| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/28/1999 | US5958995 Blends containing photosensitive high performance aromatic ether curable polymers |
| 09/28/1999 | US5958801 Anisotropic etch method |
| 09/28/1999 | US5958799 Ion beam machining in presence of water vapor to quickly sputter away portions photoresist and expose photoresist cross-section without damage to underlying integrated circuit substrate material, then analyzing cross section |
| 09/28/1999 | US5958798 Borderless vias without degradation of HSQ gap fill layers |
| 09/28/1999 | US5958797 Planarization of a patterned structure on a substrate using an ion implantation-assisted wet chemical etch |
| 09/28/1999 | US5958796 Covering front side of wafer, removing accumulated matter from backside and fabricating components on front side |
| 09/28/1999 | US5958795 Chemical-mechanical polishing for shallow trench isolation |
| 09/28/1999 | US5958794 Method of modifying an exposed surface of a semiconductor wafer |
| 09/28/1999 | US5958793 Patterning silicon carbide films |
| 09/28/1999 | US5958656 Pattern forming method using phase shift mask |
| 09/28/1999 | US5958654 Lithographic process and energy-sensitive material for use therein |
| 09/28/1999 | US5958648 Radiation sensitive resin composition |
| 09/28/1999 | US5958646 Positive-working photosensitive composition and process for image formation |
| 09/28/1999 | US5958644 Process to form light-receiving member with outer layer made by alternately forming and etching |
| 09/28/1999 | US5958636 Pattern drawing method using charged particle beams |
| 09/28/1999 | US5958632 Method of making mask pattern utilizing sizing dependent on mask material and mask formed through the method |
| 09/28/1999 | US5958631 X-ray blocking and membrane stiffening layer is applied on at least one side of the wafer; resistance to warpage |
| 09/28/1999 | US5958630 Phase shifting mask and method of manufacturing the same |
| 09/28/1999 | US5958626 Dividing pattern to be projected into plurality of blocks by parting lines including segments connected end-to-end so as to be non-linear |
| 09/28/1999 | US5958519 Method for forming oxide film on III-V substrate |
| 09/28/1999 | US5958517 Positioning delivery nozzle over cleaning station, delivering cleaning fluid from cleaning fluid supply line through valve subsystem to interior conduit of delivery nozzle to remove any spin-on-glass from the interior conduit |
| 09/28/1999 | US5958510 Method and apparatus for forming a thin polymer layer on an integrated circuit structure |
| 09/28/1999 | US5958508 Dielectric with gradiant concentrtaion |
| 09/28/1999 | US5958505 Applying a silicide layer on a surface of a silicon-based substrate, applying a mask to the silicide layer, and locally oxidizing the silicide layer through the mask on a boundary surface thereof |
| 09/28/1999 | US5958466 Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits |
| 09/28/1999 | US5958288 Chemical mechanical polishing metal layer containing substrate by using a hydrogen peroxide or monopersulfate oxidizer, a catalyst containing ferric nitrate or other metal compound with multiple oxidation state |
| 09/28/1999 | US5958270 Wire bonding wedge tool with electric heater |
| 09/28/1999 | US5958268 Removal of material by polarized radiation |
| 09/28/1999 | US5958265 Substrate holder for a plasma processing system |
| 09/28/1999 | US5958259 Method for forming a ball in wire bonding |
| 09/28/1999 | US5958258 Plasma processing method in semiconductor processing system |
| 09/28/1999 | US5958198 Clamp ring for domed heated pedestal in wafer processing |
| 09/28/1999 | US5958148 Method for cleaning workpiece surfaces and monitoring probes during workpiece processing |
| 09/28/1999 | US5958146 Immersion in hot water |
| 09/28/1999 | US5958145 Scrubbing front and back surfaces separately with washing liquid while rotating substrate, heating to dry as previously determined |
| 09/28/1999 | US5958144 Flux-removing aqueous cleaning composition and method of use |
| 09/28/1999 | US5958141 Dry etching device |
| 09/28/1999 | US5958140 One-by-one type heat-processing apparatus |
| 09/28/1999 | US5958139 Plasma etch system |
| 09/28/1999 | US5958138 Gas recovery unit |
| 09/28/1999 | US5957754 Cavitational polishing pad conditioner |
| 09/28/1999 | US5957751 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
| 09/28/1999 | US5957750 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates |
| 09/28/1999 | US5957749 Apparatus for optical inspection of wafers during polishing |
| 09/28/1999 | US5957654 Lead frame unloading tool having sliding blocks |
| 09/28/1999 | US5957651 Substrate carrying apparatus |
| 09/28/1999 | US5957648 Factory automation apparatus and method for handling, moving and storing semiconductor wafer carriers |
| 09/28/1999 | US5957371 Method and apparatus for forming a ball in wire bonding |
| 09/28/1999 | US5957293 Tray to ship ceramic substrates and ceramic BGA packages |
| 09/28/1999 | US5957292 Wafer enclosure with door |
| 09/28/1999 | US5956859 Drying apparatus for processing surface of substrate |
| 09/28/1999 | US5956838 IC leadframe processing system |
| 09/28/1999 | US5956837 Method of detaching object to be processed from electrostatic chuck |
| 09/23/1999 | WO1999048158A1 Method and arrangement for producing thin metal chalcogenide layers |
| 09/23/1999 | WO1999048154A1 Capacitor in an integrated circuit |
| 09/23/1999 | WO1999048153A1 Silicon carbide semiconductor switching device |
| 09/23/1999 | WO1999048151A1 Dram-cell arrangement and method of production thereof |
| 09/23/1999 | WO1999048149A1 Stepper alignment mark formation with dual field oxide process |
| 09/23/1999 | WO1999048148A1 Method and apparatus for predicting failure of an electrostatic chuck |
| 09/23/1999 | WO1999048147A1 Process for manufacturing semiconductor device |
| 09/23/1999 | WO1999048146A1 No clean flux for flip chip assembly |
| 09/23/1999 | WO1999048144A1 Method of fabricating semiconductor integrated circuit device |
| 09/23/1999 | WO1999048143A2 Method of manufacturing semiconductor devices with 'chip size package' |
| 09/23/1999 | WO1999048142A1 Flux cleaning for flip chip technology using environmentally friendly solvents |
| 09/23/1999 | WO1999048141A1 Automated brush fluxing system for application of controlled amount of flux to packages |
| 09/23/1999 | WO1999048140A1 Attachment method for stacked integrated circuit (ic) chips |
| 09/23/1999 | WO1999048139A2 Apparatus for reducing heat loss |
| 09/23/1999 | WO1999048138A1 Large area uniform laminar gas flow dispenser |
| 09/23/1999 | WO1999048137A2 Method and device for treating wafers presenting components during thinning of the wafer and separation of the components |
| 09/23/1999 | WO1999048136A2 Solar cell arrangement |
| 09/23/1999 | WO1999048132A1 An apparatus and method for generating plasma |
| 09/23/1999 | WO1999048131A1 Sputtering apparatus with a coil having overlapping ends |
| 09/23/1999 | WO1999048130A1 Distributed inductively-coupled plasma source |
| 09/23/1999 | WO1999048110A1 Anisotropic conductive film |
| 09/23/1999 | WO1999048107A1 Method of producing carbon with electrically active sites |
| 09/23/1999 | WO1999048102A1 An electrically-programmable read-only memory fabricated using a dynamic random access memory fabrication process and methods for programming same |
| 09/23/1999 | WO1999048078A1 Transistor circuit, display panel and electronic apparatus |
| 09/23/1999 | WO1999047981A1 METHOD OF PATTERNING SUB-0.25μ LINE FEATURES WITH HIGH TRANSMISSION, 'ATTENUATED' PHASE SHIFT MASKS |
| 09/23/1999 | WO1999047978A1 Method and apparatus for direct writing of semiconductor die using microcolumn array |
| 09/23/1999 | WO1999047901A1 Method and apparatus for measuring substrate temperatures |
| 09/23/1999 | WO1999047732A1 Apparatus for moving exhaust tube of barrel reactor |
| 09/23/1999 | WO1999047731A1 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 09/23/1999 | WO1999047728A1 Method and apparatus for deposition and etching of a dielectric layer |
| 09/23/1999 | WO1999047722A2 Method for applying a dielectric cap film to a dielectric stack |
| 09/23/1999 | WO1999047618A1 Chemical mechanical polishing slurry useful for copper substrates |
| 09/23/1999 | WO1999047571A1 Light-absorbing polymers and application thereof to antireflection film |
| 09/23/1999 | WO1999047332A1 Method for making smart cards using isotropic thermoset adhesive materials |
| 09/23/1999 | WO1999047331A1 Method for making tamper-preventing, contact-type, smart cards |
| 09/23/1999 | WO1999041770A3 Routing topology for identical connector point layouts on primary and secondary sides of a substrate |
| 09/23/1999 | WO1999039022A3 SUBSTRATE SUPPORT FOR SiC EPITAXY AND METHOD FOR PRODUCING AN INSERT FOR A SUSCEPTOR |
| 09/23/1999 | WO1999013498A8 Combined cmp and wafer cleaning apparatus and associated methods |
| 09/23/1999 | WO1999012192A3 Transport system |
| 09/23/1999 | DE19912834A1 Electronic control unit with a terminal section |
| 09/23/1999 | DE19912464A1 Exposure optics for illuminator with rod-shaped integrator |
| 09/23/1999 | DE19911977A1 Substrate isolation region is formed especially between low sub-micron range IC components |
| 09/23/1999 | DE19910391A1 Ultrasonic drying system for removing water from semiconductor wafer surface |
| 09/23/1999 | DE19909993A1 High speed, low power dissipation bipolar transistor with a self-aligned epitaxial base is produced |
| 09/23/1999 | DE19906805A1 Semiconductor wafer holding position adjustment mechanism in substrate conveying processing apparatus |
| 09/23/1999 | DE19901386A1 Groove bus structure for field coupled power MOSFET |
| 09/23/1999 | DE19857094A1 Semiconductor device production process especially for forming fine resist pattern e.g. in LSI or LCD panel production |