Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/1999
07/27/1999US5929176 Vinyl 4-tetrahydropyranyloxybenzal-vinyl 4-hydroxybenzal-vinyl tetrahydropyranyl ether-vinyl acetate copolymer, vinyl 4-tetrahydropyranyloxybenzal-vinyl tetrahydropyranyl ether-vinyl acetate copolymer and preparation methods thereof
07/27/1999US5928969 Ammonium fluoride and ammonium hydroxide etchants
07/27/1999US5928967 Selective oxide-to-nitride etch process using C4 F8 /CO/Ar
07/27/1999US5928966 Forming multilayer electrodes with patterns
07/27/1999US5928965 Method for dry-etching of silicon substrate
07/27/1999US5928964 System and method for anisotropic etching of silicon nitride
07/27/1999US5928963 Plasma etching method
07/27/1999US5928962 Process for forming a semiconductor device
07/27/1999US5928961 Wear resistance during polishing
07/27/1999US5928960 Process for reducing pattern factor effects in CMP planarization
07/27/1999US5928959 Integrated circuits and multilayers with reduced dishing caused by polishing
07/27/1999US5928837 Negative-working chemical-sensitization photoresist composition comprising oxime sulfonate compounds
07/27/1999US5928818 Photoresist compositions
07/27/1999US5928816 Lithography technique in semiconductor industry; bilayer structure
07/27/1999US5928813 Attenuated phase shift mask
07/27/1999US5928791 Low dielectric constant material with improved dielectric strength
07/27/1999US5928786 Monocrystalline silicon wafer and method of thermally oxidizing a surface thereof
07/27/1999US5928768 Silicon nitride circuit board
07/27/1999US5928732 Method of forming silicon oxy-nitride films by plasma-enhanced chemical vapor deposition
07/27/1999US5928598 Acoustic wave frequency selection components.
07/27/1999US5928595 Method of manufacturing a semiconductor component
07/27/1999US5928537 Pneumatic pickup tool for small parts
07/27/1999US5928528 Plasma treatment method and plasma treatment system
07/27/1999US5928526 Method for manufacturing a substrate having an irregular shape
07/27/1999US5928506 Water purifier for drinking water
07/27/1999US5928458 Flip chip bonding with non conductive adhesive
07/27/1999US5928428 Apparatus and method for manufacturing a semiconductor device
07/27/1999US5928427 Apparatus for low pressure chemical vapor deposition
07/27/1999US5928426 Method and apparatus for treating exhaust gases from CVD, PECVD or plasma etch reactors
07/27/1999US5928425 Chemical catcher
07/27/1999US5928422 Regulating cylinder unit in a single-crystal pulling apparatus and a jig for installing them
07/27/1999US5928421 Method of forming gallium nitride crystal
07/27/1999US5928390 Vertical processing apparatus
07/27/1999US5928389 Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
07/27/1999US5928077 Clean room for manufacturing of semiconductor device
07/27/1999US5928062 Vertical polishing device and method
07/27/1999US5927995 Reduction of threading dislocations by amorphization and recrystallization
07/27/1999US5927994 Method for manufacturing thin film
07/27/1999US5927993 Backside processing method
07/27/1999US5927992 Method of forming a dielectric in an integrated circuit
07/27/1999US5927991 Method for forming triple well in semiconductor device
07/27/1999US5927589 Method and fixture for use in bonding a chip to a substrate
07/27/1999US5927560 Dispensing pump for epoxy encapsulation of integrated circuits
07/27/1999US5927505 Overmolded package body on a substrate
07/27/1999US5927503 Tray for processing and/or shipping integrated circuit device
07/27/1999US5927308 Megasonic cleaning system
07/27/1999US5927306 Silicon carbide
07/27/1999US5927305 Cleaning apparatus
07/27/1999US5927303 Substrate processing apparatus
07/27/1999US5927302 Method for rinsing plate-shaped articles and cleaning bath and cleaning equipment used in the same
07/27/1999US5927263 Method for manufacturing completely circular semiconductor wafers
07/27/1999US5927193 Process for via fill
07/27/1999US5927077 Processing system hot plate construction substrate
07/27/1999US5926951 Method of stacking electronic components
07/23/1999CA2259725A1 Method of fabricating capacitors in semiconductor devices
07/22/1999WO1999036965A1 A high voltage transistor having a field oxide gate region
07/22/1999WO1999036964A1 Source-down fet
07/22/1999WO1999036963A1 Vertical igbt with an soi structure
07/22/1999WO1999036957A1 Semiconductor package
07/22/1999WO1999036956A1 Etching methods for anisotropic platinum profile
07/22/1999WO1999036955A1 Plasma annealing of substrates to improve adhesion
07/22/1999WO1999036954A1 Semiconductor device and method of manufacturing the same
07/22/1999WO1999036953A1 Nanoporous silica dielectric films modified by electron beam exposure and having low dielectric constant and low water content
07/22/1999WO1999036952A1 Metallization process and apparatus
07/22/1999WO1999036951A1 Method of eliminating edge effect in chemical vapor deposition of a metal
07/22/1999WO1999036950A1 Exposure system, exposure apparatus, and coating developing exposure apparatus
07/22/1999WO1999036948A1 Integrated large area microstructures and micromechanical devices
07/22/1999WO1999036947A1 Method for using a hard mask for critical dimension growth containment
07/22/1999WO1999036946A1 Wafer aligner in center of front end frame of vacuum system
07/22/1999WO1999036945A1 Method and device for separating and transferring electronic components
07/22/1999WO1999036944A1 Method and device for drying an object
07/22/1999WO1999036943A1 Device for carrying out wet treatment of substrates
07/22/1999WO1999036941A2 Trench isolation for micromechanical devices
07/22/1999WO1999036931A2 Low ceiling temperature process for a plasma reactor with heated source of a polymer-hardening precursor material
07/22/1999WO1999036790A2 Test probe interface unit and method of manufacturing the same
07/22/1999WO1999036599A1 Semiconductor etching process and apparatus
07/22/1999WO1999036589A1 Method of cleaning a cvd cold-wall chamber and exhaust lines
07/22/1999WO1999036588A1 Method and apparatus for improved chemical vapor deposition processes using tunable temperature controlled gas injectors
07/22/1999WO1999036587A1 Vertical plasma enhanced process apparatus and method
07/22/1999WO1999036586A1 Apparatus and method for plasma enhanced chemical vapor deposition (pecvd) in a single wafer reactor
07/22/1999WO1999036585A1 Free floating shield and semiconductor processing system
07/22/1999WO1999036484A1 Curable epoxy-based compositions
07/22/1999WO1999036353A1 Process for the formation of oxide ceramic thin film
07/22/1999WO1999036336A1 Semiconductor wafer cassette positioning and detection mechanism
07/22/1999WO1999036196A1 A cleaning/buffing apparatus for use in a wafer processing device
07/22/1999WO1999023699A3 Polygon representation in an integrated circuit layout
07/22/1999WO1999001893A8 Method for producing layered structures on a substrate, substrate and semiconductor components produced according to said method
07/22/1999WO1998057378A9 Latch-up free power mos-bipolar transistor
07/22/1999DE19901922A1 Loading and unloading mechanism for integrated circuit into or from holding socket
07/22/1999DE19900165A1 Method for forming shaped wire connection
07/22/1999DE19860809A1 New di-tert.-butyl 5-norbornene-2.3-dicarboxylate and copolymers useful in photoresist, e.g. for structurizing silicon wafer
07/22/1999DE19860731A1 Installation for washing substrates during manufacture of semiconductor components
07/22/1999DE19843179A1 Production of semiconductor device especially with very fine pattern
07/22/1999DE19842459A1 Signal transfer system in microcomputer having circuits operating with different source voltage
07/22/1999DE19842245A1 Manufacturing semiconductor component, containing integrated logic circuit and DRAM
07/22/1999DE19840402A1 DMOS power element structure production
07/22/1999DE19838857A1 Semiconductor arrangement for memory cell evaluation
07/22/1999DE19837037A1 Reticle for stepwise and repetition illumination in semiconductor manufacture
07/22/1999DE19806231C1 Device for gripping an object by a gripping component with interacting adjustable gripping components
07/22/1999DE19802161A1 Stacked vias manufacturing method for microelectronic component with several wiring planes