Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/1999
09/14/1999US5952687 Semiconductor memory device having a trench capacitor with lower electrode inside the trench
09/14/1999US5952684 On a semiconductor substrate
09/14/1999US5952682 Semiconductor device with deep anode and lifetime reduction region
09/14/1999US5952679 Semiconductor substrate and method for straightening warp of semiconductor substrate
09/14/1999US5952678 The thin film transistor has p-channel part doped by boron difluoride, formed above the balk transistor part; improving memory cells high resist to soft error and no parasitic capacitance
09/14/1999US5952677 Thin film transistor and method for manufacturing the same
09/14/1999US5952675 Thin film transistor element array
09/14/1999US5952672 Containing phosphide
09/14/1999US5952669 Method of alignment for CCD and the apparatus of the same
09/14/1999US5952667 Variable-axis stigmator lens and charged-particle-beam microlithography apparatus comprising same
09/14/1999US5952658 Method and system for judging milling end point for use in charged particle beam milling system
09/14/1999US5952646 Low temperature bump-bonding semiconductor imaging device
09/14/1999US5952246 Nitride selective, anisotropic Cl2 /He etch process
09/14/1999US5952245 Method for processing samples
09/14/1999US5952244 Etching through anti-reflective layer of wafer stack with a first source gas, said first source gas being selected from chlorine, nitrogen, hydrogen chloride, etching through metallization layer of wafer stack with a second source gas
09/14/1999US5952243 Spin coating a dilectric material selected from silicates, phosphosilicates, siloxanes, silsequioxane, organic polymers, to a substrate surface to fill the voids, curing, chemical mechanical polishing the surface
09/14/1999US5952242 Method and device for removing a semiconductor wafer from a flat substrate
09/14/1999US5952241 Method and apparatus for improving alignment for metal masking in conjuction with oxide and tungsten CMP
09/14/1999US5952157 Method for removal of resist film and method for production of semiconductor device
09/14/1999US5952156 Enhanced reflectivity coating (ERC) for narrow aperture width contact and interconnection lithography
09/14/1999US5952149 High accuracy pattern transfer while suppressing oxidation of resist
09/14/1999US5952134 Method for measuring overlay accuracy
09/14/1999US5952133 Methods for evaluating image-forming characteristics of a projection-optical system used in a charged-particle-beam microlithography apparatus
09/14/1999US5952127 Liquid phase epitaxial growth method to prevent the use of a high temperature treatment; thickness of the phase shifter is easily controlled due to a low growth rate of the silicon dioxide layer serving as the phase shifter; precision
09/14/1999US5952086 Efficieny film forming in contact hole
09/14/1999US5952063 Crucible of pyrolytic boron nitride for molecular beam epitaxy
09/14/1999US5952060 Comprising interior surface of processing chamber having dimond-like carbon coating; extends durability of processing systems; prevents accumulation of residues; does not generate particulates and seals in impurities
09/14/1999US5952050 Removing edge bead formed on wafers by dispensing the chemical selectively onto the wafer and applying a suction to the area immediately surrounding the location at which the chemical is dispensed onto the wafer
09/14/1999US5952045 Comprising chuck captively holding bottom surface of water; prevents coating on backside of wafer; no need to wash backside with organic solvents; solution coatings of uniform thickness
09/14/1999US5952039 Method for manufacturing DRAM capacitor
09/14/1999US5951896 Rapid thermal processing heater technology and method of use
09/14/1999US5951893 Integrated circuit pad structure with high temperature heating element and method therefor
09/14/1999US5951879 Forming a polysilicon layer on a silicon dioxide layer formed on a silicon substrate, masking, etching, wherein said etching step comprises using a mixed gas of an etching gas and an oxygen gas
09/14/1999US5951834 Vacuum processing apparatus
09/14/1999US5951833 Anodizing apparatus
09/14/1999US5951814 A portion of electrode consumed by plasma is formed of metal silicon or glassy carbon and the remaining portion is formed of a carbon material covered with a film of glassy carbon material; capable of reducing dust generation
09/14/1999US5951804 Method for simultaneously manufacturing chip-scale package using lead frame strip with a plurality of lead frames
09/14/1999US5951779 Treatment method of semiconductor wafers and the like and treatment system for the same
09/14/1999US5951776 Positioning substrate in chemical reactor; lifting cycles
09/14/1999US5951775 Apparatus for full wafer deposition
09/14/1999US5951774 Cold-wall operated vapor-phase growth system
09/14/1999US5951773 Inductively coupled plasma chemical vapor deposition apparatus
09/14/1999US5951772 For semiconductors, integrated circuits
09/14/1999US5951770 Carousel wafer transfer system
09/14/1999US5951759 Multiple pairs of guide pipes; retaining wires; winding
09/14/1999US5951757 Method for making silicon germanium alloy and electric device structures
09/14/1999US5951755 Annealing, in first and second temperature ranges, a silicon single crystal comprising boron at a first concentration to precipitate oxygen embryos or to grow oxygen precipitations within a region at a principal surface of the silicon
09/14/1999US5951754 Adsorbing an element of goup 6 of periodic table to the surface of quantum well structure, growing by liquid-drop epitaxy, crystal structures of metal or semiconductor, chemical etching well structure, then removing masks
09/14/1999US5951753 Forming a silicon single crystal
09/14/1999US5951724 Fine particulate polishing agent, method for producing the same and method for producing semiconductor devices
09/14/1999US5951380 Polishing apparatus for a semiconductor wafer
09/14/1999US5951374 Method of polishing semiconductor wafers
09/14/1999US5951283 Substrate transporting device
09/14/1999US5951282 Vertical heat treatment apparatus
09/14/1999US5950908 Solder supplying method, solder supplying apparatus and soldering method
09/14/1999US5950907 Using alloy of tin, silvewr and lead
09/14/1999US5950843 Device for preventing contacting of wafers in wafer cassette
09/14/1999US5950817 Container for flat panel
09/14/1999US5950723 Method of regulating substrate temperature in a low pressure environment
09/14/1999US5950687 Lead forming apparatus and lead forming method
09/14/1999US5950675 Backflow prevention apparatus for feeding a mixture of gases
09/14/1999US5950645 Semiconductor wafer cleaning system
09/14/1999US5950643 Wafer processing system
09/14/1999US5950495 Two-armed transfer robot
09/14/1999US5950330 Vacuum processing apparatus and operating method therefor
09/14/1999US5950328 For semiconductor wafer; vapor bath, carrier, tray, inert gas supply, cooling pipe
09/14/1999US5950327 Methods and apparatus for cleaning and drying wafers
09/14/1999US5950304 Methods of making semiconductor chip assemblies
09/14/1999US5950292 Methods of fabricating applique circuits
09/14/1999CA2188962C High-frequency amplifier integrated circuit device
09/14/1999CA2147396C Supporting member for cooling means and electronic package using the same
09/13/1999CA2262152A1 Fiber-reinforced, composite body contactors
09/10/1999WO1999045753A1 Method for manufacturing a resistor
09/10/1999WO1999045752A1 Electric conductor with a surface structure in the form of flanges and etched grooves
09/10/1999WO1999045745A1 Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
09/10/1999WO1999045593A1 Three-dimensional device
09/10/1999WO1999045591A1 An integrated circuit package having interchip bonding and method therefor
09/10/1999WO1999045589A1 Method of forming dual field isolation structures
09/10/1999WO1999045588A2 Semiconductor device comprising a glass supporting body onto which a substrate with semiconductor elements and a metallization is attached by means of an adhesive
09/10/1999WO1999045587A2 Etching method
09/10/1999WO1999045586A1 Mould part, mould and method for encapsulating electronic components mounted on a carrier
09/10/1999WO1999045585A1 Plasma processing apparatus and plasma processing method
09/10/1999WO1999045584A1 Processing apparatus
09/10/1999WO1999045583A1 Method for electrochemically etching a p-type semiconducting material, and a substrate of at least partly porous semiconducting material
09/10/1999WO1999045582A1 A method for generation of electrical conducting or semiconducting structures in three dimensions and methods for erasure of the same structures
09/10/1999WO1999045579A1 On the fly center-finding during substrate handling in a processing system
09/10/1999WO1999045578A1 Uniform heat trace and secondary containment for delivery lines for processing system
09/10/1999WO1999045577A1 Prevention of ground fault interrupts in a semiconductor processing system
09/10/1999WO1999045576A1 Method and apparatus for automatically performing cleaning processes in a semiconductor wafer processing system
09/10/1999WO1999045575A1 Method ans apparatus for sequencing wafers in a multiple chamber, semiconductor wafer processing system
09/10/1999WO1999045574A1 Method for changing a processing medium contained in a processing tank and system for carrying out the method
09/10/1999WO1999045573A2 Device for the thermal treatment of substrates
09/10/1999WO1999045572A2 Ultra-small capacitor array
09/10/1999WO1999045443A1 Composition and method for removing resist and etching residues using hydroxylammonium carboxylates
09/10/1999WO1999045442A1 Alkaline aqueous solution and method for forming pattern of photosensitive resin composition using the same
09/10/1999WO1999045441A1 Improved modulator design for pattern generator
09/10/1999WO1999045440A1 Pattern generator with improved address resolution
09/10/1999WO1999045439A1 Improved pattern generator
09/10/1999WO1999045438A1 Method for pattern generation with improved image quality
09/10/1999WO1999045437A1 Pattern generator using euv
1 ... 5640 5641 5642 5643 5644 5645 5646 5647 5648 5649 5650 5651 5652 5653 5654 5655 5656 5657 5658 5659 5660 ... 6590