| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 07/20/1999 | US5924916 Apparatus and method for polishing a semiconductor wafer |
| 07/20/1999 | US5924833 Automated wafer transfer system |
| 07/20/1999 | US5924623 Diffusion patterned C4 bump pads |
| 07/20/1999 | US5924622 Method and apparatus for soldering ball grid array modules to substrates |
| 07/20/1999 | US5924447 Ultra high purity gas distribution component with integral valved coupling and methods for its use |
| 07/20/1999 | US5924431 Electronic component cleaning apparatus |
| 07/20/1999 | US5924191 Forming metal layer, attaching to ceramic surface, forming slit in ceramic layer down to metal layer, bending metal layer near split to form contactors which attach to other ceramic layers |
| 07/20/1999 | US5924190 Methods and apparatus for manufacturing encapsulated integrated circuits |
| 07/20/1999 | US5924154 Brush assembly apparatus |
| 07/15/1999 | WO1999035696A1 Method for producing semiconductor integrated circuit device |
| 07/15/1999 | WO1999035695A1 Silicon on insulator high-voltage switch |
| 07/15/1999 | WO1999035693A1 Semiconductor memory system and method for producing same |
| 07/15/1999 | WO1999035692A1 Subscriber interface protection circuit |
| 07/15/1999 | WO1999035690A1 Method for producing a semiconductor component and semiconductor component produced according to said method |
| 07/15/1999 | WO1999035688A1 Gettering device for ion capture |
| 07/15/1999 | WO1999035685A1 Integrated cmos transistor formation |
| 07/15/1999 | WO1999035684A1 Semiconductor device having insulating film of fluorine-added carbon film and method of producing the same |
| 07/15/1999 | WO1999035682A1 Semiconductor device, manufacture thereof, and electronic device |
| 07/15/1999 | WO1999035680A1 Low energy boron implantation for p+ poly gate |
| 07/15/1999 | WO1999035679A1 Method for making asymmetrical gate oxide thicknesses |
| 07/15/1999 | WO1999035677A1 Apparatus and method for rapid photo-thermal surface treatment |
| 07/15/1999 | WO1999035676A1 In situ wafer cleaning process |
| 07/15/1999 | WO1999035675A1 Method for forming titanium film by cvd |
| 07/15/1999 | WO1999035674A1 Method for transferring a thin film comprising a step of generating inclusions |
| 07/15/1999 | WO1999035673A1 Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
| 07/15/1999 | WO1999035672A1 Method and device for treating substrates |
| 07/15/1999 | WO1999035671A1 Method and device for drying substrates |
| 07/15/1999 | WO1999035666A1 Method of and apparatus for minimizing plasma instability in an rf processor |
| 07/15/1999 | WO1999035611A1 Support element for a semiconductor chip |
| 07/15/1999 | WO1999035536A1 Inorganic-containing photosensitive resin composition and method for forming inorganic pattern |
| 07/15/1999 | WO1999035535A1 Linear developer |
| 07/15/1999 | WO1999035505A2 Method for removing accumulated solder from probe card probing features |
| 07/15/1999 | WO1999035311A1 In situ growth of oxide and silicon layers |
| 07/15/1999 | WO1999035309A1 Plating jig of wafer |
| 07/15/1999 | WO1999035302A1 Coaxial resonant multiport microwave applicator for an ecr plasma source |
| 07/15/1999 | WO1999034977A1 Fire retarding polypropylene composition |
| 07/15/1999 | WO1999034970A1 Ceramic composites with improved interfacial properties and methods to make such composites |
| 07/15/1999 | WO1999034940A1 Improvement in aqueous stripping and cleaning compositions |
| 07/15/1999 | WO1999034939A1 Wafer container washing apparatus |
| 07/15/1999 | WO1999034897A1 Throughflow gas storage and dispensing system |
| 07/15/1999 | WO1999026293A3 Semiconductor component and manufacturing method for semiconductor component |
| 07/15/1999 | WO1999022279A3 Process for determining possible configurations of machining plants |
| 07/15/1999 | WO1999021652A3 Nanostructures |
| 07/15/1999 | DE19900364A1 Integrated circuit device made from wafer |
| 07/15/1999 | DE19900343A1 Error analysis method for integrated circuit device formed in several multi-chip wafer processes |
| 07/15/1999 | DE19900313A1 Semiconductor device, e.g. insulated gate bipolar transistor device |
| 07/15/1999 | DE19900159A1 Connecting pipe for reactive gas supply to vapor deposition chamber |
| 07/15/1999 | DE19860769A1 Self aligned contact for a DRAM |
| 07/15/1999 | DE19860505A1 Electrostatic discharge protection circuit |
| 07/15/1999 | DE19840236A1 Tungsten silicide film formation on single crystal silicon or polysilicon in semiconductor device production |
| 07/15/1999 | DE19838435A1 Semiconductor memory device, especially DRAM |
| 07/15/1999 | DE19837646A1 SOI semiconductor substrate production by SIMOX method |
| 07/15/1999 | DE19836614A1 Semiconductor chip having corner connector pads for quality control |
| 07/15/1999 | DE19832271A1 Semiconductor device, especially MOS transistor for DRAM |
| 07/15/1999 | DE19825226A1 Silicon wafer surface testing chamber e.g. for detecting heavy metal contaminants by the vapor phase decomposition |
| 07/15/1999 | DE19823253C1 Capacitor lower electrode is produced especially for a DRAM capacitor |
| 07/15/1999 | DE19821191A1 Semiconductor device plug, especially polysilicon via plug e.g. of bit line via or node via for capacitor |
| 07/15/1999 | DE19801096A1 Integrated semiconductor circuit |
| 07/15/1999 | DE19800951A1 Apparatus for wet treatment of substrates e.g. semiconductor wafers |
| 07/15/1999 | DE19800949A1 Substrate drying method, e.g. for semiconductor wafer processing |
| 07/15/1999 | DE19800715A1 Semiconductor element consists of a wafer segmented into isolated individual elements |
| 07/15/1999 | DE19800584A1 Verfahren und Vorrichtung zum Trocknen von Substraten Method and device for drying substrates |
| 07/15/1999 | DE19800566A1 Verfahren zum Herstellen eines Halbleiterbauelementes und ein derart hergestelltes Halbleiterbauelement A method of manufacturing a semiconductor device and a semiconductor device manufactured in this way |
| 07/15/1999 | DE19800340A1 Halbleiterspeicheranordnung und Verfahren zu deren Herstellung A semiconductor memory device and methods for their preparation |
| 07/15/1999 | DE19753148A1 Metal-ceramic substrate for electrical circuit |
| 07/15/1999 | CA2317537A1 Gettering device for ion capture |
| 07/15/1999 | CA2317393A1 Improvement in aqueous stripping and cleaning compositions |
| 07/14/1999 | EP0929207A2 Multi-layer ceramic substrate and method for producing the same |
| 07/14/1999 | EP0929205A2 A heater and a method of manufacturing the same |
| 07/14/1999 | EP0929105A2 Metal gate sub-micron mos transistor and method of making same |
| 07/14/1999 | EP0929103A1 DRAM cell array and fabrication process |
| 07/14/1999 | EP0929102A1 Low voltage device operable with a high voltage supply |
| 07/14/1999 | EP0929101A1 Providing dual work function doping |
| 07/14/1999 | EP0929100A2 Process for controlling the height of a stud intersecting an interconnect |
| 07/14/1999 | EP0929099A2 Method for reducing stress in metallization of an integrated circuit |
| 07/14/1999 | EP0929098A1 Process for selectively implanting dopants into the bottom of a deep trench |
| 07/14/1999 | EP0929097A2 Semiconductor device assembly method and semiconductor device produced by the method |
| 07/14/1999 | EP0929096A2 Metal patterning by formation of etchable plural metal compositions |
| 07/14/1999 | EP0929095A1 Method for producing an SOI wafer |
| 07/14/1999 | EP0929094A2 Method and device for measuring the depth of a buried interface |
| 07/14/1999 | EP0929093A2 Plasma processor for large workpieces |
| 07/14/1999 | EP0928959A2 Semiconductor variable capacitor and method of making same |
| 07/14/1999 | EP0928662A2 Semiconductor wafer surface flattening apparatus |
| 07/14/1999 | EP0928634A1 Dispensing nozzle for a die bonder |
| 07/14/1999 | EP0928500A2 Method of producing a buried, laterally insulated zone of very high conductivity in a semiconductor substrate |
| 07/14/1999 | EP0928499A1 Method for detecting the transition of different materials in semiconductor structures |
| 07/14/1999 | EP0928498A1 Method for producing a titanium monophosphide layer and its use |
| 07/14/1999 | EP0928497A1 A novel process for reliable ultra-thin oxynitride formation |
| 07/14/1999 | EP0928486A1 Device and method for testing integrated circuit dice in an integrated circuit module |
| 07/14/1999 | EP0928485A1 Two-transistor flash eprom cell |
| 07/14/1999 | EP0867070A4 Zero power fuse circuit |
| 07/14/1999 | EP0862792A4 Integrated photocathode |
| 07/14/1999 | EP0838084A4 Multilayer high vertical aspect ratio thin film structures |
| 07/14/1999 | EP0832311B1 Process for plasma enhanced anneal of titanium nitride |
| 07/14/1999 | EP0824681A4 Dynamic contaminant extraction measurement for chemical distribution systems |
| 07/14/1999 | EP0728359A4 Flash eprom integrated circuit architecture |
| 07/14/1999 | EP0647971B1 Thin film transistor and display using the transistor |
| 07/14/1999 | CN1223015A Display |
| 07/14/1999 | CN1223014A Substrate with conductor formed of low-resistance aluminum alloy |
| 07/14/1999 | CN1223013A Process for manufacturing semiconductor device and semiconductor component |