Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/1999
08/17/1999US5939890 Tweezer probe and arm therefor
08/17/1999US5939886 Plasma monitoring and control method and system
08/17/1999US5939852 Stage feeding device
08/17/1999US5939831 Methods and apparatus for pre-stabilized plasma generation for microwave clean applications
08/17/1999US5939792 Resin-mold type semiconductor device
08/17/1999US5939791 Body of semiconductor material
08/17/1999US5939789 Multilayer substrates methods for manufacturing multilayer substrates and electronic devices
08/17/1999US5939788 Copper diffusion barrier, aluminum wetting layer and improved methods for filling openings in silicon substrates with cooper
08/17/1999US5939787 Semiconductor device having a multi-layer contact structure
08/17/1999US5939786 Palladium dendrites are electrodeposited on circuitry
08/17/1999US5939780 Power supply circuit for a semiconductor integrated circuit
08/17/1999US5939779 Bottom lead semiconductor chip stack package
08/17/1999US5939778 Integrated circuit chip package
08/17/1999US5939775 Leadframe structure and process for packaging intergrated circuits
08/17/1999US5939774 Semiconductor lead frame
08/17/1999US5939771 Polyimide resin and a fluoropolymer
08/17/1999US5939770 Semiconductor device and its manufacturing method
08/17/1999US5939769 Bipolar power transistor with high collector breakdown voltage and related manufacturing process
08/17/1999US5939768 Vertical bipolar power transistor with an integrated sensing circuit
08/17/1999US5939767 Structure and process for buried diode formation in CMOS
08/17/1999US5939765 Sidewall profile
08/17/1999US5939763 Ultrathin oxynitride structure and process for VLSI applications
08/17/1999US5939762 SRAM cell using thin gate oxide pulldown transistors
08/17/1999US5939761 Method of forming a field effect transistor
08/17/1999US5939760 SRAM cell employing substantially vertically elongated pull-up resistors and methods of making, and resistor constructions and methods of making
08/17/1999US5939759 Silicon-on-insulator device with floating collector
08/17/1999US5939758 Semiconductor device with gate electrodes having conductive films
08/17/1999US5939757 Semiconductor device having triple well structure
08/17/1999US5939755 Semiconductor device
08/17/1999US5939754 Power MOSFET having a drain heterojunction
08/17/1999US5939751 MOSFET having double junction structures in each of source and drain regions
08/17/1999US5939750 Use of implanted ions to reduce oxide-nitride-oxide (ONO) etch residue and polystringers
08/17/1999US5939749 Split gate transistor array
08/17/1999US5939748 In a semiconductor memory device
08/17/1999US5939747 Capacitor produced in a semiconductor device
08/17/1999US5939746 Semiconductor memory device and manufacturing method of the same
08/17/1999US5939745 Dynamic access memory using silicon-on-insulator
08/17/1999US5939744 Semiconductor device with x-ray absorption layer
08/17/1999US5939743 Semiconductor IC device with transistors of different characteristics
08/17/1999US5939741 Methods of forming integrated circuitry and integrated circuitry structures
08/17/1999US5939740 Gate array base cell
08/17/1999US5939739 Separation of thermal and electrical paths in flip chip ballasted power heterojunction bipolar transistors
08/17/1999US5939738 Low base-resistance bipolar transistor
08/17/1999US5939737 Gate electrode of a refractory metal compound being selected from a group consisting of wn, tiw, tiwn
08/17/1999US5939731 MIS semiconductor device and method for fabricating the same
08/17/1999US5939725 Electron beam exposure apparatus
08/17/1999US5939617 Method and apparatus for testing the filtration efficiency of cloth materials intended for use in a clean room environment
08/17/1999US5939510 Undercoating composition for photolithographic resist
08/17/1999US5939465 Photopolymerizable composition
08/17/1999US5939361 Method of fabricating Tl or Hg-containing oxide superconductor film
08/17/1999US5939336 Aqueous solutions of ammonium fluoride in propylene glycol and their use in the removal of etch residues from silicon substrates
08/17/1999US5939335 Method for reducing stress in the metallization of an integrated circuit
08/17/1999US5939334 System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides
08/17/1999US5939333 Nitridating silicon substrate surface in an atmosphere of dimethylhydrazine; depositing a silicon nitride layer on nitridated surface
08/17/1999US5939241 Method of preventing photoresist residue on metal lines
08/17/1999US5939240 Semiconductor element structure with stepped portion for formation of element patterns
08/17/1999US5939236 Multilayer element with resin and coating of photoresists
08/17/1999US5939235 Positive-working light-sensitive composition
08/17/1999US5939234 Increasing the photosensitivity of photoresists comprising a compound with an acid-decomposable tert-alkyl ester and tert-alkyl carbonate group and a polyhydroxystrene protected by acetal or silyl ether group for alkali solubility
08/17/1999US5939226 Multilayer element with patterns
08/17/1999US5939225 Multilayer element with substrate and silicon, nitrogen withmetal layer
08/17/1999US5939150 Metallizing patterns on semiconductors and printed circuits; exposure to radiation beam
08/17/1999US5939149 Method of forming hydrogen-free diamond like carbon (DLC) films
08/17/1999US5939139 Method of removing coated film from substrate edge surface and apparatus for removing coated film
08/17/1999US5939132 Alignment chips positioned in the peripheral part of the semiconductor substrate and method of manufacturing thereof
08/17/1999US5939131 Methods for forming capacitors including rapid thermal oxidation
08/17/1999US5939130 Coating film forming method and coating film forming apparatus
08/17/1999US5939032 Gas permeable, liquid impermeable membrane tube with porous plug inserted in each end and platinum catalyst in space between plugs; outer glass tube enclosing membrane tube; outtakes discharge to analystical instrument
08/17/1999US5938956 Circuit and method for heating an adhesive to package or rework a semiconductor die
08/17/1999US5938951 Method and apparatus for the bonding of a contact element
08/17/1999US5938943 Near Substrate reactant Homogenization apparatus
08/17/1999US5938942 Active matrix type liquid crystal display.
08/17/1999US5938911 Coating electroconductive substrate with partially polymerized colloidal solution containing alkali salt and ethyl silicate, drying and tempering, applying voltage to bond coating to substrate
08/17/1999US5938885 Automated method for monitoring and controlling the orthophosphoric acid etch rate of silicon nitride insulator layers
08/17/1999US5938884 Apparatus for chemical mechanical polishing
08/17/1999US5938857 Method for rinsing and drying a substrate
08/17/1999US5938856 Process of removing flux residue from microelectronic components
08/17/1999US5938854 Exposing surface with contaminants to steady state radio frequency uniform glow dischage plasma for set period of time
08/17/1999US5938852 Cap for vertical furnace
08/17/1999US5938850 Single wafer heat treatment apparatus
08/17/1999US5938841 Device for producing a single crystal
08/17/1999US5938840 Method for vapor phase growth
08/17/1999US5938839 Method for forming a semiconductor device
08/17/1999US5938836 Pulling up semiconductor single crystal from melt through magnetic field generated by three or more annular magnets arranged outside pulling up chamber so that all adjacent magnets are homopolar; czochralski method
08/17/1999US5938512 Wafer holding jig
08/17/1999US5938507 Linear conditioner apparatus for a chemical mechanical polishing system
08/17/1999US5938452 Flexible interface structures for electronic devices
08/17/1999US5938105 Encapsulated ball bonding apparatus and method
08/17/1999US5938104 Direct metal bonding
08/17/1999US5938038 Parts carrier strip and apparatus for assembling parts in such a strip
08/17/1999US5937918 Gas filling method and facility
08/17/1999US5937878 Apparatus for removing particles from a wafer and for cleaning the wafer
08/17/1999US5937876 Rinsing system used in a photoresist coater with capability to avoid a reversed pressure effect
08/17/1999US5937541 Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
08/17/1999US5937518 Burr-free workpiece and method of forming
08/17/1999US5937515 Reconfigurable circuit fabrication method
08/17/1999US5937512 Method of forming a circuit board
08/17/1999US5937493 Method of manufacturing an electronic multilayer component
08/17/1999US5937469 Apparatus for mechanically cleaning the edges of wafers
08/17/1999CA2159642C Method for fabricating suspension members for micromachined sensors
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