| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/22/1999 | DE19801360A1 Method for cleaning, etching, or smoothing semiconductor wafer coated surfaces |
| 07/22/1999 | DE19801313A1 Source-down FET with buried gate |
| 07/22/1999 | DE19801093A1 SOI insulated-gate bipolar transistor for integration in CMOS circuit |
| 07/22/1999 | DE19800646A1 Trägerelement für einen Halbleiterchip A member for a semiconductor chip |
| 07/22/1999 | CA2319188A1 Method for using a hard mask for critical dimension growth containment |
| 07/22/1999 | CA2318167A1 Curable epoxy-based compositions |
| 07/22/1999 | CA2318147A1 Free floating shield and semiconductor processing system |
| 07/21/1999 | EP0930656A2 Flash memory region and method of fabrication thereof |
| 07/21/1999 | EP0930655A1 "Non-volatile memory cell and corresponding manufacturing process". |
| 07/21/1999 | EP0930654A1 Three-dimensional semiconductor memory array and method for its manufacture |
| 07/21/1999 | EP0930653A1 High frequency semiconductor device |
| 07/21/1999 | EP0930652A1 Portion of metallization of integrated circuit |
| 07/21/1999 | EP0930651A1 Method for connecting conductive pads of an integrated circuit component to connexion pads of a plastic substrate using flip-chip bonding |
| 07/21/1999 | EP0930649A2 Heatsink and fabrication method thereof |
| 07/21/1999 | EP0930648A2 Package for semiconductors, and semiconductor module that employs the package |
| 07/21/1999 | EP0930647A1 Method to selectively fill recesses with conductive metal |
| 07/21/1999 | EP0930646A2 Lead-on-chip type semicoductor device having thin plate and method for manufacturing the same |
| 07/21/1999 | EP0930645A2 Solderless flip-chip assembly and method and material for same |
| 07/21/1999 | EP0930644A1 Fabrication method of plastic-packaged semiconductor device |
| 07/21/1999 | EP0930643A2 Method for formation of a doped region in a semiconductor substrate and apparatus therefor |
| 07/21/1999 | EP0930641A2 Pattern formation method and substrate manufacturing apparatus |
| 07/21/1999 | EP0930640A2 Wet etching method for silicon semiconductor wafer |
| 07/21/1999 | EP0930619A2 A voltage reference circuit |
| 07/21/1999 | EP0930543A1 Dyed photoresists and methods and articles of manufacture comprising same |
| 07/21/1999 | EP0930542A1 Polymers and photoresist compositions for short wavelength imaging |
| 07/21/1999 | EP0930499A1 Automatic visual inspection apparatus, automatic visual inspection method, and recording medium having recorded an automatic visual inspection program |
| 07/21/1999 | EP0930382A1 Process for obtaining a layer of single crystal germanium or silicon on single cystal silicon or germanium substrate respectively, and multilayer products thus obtained |
| 07/21/1999 | EP0930376A1 Method of processing substrate |
| 07/21/1999 | EP0929935A1 Coplanar waveguide amplifier |
| 07/21/1999 | EP0929921A1 Selective etch for ii-vi semiconductors |
| 07/21/1999 | EP0929910A1 Vertical power mosfet |
| 07/21/1999 | EP0929909A1 Method of manufacturing a semiconductor device, method of cleaning such a device, and cleaning agent for this purpose |
| 07/21/1999 | EP0929906A1 An arc chamber for an ion implantation system |
| 07/21/1999 | EP0929844A1 Antireflective coating for photoresist compositions |
| 07/21/1999 | EP0929843A1 Light sensitive composition containing an arylhydrazo dye |
| 07/21/1999 | EP0929842A1 Bottom antireflective coatings containing an arylhydrazo dye |
| 07/21/1999 | EP0929841A1 Method for forming photoresist features having reentrant profiles using a basic agent |
| 07/21/1999 | EP0929819A1 Membrane probing system with local contact scrub |
| 07/21/1999 | EP0929592A1 Thermosetting resin compositions useful as underfill sealants |
| 07/21/1999 | EP0929367A1 Method and device for treating substrates |
| 07/21/1999 | EP0876677B1 Ion source for an ion beam arrangement |
| 07/21/1999 | EP0764148B1 Process for preparing biscyanoacrylates |
| 07/21/1999 | EP0582605B1 Stabilization of the interface between aluminum and titanium nitride |
| 07/21/1999 | CN1223543A Vias and method for making the same in organic board and chip carriers |
| 07/21/1999 | CN1223473A Resistance element having flexing portion and its manufacturing method |
| 07/21/1999 | CN1223472A High yield semiconductor device and method of fabricating the same |
| 07/21/1999 | CN1223471A Semiconductor device having improved interconnection and method for fabricating the same |
| 07/21/1999 | CN1223470A Semiconductor device |
| 07/21/1999 | CN1223469A Recessed shallow trench isolation structure nitride liner and method for making same |
| 07/21/1999 | CN1223468A Method for testing semiconductor device and semiconductor device with transistor circuit for marking |
| 07/21/1999 | CN1223467A Method for quantitating impurity concentration and recording medium storing record of program for quantitating inpurity concentration |
| 07/21/1999 | CN1223466A Method for controlling emergency states of equipments arranged in semiconductor fabricating equipments management system |
| 07/21/1999 | CN1223465A Semiconductor device and method for manufacturing the same |
| 07/21/1999 | CN1223464A Providing dual work function doping |
| 07/21/1999 | CN1223463A Porous region removing method and semiconductor substrate manufacturing method |
| 07/21/1999 | CN1223462A Method and apparatus for etching semiconductor article and method of preparing semiconductor article by using the same |
| 07/21/1999 | CN1223461A Dual damascene with bond pads |
| 07/21/1999 | CN1223460A Semiconductor material |
| 07/21/1999 | CN1223459A 半导体器件 Semiconductor devices |
| 07/21/1999 | CN1223458A Processing method for semiconductor substrate and semiconductor substrate |
| 07/21/1999 | CN1223457A Method for controlling states of units of equipment arranged in system for controlling semiconductor fabricating equipments |
| 07/21/1999 | CN1223456A Method for controlling operating states of units of equipment arranged in system for controlling semiconductor fabrication equipments |
| 07/21/1999 | CN1223455A Repairing test method for semiconductor device |
| 07/21/1999 | CN1223405A Method for controlling preventive maintenance cycles of semiconductor fabricating equipments arranged in controlling system |
| 07/21/1999 | CN1223404A Semiconductor integrated circuit |
| 07/21/1999 | CN1223308A Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture |
| 07/21/1999 | CN1223252A Copolymer resin preparation thereof, and photoresist using the same |
| 07/21/1999 | CN1223194A Apparatus for dispensing slurry |
| 07/21/1999 | CN1044294C Semiconductor memory equipment |
| 07/21/1999 | CN1044265C Cleaning agent comprising plural components and cleaning method using the same |
| 07/20/1999 | US5926774 Test system for testing the quality of semiconductor parts and handling the collection of operation status data on the tester and handlers |
| 07/20/1999 | US5926743 Process for chlorine trifluoride chamber cleaning |
| 07/20/1999 | US5926742 Controlling semiconductor structural warpage in rapid thermal processing by selective and dynamic control of a heating source |
| 07/20/1999 | US5926741 Reoxidation after oxynitridation, reduces scattering of film thickness and prevents any lowering of the dielectric breakdown withstand voltage |
| 07/20/1999 | US5926740 Graded anti-reflective coating for IC lithography |
| 07/20/1999 | US5926739 Semiconductor processing method of promoting photoresist adhesion to an outer substrate layer predominately comprising silicon nitride |
| 07/20/1999 | US5926738 Interconnects using metal spacers and method for forming same |
| 07/20/1999 | US5926737 Use of TiCl4 etchback process during integrated CVD-Ti/TiN wafer processing |
| 07/20/1999 | US5926736 Forming barrier layer within hole, forming metal plug, forming cap layer over plug, heating so that metal in hole flows to eliminate void |
| 07/20/1999 | US5926735 Method of forming semiconductor device |
| 07/20/1999 | US5926734 Semiconductor structure having a titanium barrier layer |
| 07/20/1999 | US5926733 Metal layer patterns of a semiconductor device and a method for forming the same |
| 07/20/1999 | US5926732 Method of making a semiconductor device |
| 07/20/1999 | US5926731 Method for controlling solder bump shape and stand-off height |
| 07/20/1999 | US5926730 Conductor layer nitridation |
| 07/20/1999 | US5926729 Method for forming gate oxide layers of various predefined thicknesses |
| 07/20/1999 | US5926728 Method for fabricating tungsten polycide contacts |
| 07/20/1999 | US5926727 Phosphorous doping a semiconductor particle |
| 07/20/1999 | US5926726 In-situ acceptor activation in group III-v nitride compound semiconductors |
| 07/20/1999 | US5926725 Method of manufacturing semiconductor devices with a reverse tapered sectional configuration |
| 07/20/1999 | US5926724 Of semiconductor devices |
| 07/20/1999 | US5926723 Generation of a loose planarization mask having relaxed boundary conditions for use in shallow trench isolation processes |
| 07/20/1999 | US5926722 Planarization of shallow trench isolation by differential etchback and chemical mechanical polishing |
| 07/20/1999 | US5926721 Isolation method for semiconductor device using selective epitaxial growth |
| 07/20/1999 | US5926719 Method for fabricating a crown shaped capacitor structure |
| 07/20/1999 | US5926718 Method for forming a capacitor |
| 07/20/1999 | US5926717 Semiconductor fabrication process |
| 07/20/1999 | US5926716 Method for forming a structure |
| 07/20/1999 | US5926715 Method of forming lightly-doped drain by automatic PSG doping |
| 07/20/1999 | US5926714 Method for fabricating a transistor |