO1999007912A3 Single substrate load lock with offset cool module and buffer chamber
08/05/1999DE19841435A1 Semiconductor device has a wiring connection structure of low contact resistance
08/05/1999DE19836953A1 MOSFET has a constant threshold voltage along its channel
08/05/1999DE19835442A1 Hollow casing for integrated circuits
08/05/1999DE19829862A1 Semiconductor component manufacture method
08/05/1999DE19803392A1 Production of a soldered joint
08/05/1999DE19803013A1 Epitaxial layer transfer to an alternative substrate e.g. of glass, plastic or ceramic
08/05/1999DE19802202A1 Disc gripper mechanism
08/05/1999DE19743348A1 Semiconductor chip transport method for LED display assembly, e.g. intelligent display
08/05/1999CA2319636A1 Wafer carrier and semiconductor apparatus for processing a semiconductor substrate
08/05/1999CA2319548A1 X-y addressable electric microswitch arrays and sensor matrices employing them
08/05/1999CA2281932A1 Multi-probe test head
08/04/1999EP0933821A2 Low voltage one transistor flash eeprom cell using fowler-nordheim programming and erase
08/04/1999EP0933820A1 Semiconductor element and semiconductor memory device using the same
08/04/1999EP0933819A1 Method of fabricating a bidirectionally blocking power semiconductor
08/04/1999EP0933817A2 Semiconductor memory with stacked structure
08/04/1999EP0933813A2 Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package
08/04/1999EP0933812A1 Electroplating of conducting elements in integrated circuits
08/04/1999EP0933811A2 Dummy patterns for aluminium chemical polishing (CMP)
08/04/1999EP0933810A1 Process of reclamation of SOI substrate and reproduced substrate
08/04/1999EP0933809A2 Method for mounting flip-chip semiconductor devices
08/04/1999EP0933808A2 Resin sealing method and apparatus for a semiconductor device
08/04/1999EP0933807A2 Method for manufacturing a power semiconductor device
08/04/1999EP0933805A2 Process for anisotropic etching of nitride layer with selectivity to oxide
08/04/1999EP0933804A2 Process for the formation of a collar oxide in a trench in a semiconductor substrate
08/04/1999EP0933803A1 Method of plasma treatment
08/04/1999EP0933802A1 Process for the production of semiconductor device
08/04/1999EP0933801A1 Process for depositing a monocrystalline Silicon region
08/04/1999EP0933785A1 Semiconductor device and power supply current detecting method
08/04/1999EP0933783A2 Nonvolatile semiconductor storage device using ferroelectric films and its fabricating method.
08/04/1999EP0933782A2 Magnetic thin film element, memory element using the same, and method for recording and reproducing using the memory element
08/04/1999EP0933780A1 Interactive method for self-adjusted access on embedded dram memory macros
08/04/1999EP0933716A2 Design method of routing signal lines between circuit blocks for equalizing characteristics of circuit blocks and semiconductor integrated circuit device designed therethrough
08/04/1999EP0933683A2 Method of forming a resist pattern by using an optimized silicon carbide anti-reflective layer
08/04/1999EP0933451A1 Film forming apparatus and method of forming a crystalline silicon film
08/04/1999EP0933413A2 Adhesive sheets for semiconductor device and face-mounting type semiconductor device
08/04/1999EP0933166A1 Abrasive and method for polishing semiconductor substrate
08/04/1999EP0933120A1 Exhaust gas treatment installation
08/04/1999EP0933012A1 Method and device for positioning and retaining micro-building-blocks
08/04/1999EP0932913A1 Electroplated interconnection structures on integrated circuit chips
08/04/1999EP0932912A1 Conductive layer with anti-reflective surface portion
08/04/1999EP0932911A2 Control mechanisms for dosimetry control in ion implantation systems
08/04/1999EP0932907A1 A stabilized polysilicon resistor and a method of manufacturing it
08/04/1999EP0932874A1 A method for routing of nets in an electronic device
08/04/1999EP0932665A1 Method for sorting antifungal molecules acting on the glucanosyltransferase activity
08/04/1999EP0932638A1 Acrylic sheet having uniform distribution of coloring and mineral filler before and after thermoforming
08/04/1999EP0932500A1 Method to control cavity dimensions of fired multilayer circuit boards on a support
08/04/1999EP0879115A4 Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
08/04/1999EP0858565B1 Gas inlet device for a coating system
08/04/1999EP0740852B1 Method of producing integrated circuit devices
08/04/1999EP0739252B1 Process and apparatus for the treatment of semiconductor wafers in a fluid
08/04/1999EP0596453B1 Field programmable gate array
08/04/1999CN1225042A Wet processing methods for the manufacture of electronic components using sequential chemical processing
08/04/1999CN1224933A Method of producing photovoltaic element
08/04/1999CN1224932A Semiconductor memory device
08/04/1999CN1224931A Flash memory and manufacturing method therefor
08/04/1999CN1224930A Semiconductor device
08/04/1999CN1224928A Improved nitride etch stop layer
08/04/1999CN1224927A Method of forming void free trench isolation
08/04/1999CN1224926A Method for forming interconnect bumps on semiconductor die
08/04/1999CN1224925A Semi-conductor element and its producing apparatus and method
08/04/1999CN1224924A Method and apparatus for heat-treating SOI substrate and method of preparing SOI substrate by using the same
08/04/1999CN1224923A Computer simulation method of silicon oxidation
08/04/1999CN1224922A In-situ monitoring of polishing pad wear
08/04/1999CN1224846A Contact-making apparatus affording ease of servicing
08/04/1999CN1224835A Non-destructive method and device for measuring depth of buried interface
08/04/1999CN1044526C Semiconductor memory device
08/03/1999USRE36261 Stack capacitor DRAM cell having increased capacitor area
08/03/1999US5933761 Dual damascene structure and its manufacturing method
08/03/1999US5933760 Method and apparatus for reducing fixed charge in semiconductor device layers
08/03/1999US5933759 Method of controlling etch bias with a fixed lithography pattern for sub-micron critical dimension shallow trench applications
08/03/1999US5933758 Method for preventing electroplating of copper on an exposed surface at the edge exclusion of a semiconductor wafer
08/03/1999US5933757 Spraying substrate bearing a silicide structure with ammonium hydroxide/hydrogen peroxide to selectively remove titanium or titanium nitride residues, then with aqueous phosphoric acid/acetic/nitric acid to remove non-silicided cobalt
08/03/1999US5933756 Fabrication process of a semiconductor device having a multilayered interconnection structure
08/03/1999US5933755 Method of fabricating contact sites for microelectronic devices
08/03/1999US5933754 Semiconductor processing method of forming an electrically conductive contact plug
08/03/1999US5933753 Method of forming a bottomless liner structure
08/03/1999US5933751 Charging a group group iii donor impurity-coated group ii-vi single crystal and a group ii element for constituting the single crystal into a closed vessel and heating them without being in contact with each other
08/03/1999US5933750 Method of fabricating a semiconductor device with a thinned substrate
08/03/1999US5933749 Method for removing a top corner of a trench
08/03/1999US5933748 Method of making a semiconductor device
08/03/1999US5933747 Method and structure for an advanced isolation spacer shell
08/03/1999US5933746 Process of forming trench isolation device
08/03/1999US5933745 Method of making total dielectric semiconductor device isolation region
08/03/1999US5933744 Alignment method for used in chemical mechanical polishing process
08/03/1999US5933742 Multi-crown capacitor for high density DRAMS
08/03/1999US5933741 Forming low resistance transistor elements using self-aligned silicide process without short circuiting
08/03/1999US5933740 RTP booster to semiconductor device anneal
08/03/1999US5933739 Self-aligned silicidation structure and method of formation thereof
08/03/1999US5933738 Method of forming a field effect transistor
08/03/1999US5933737 Buried-channel MOS transistor and process of producing same
08/03/1999US5933736 Method of manufacturing a semiconductor device
08/03/1999US5933735 Semiconductor read-only memory device and method of fabricating the same
08/03/1999US5933734 High speed MOS-technology power device integrated structure, and related manufacturing process
08/03/1999US5933733 Zero thermal budget manufacturing process for MOS-technology power devices