Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/1999
08/10/1999US5936277 MOS transistor with impurity-implanted region
08/10/1999US5936276 Single polysilicon level flash EEPROM cell and manufacturing process therefor
08/10/1999US5936275 High density flash memory cell and method of forming a line of floating gate transistors
08/10/1999US5936274 High density flash memory
08/10/1999US5936273 High-capacitance dynamic random access memory cell having a storage capacitor on a continuous irregular surface
08/10/1999US5936272 DRAM transistor cells with a self-aligned storage electrode contact
08/10/1999US5936271 Unit cell layout and transfer gate design for high density DRAMs having a trench capacitor with signal electrode composed of three differently doped polysilicon layers
08/10/1999US5936262 Thin film transistors
08/10/1999US5936253 Position detector and microlithography apparatus comprising same
08/10/1999US5936159 Semiconductor sensor having multi-layer movable beam structure film
08/10/1999US5936071 Reacting hydroxy compound from phenolic resin with halide compound from quinonediazide compound using solid basic catalyst insoluble in solvent
08/10/1999US5935877 Preferential etching dielectric layer overlying silicide surface of integrated circuit strucutre on semiconductor by flowing mixture of fluorine-containing etch gases and nitrogen containg gas into etch chamber containing workpiece
08/10/1999US5935876 Via structure using a composite dielectric layer
08/10/1999US5935875 Dual insulating layer methods for forming integrated circuit gates and conductive contacts
08/10/1999US5935874 Techniques for forming trenches in a silicon layer of a substrate in a high density plasma processing system
08/10/1999US5935873 Deposition of carbon into nitride layer for improved selectivity of oxide to nitride etchrate for self aligned contact etching
08/10/1999US5935871 Polishing conductive layer formed on substrate with polishing slurry having abrasive particles; contacting with cleaning solution comprising organic amine or silicate
08/10/1999US5935869 Polishing semiconductor wafer in slurry; applying aqueous solution of trialkanolamine to wafer to remove slurry
08/10/1999US5935868 Interconnect structure and method to achieve unlanded vias for low dielectric constant materials
08/10/1999US5935867 Shallow drain extension formation by angled implantation
08/10/1999US5935768 Baking and cooling of substrates done inside integrated thermal process module
08/10/1999US5935766 Method of forming a conductive plug in an interlevel dielectric
08/10/1999US5935764 Method of forming alignment mark and fabricating semiconductor device
08/10/1999US5935763 Self-aligned pattern over a reflective layer
08/10/1999US5935762 Two-layered TSI process for dual damascene patterning
08/10/1999US5935744 Method of drawing patterns through electron beam exposure utilizing target subpatterns and varied exposure quantity
08/10/1999US5935739 Mask for apertures of subfields separated by reinforcing struts of crystalline structure oriented such that the (100) direction is perpendicular to the membrane to avoid damage; thin support walls; anisotropic plasma etchiine
08/10/1999US5935738 Phase-shifting mask, exposure method and method for measuring amount of spherical aberration
08/10/1999US5935650 Method of oxidation of semiconductor wafers in a rapid thermal processing (RTP) system
08/10/1999US5935649 Vapor depositing a dielectric inorganic film for a semiconductor integrated circuit comprising tetraethyl silicate, hexafluorocarbon, and oxygen in presence of helium or argon inert gas
08/10/1999US5935647 Method of manufacturing an injector for chemical vapor deposition processing
08/10/1999US5935642 Formation of resistor with small occupied area
08/10/1999US5935638 Silicon dioxide containing coating
08/10/1999US5935502 Method for manufacturing plastic package for electronic device having a fully insulated dissipator
08/10/1999US5935460 Method of performing high-efficiency machining by high-density radical reaction using a rotating electrode, device for performing the method and the rotating electrode used therefor
08/10/1999US5935454 Forming condensates at prescribed positions on a substrate and dry etching the substrate using the condensates thus formed as an etching mask
08/10/1999US5935451 Fabrication of etched features
08/10/1999US5935410 Applying an etching photocurrent for an electrochemical etching process
08/10/1999US5935404 Applying a shorting layer across the connectors which are in electrical contact with the features, thereby shorting the features and creating assembly for which electricity is applied
08/10/1999US5935396 Method for depositing metal
08/10/1999US5935375 Apparatus and method for manufacturing a semiconductor package
08/10/1999US5935374 Electronic device fabrication apparatus
08/10/1999US5935373 Plasma processing apparatus
08/10/1999US5935340 Method and apparatus for gettering fluorine from chamber material surfaces
08/10/1999US5935338 Chemical vapor deposition chamber
08/10/1999US5935334 High temperature deposition, heating and efficient cleaning for forming dielectric films having thickness uniformity, good gap fill capability, high density, low moisture, and other desired characteristics.
08/10/1999US5935330 Automatic wafer plating equipment
08/10/1999US5935326 Apparatus for manufacturing semiconductor single crystals
08/10/1999US5935325 Apparatus for manufacturing a single crystal
08/10/1999US5935324 Apparatus and method for forming I-III-VI2 thin-film layers
08/10/1999US5935320 Process for producing silicon semiconductor wafers with low defect density
08/10/1999US5935302 Ion chromatography system for conducting an environmental analysis in semiconductor equipment
08/10/1999US5935294 Method of manufacturing and transferring metallic droplets
08/10/1999US5935203 Rectifying transfer gate circuit
08/10/1999US5934996 Semiconductor assembling method and apparatus
08/10/1999US5934991 Pod loader interface improved clean air system
08/10/1999US5934981 Method for polishing thin plate and apparatus for polishing
08/10/1999US5934980 Method of chemical mechanical polishing
08/10/1999US5934977 Method of planarizing a workpiece
08/10/1999US5934974 In-situ monitoring of polishing pad wear
08/10/1999US5934914 Microelectronic contacts with asperities and methods of making same
08/10/1999US5934865 Disk gripper
08/10/1999US5934856 Multi-chamber treatment system
08/10/1999US5934566 Washing apparatus and washing method
08/10/1999US5934545 Ball placement method and apparatus for forming a ball grid array
08/10/1999US5934299 Apparatus and method for improved washing and drying of semiconductor wafers
08/10/1999US5933943 Pin leading device
08/10/1999US5933902 Wafer cleaning system
08/10/1999CA2261394A1 Double wall reaction chamber glassware
08/10/1999CA2261391A1 Semiconductor thermal processor recirculating heater
08/10/1999CA2175787C Method of synthetic diamond ablation with an oxygen plasma and synthetic diamonds etched accordingly
08/10/1999CA2157257C Semiconductor device with amorphous carbon layer and method of fabricating the same
08/10/1999CA2110472C Method and apparatus for in-situ testing of integrated circuit chips
08/10/1999CA2072262C Semiconductor device and method for manufacturing the same
08/05/1999WO1999039394A1 X-y addressable electric microswitch arrays and sensor matrices employing them
08/05/1999WO1999039388A1 Semiconductor insulating structure with reduced surface field strength and method for the production of the said structure
08/05/1999WO1999039387A1 Transistor for analog switching functions
08/05/1999WO1999039386A1 Load port and carriage for transferring the same
08/05/1999WO1999039385A1 Method for hydrogen passivation and multichamber hollow cathode apparatus
08/05/1999WO1999039384A1 Method of forming a semiconductor device
08/05/1999WO1999039383A1 Method for treating silicon-containing polymer layers
08/05/1999WO1999039382A1 Process for ashing organic materials from substrates
08/05/1999WO1999039381A1 Method for forming shallow junctions in semiconductor wafers using controlled, low level oxygen ambients during annealing
08/05/1999WO1999039380A1 Soi substrate and method for manufacturing the same
08/05/1999WO1999039379A1 Method of rapid thermal processing (rtp) of ion implanted silicon
08/05/1999WO1999039378A1 Method for forming cavities in a semiconductor substrate by implanting atoms
08/05/1999WO1999039377A1 Compliant substrate in particular for deposit by hetero-epitaxy
08/05/1999WO1999039373A2 Fabrication of organic semiconductor devices using ink jet printing
08/05/1999WO1999039371A2 METHOD FOR PRODUCING A STRUCTURE SUCH AS AN INSULATOR SEMICONDUCTOR AND IN PARTICULAR SiCOI
08/05/1999WO1999039330A1 Interchangeable pickup, electric stringed instrument and system for an electric stringed musical instrument
08/05/1999WO1999039246A1 Process for producing a photoresist composition having a reduced tendency to produce particles
08/05/1999WO1999039245A1 A process for making a photoactive compound and photoresist therefrom
08/05/1999WO1999039241A1 Liquid crystal display device
08/05/1999WO1999039215A1 Multi-probe test head
08/05/1999WO1999039183A1 Increasing the sensitivity of an in-situ particle monitor
08/05/1999WO1999039144A1 Wafer carrier and semiconductor apparatus for processing a semiconductor substrate
08/05/1999WO1999039022A2 SUBSTRATE SUPPORT FOR SiC EPITAXY AND METHOD FOR PRODUCING AN INSERT FOR A SUSCEPTOR
08/05/1999WO1999038910A1 Solvent systems for low dielectric constant polymeric materials
08/05/1999WO1999038903A1 Snap cure adhesive based on anhydride/epoxy resins
08/05/1999WO1999026291A3 Semiconductor component and manufacturing method for semiconductor components
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