Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/1999
07/13/1999US5923429 Apparatus for monitoring in-situ the thickness of a film during film deposition and a method thereof
07/13/1999US5923408 Substrate holding system and exposure apparatus using the same
07/13/1999US5923393 Liquid crystal display
07/13/1999US5923181 Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
07/13/1999US5923180 Compliant wafer prober docking adapter
07/13/1999US5923177 Portable wedge probe for perusing signals on the pins of an IC
07/13/1999US5923157 Semiconductor device capable of decreasing an internal voltage in period of acceleration test
07/13/1999US5923092 Wiring between semiconductor integrated circuit chip electrode pads and a surrounding lead frame
07/13/1999US5923091 Bonded semiconductor integrated circuit device
07/13/1999US5923087 Semiconductor device comprising bonding pad of barrier metal, silicide and aluminum
07/13/1999US5923080 Semiconductor apparatus having a leadframe with coated leads
07/13/1999US5923079 Single-chip system having electrostatic discharge (ESD) protective circuitry including a single bipolar transistor portion
07/13/1999US5923078 Method of forming a resistor and integrated circuitry having a resistor construction
07/13/1999US5923073 Method of manufacturing a semiconductor device and semiconductor device manufactured according to the method
07/13/1999US5923072 Semiconductor device with metallic protective film
07/13/1999US5923071 Semiconductor device having a semiconductor film of low oxygen concentration
07/13/1999US5923070 Semiconductor device having an element inclusion region for reducing stress caused by lattice mismatch
07/13/1999US5923068 Electrostatic discharge protection device
07/13/1999US5923065 Power MOSFET device manufactured with simplified fabrication processes to achieve improved ruggedness and product cost savings
07/13/1999US5923064 Semiconductor memory device with a concentrated impurities in channel transistors
07/13/1999US5923063 Double density V nonvolatile memory cell
07/13/1999US5923062 Semiconductor device incorporating capacitors
07/13/1999US5923061 CCD charge splitter
07/13/1999US5923057 Bipolar semiconductor device and method for fabricating the same
07/13/1999US5923056 Flash memory device
07/13/1999US5923053 Light-emitting diode having a curved side surface for coupling out light
07/13/1999US5923051 Field controlled semiconductor device of SiC and a method for production thereof
07/13/1999US5923050 Amorphous silicon TFT
07/13/1999US5923048 Semiconductor integrated circuit device with test element
07/13/1999US5923047 Semiconductor die having sacrificial bond pads for die test
07/13/1999US5923046 Quantum dot memory cell
07/13/1999US5923034 Pattern transfer mask, mask inspection method and a mask inspection apparatus
07/13/1999US5922624 Method for semiconductor processing using mixtures of HF and carboxylic acid
07/13/1999US5922623 Etching silicon oxide film abutting refractory metal silicide electrodes
07/13/1999US5922622 Pattern formation of silicon nitride
07/13/1999US5922620 Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
07/13/1999US5922619 Depositing polysilicon layer onto silicon wafer and raised field oxide isolation structures; depositing polysilicon etch masking layer onto polysilicon layer, planarizing polysilicon etch masking layer; etching
07/13/1999US5922606 Accurately measuring fluorescent impurities in rinse solution; monitoring for increasing concentration, then determining chip is clean by constant concentration
07/13/1999US5922515 Forming a polysilicon hard mask to prevent contaminants form entering the contact hole
07/13/1999US5922513 Illumination method and apparatus for the formation of micro patterns
07/13/1999US5922496 Apertures formed by differential etching are larger on the bottom of the mask contacting the substrate than constricted openings located near the top side of the mask, knife edges within upper sidewalls; compensation for thermal expansion
07/13/1999US5922495 Used in lithography of semiconductor, provides a mask in which the line width of light blocking patterns at the overlapping region is widened to block the excessive light from passing through the mask due to repeated exposure
07/13/1999US5922411 Composition for forming ceramic material and process for producing ceramic material
07/13/1999US5922224 Laser separation of semiconductor elements formed in a wafer of semiconductor material
07/13/1999US5922219 Pretreating substrate in chamber by exposing to ultraviolet illuminated halogen gas and subsequently uniform etching silicon oxide from substrate using gas-phase reactant system comprising hydrogen flouride and catalyst
07/13/1999US5922217 Method for correcting defects in a phase shift mask
07/13/1999US5922180 Targets, shielding plate, emitters
07/13/1999US5922168 Apparatus for making laminated electrical and electronic devices
07/13/1999US5922167 Bending integrated circuit chips
07/13/1999US5922138 Liquid treatment method and apparatus
07/13/1999US5922137 Method of producing a semiconductor wafer and a cleaning apparatus for the same
07/13/1999US5922136 Quick dump rinse (qdr) water bath receives a cassette of semiconductor substrates from a previous chemical mechanical polishing station, keeping the substrates submerged before transfer to the next station; high throughput, less chemicals
07/13/1999US5922134 Simultaneous discharge device
07/13/1999US5922133 Multiple edge deposition exclusion rings
07/13/1999US5922125 Semiconductor device and method of manufacturing the same
07/13/1999US5921855 Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
07/13/1999US5921773 Wafer boat for a vertical furnace
07/13/1999US5921744 Wafer carrying device and wafer carrying method
07/13/1999US5921559 Sealing structure for an airtight chamber
07/13/1999US5921460 Method of soldering materials supported on low-melting substrates
07/13/1999US5921458 Integrated circuit solder ball implant machine
07/13/1999US5921257 Device for treating substrates in a fluid container
07/13/1999CA2147318C Tape carrier for increasing the number of terminals between the tape carrier and a substrate
07/13/1999CA2063508C Manufacture of a micromechanical element with two degrees of freedom
07/12/1999CA2241440A1 Low voltage device operable with a high voltage supply
07/10/1999WO1999050651A1 Pattern inspection device
07/08/1999WO1999034656A1 Molded electronic package, method of preparation and method of shielding
07/08/1999WO1999034644A1 Power and control system for a workpiece chuck
07/08/1999WO1999034584A1 Bidding for telecommunications traffic over route segments
07/08/1999WO1999034512A1 Semiconductor integrated circuit device, recording medium stored with cell library, and method for designing semiconductor integrated circuit
07/08/1999WO1999034449A2 A high voltage thin film transistor with improved on-state characteristics and method for making same
07/08/1999WO1999034445A1 Semiconductor integrated circuit
07/08/1999WO1999034442A1 A novel passivation structure and its method of fabrication
07/08/1999WO1999034437A1 Wafer transferring robot
07/08/1999WO1999034436A1 Semiconductor device
07/08/1999WO1999034435A1 Circuit board, manufacture thereof, and electronic device using circuit board
07/08/1999WO1999034434A1 Epoxy bleeding inhibitor and method of preventing epoxy bleeding
07/08/1999WO1999034433A1 A method of making a self-aligned disposable gate electrode for advanced cmos design
07/08/1999WO1999034432A1 Method of providing a gettering scheme in the manufacture of silicon-on-insulator (soi) integrated circuits
07/08/1999WO1999034431A1 Method of producing silicon oxide film, method of manufacturing semiconductor device, semiconductor device, display, and infrared irradiating device
07/08/1999WO1999034430A1 Fluorocarbon film and method for forming the same
07/08/1999WO1999034429A1 Method of etching and cleaning using fluorinated carbonyl compounds
07/08/1999WO1999034428A1 Method of etching and cleaning using interhalogen compounds
07/08/1999WO1999034427A1 Hydrofluorocarbon etching compounds with reduced global warming impact
07/08/1999WO1999034426A1 Self-aligned contacts for semiconductor device
07/08/1999WO1999034425A1 Etching process for organic anti-reflective coating
07/08/1999WO1999034424A1 Precleaning step prior to metallization for sub-quarter micron application
07/08/1999WO1999034423A1 Wafer passivation structure and method of fabrication
07/08/1999WO1999034422A1 Aerosol substrate cleaner
07/08/1999WO1999034421A1 Process for producing a porous layer by an electrochemical etching process
07/08/1999WO1999034420A1 Wafer cleaning equipment and tray for use in wafer cleaning equipment
07/08/1999WO1999034419A1 Etching process
07/08/1999WO1999034415A1 A single step electroplating process for interconnect via fill and metal line patterning
07/08/1999WO1999034414A1 Holding device
07/08/1999WO1999034412A2 Workpiece chuck
07/08/1999WO1999034310A1 Timing closure methodology
07/08/1999WO1999034258A1 Alignment device and lithographic apparatus comprising such a device
07/08/1999WO1999034257A1 Positioning device having three coil systems mutually enclosing angles of 120°, and lithographic device comprising such a positioning device
07/08/1999WO1999034256A1 Method for continuous and maskless patterning of structured substrates
07/08/1999WO1999034159A1 Temperature control system for a workpiece chuck