Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/1999
09/21/1999US5956574 Lead frame flash removing method and apparatus
09/21/1999US5956573 Use of argon sputtering to modify surface properties by thin film deposition
09/21/1999US5956572 Preventing the quality degradation of photoelectric conversion and the loss in the effective power generation area
09/21/1999US5956570 Epitaxial layer on the substrate by using sihcl3 as a source gas without a hcl etching
09/21/1999US5956568 Methods of fabricating and contacting ultra-small semiconductor devices
09/21/1999US5956567 Semiconductor chip and semiconductor wafer having power supply pads for probe test
09/21/1999US5956563 Method for reducing a transient thermal mismatch
09/21/1999US5956268 Nonvolatile memory structure
09/21/1999US5956267 Self-aligned wordline keeper and method of manufacture therefor
09/21/1999US5956232 Chip support arrangement and chip support for the manufacture of a chip casing
09/21/1999US5956224 Electrode structure of capacitor for semiconductor memory device
09/21/1999US5956192 Four mirror EUV projection optics
09/21/1999US5956182 Projection optical system
09/21/1999US5956142 Method of end point detection using a sinusoidal interference signal for a wet etch process
09/21/1999US5956104 Active matrix-type liquid crystal display device and method of making the same
09/21/1999US5955938 RuO2 resistor paste, substrate and overcoat system
09/21/1999US5955877 Method and apparatus for automatically positioning electronic dice within component packages
09/21/1999US5955858 Mechanically clamping robot wrist
09/21/1999US5955857 Wafer conveyor system
09/21/1999US5955818 Machine structures fabricated of multiple microstructure layers
09/21/1999US5955788 Semiconductor device having multilevel wiring with improved planarity
09/21/1999US5955787 Method for forming intermetal dielectric with SOG etchback and CMP
09/21/1999US5955786 Semiconductor device using uniform nonconformal deposition for forming low dielectric constant insulation between certain conductive lines
09/21/1999US5955785 Copper-containing plug for connection of semiconductor surface with overlying conductor
09/21/1999US5955784 Ball contact for flip-chip device
09/21/1999US5955782 Apparatus and process for improved die adhesion to organic chip carriers
09/21/1999US5955781 Embedded thermal conductors for semiconductor chips
09/21/1999US5955780 Contact converting structure of semiconductor chip and process for manufacturing semiconductor chip having said contact converting structure
09/21/1999US5955776 Spherical shaped semiconductor integrated circuit
09/21/1999US5955775 Structure of complementary bipolar transistors
09/21/1999US5955774 Integrated circuit ferroelectric memory devices including resistors in periphery region
09/21/1999US5955773 Closely pitched polysilicon fuses and method of forming the same
09/21/1999US5955770 Method of forming raised source/drain regions in an integrated circuit
09/21/1999US5955769 Multiple stage ROM unit
09/21/1999US5955768 Integrated self-aligned butt contact process flow and structure for six transistor full complementary metal oxide semiconductor static random access memory cell
09/21/1999US5955767 Semiconductor device with self-aligned insulator
09/21/1999US5955765 Thin-film dual gate, common channel semiconductor device having a single first gate and a multi-gate second gate structure
09/21/1999US5955762 Microelectronic package with polymer ESD protection
09/21/1999US5955761 Semiconductor device and manufacturing method thereof
09/21/1999US5955760 Transistor device structures
09/21/1999US5955759 Reduced parasitic resistance and capacitance field effect transistor
09/21/1999US5955758 Method of forming a capacitor plate and a capacitor incorporating same
09/21/1999US5955756 Trench separator for self-defining discontinuous film
09/21/1999US5955755 Semiconductor storage device and method for manufacturing the same
09/21/1999US5955754 Integrated circuits having mixed layered superlattice materials and precursor solutions for use in a process of making the same
09/21/1999US5955748 End face light emitting type light emitting diode
09/21/1999US5955746 SRAM having enhanced cell ratio
09/21/1999US5955745 Semiconductor device having SiGe spacer under an active layer
09/21/1999US5955744 LCD with increased pixel opening sizes
09/21/1999US5955742 Semiconductor device formed on a substrate having an off-angle surface and a fabrication process thereof
09/21/1999US5955739 Surface position detection device
09/21/1999US5955738 Exposure data preparing apparatus, exposure data preparing method and charged particle beam exposure apparatus
09/21/1999US5955543 Polymer adhesives for electroconductive or thermal conductive fillers
09/21/1999US5955392 Thin, smooth sheet comprising fine zirconia particles in organic binder; good surface quality
09/21/1999US5955384 Method of fabricating semiconductor device
09/21/1999US5955383 Invention teaches how to adjust for process variables by using feedback from two strategically placed pressure manometers
09/21/1999US5955382 Microwave excitation plasma processing apparatus and microwave excitation plasma processing method
09/21/1999US5955381 Shadow ring having at least an upper surface which is incapable of liberating sufficient oxygen significantly to alter a plasma's etching
09/21/1999US5955380 Endpoint detection method and apparatus
09/21/1999US5955245 Amidation to polyamic acid; imidation; evaporating solvent; coating; exposure to light
09/21/1999US5955244 Method for forming photoresist features having reentrant profiles using a basic agent
09/21/1999US5955243 Illumination optical system and method of manufacturing semiconductor devices
09/21/1999US5955240 Positive resist composition
09/21/1999US5955227 Calculating intensity distribution of exposure light; processing qualification/disqualification data of optical image formation in semiconductors
09/21/1999US5955213 Single crystal substrates of silicon, with ferroelectric thin film with scandium and yttrium, manganese and oxygen for computers
09/21/1999US5955200 Structure for reducing stress between metallic layer and spin-on-glass layer
09/21/1999US5955192 Polysilane
09/21/1999US5955179 Coating for the structured production of conductors on the surface of electrically insulating substrates
09/21/1999US5955178 Electro-conductive oxides and electrodes using the same
09/21/1999US5955148 Invention can be used as a substrate for integrated circuits and packaging material.
09/21/1999US5955140 Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates
09/21/1999US5955119 Carbide rod screening nozzles
09/21/1999US5955115 Pre-packaged liquid molding for component encapsulation
09/21/1999US5954997 Alumina abrasive; oxidizer, complexing agent such as ammonium oxalate, benzotriazole
09/21/1999US5954982 Method and apparatus for efficiently heating semiconductor wafers or reticles
09/21/1999US5954975 Slurries for chemical mechanical polishing tungsten films
09/21/1999US5954912 Rotary coupling
09/21/1999US5954911 Semiconductor processing using vapor mixtures
09/21/1999US5954888 Post-CMP wet-HF cleaning station
09/21/1999US5954887 Using a gas consisting essentially of ticl.sub.4 as a cleaning gas for removing a unnecessary portion of the ti film sticking to a process chamber in the film forming apparatus.
09/21/1999US5954885 Cleaning method
09/21/1999US5954884 Demetallization substrates with chlorine, radiation
09/21/1999US5954878 Apparatus for uniformly coating a substrate
09/21/1999US5954877 Soft impact dispense nozzle
09/21/1999US5954875 Temperature keeping cylindrical body and/or a crucible
09/21/1999US5954873 Manufacturing method for a silicon single crystal wafer
09/21/1999US5954842 Lead finger clamp assembly
09/21/1999US5954570 Conditioner for a polishing tool
09/21/1999US5954472 Batch loader arm
09/21/1999US5954262 Soldering apparatus for providing a fixed quantity of solder piece onto target plate and method of soldering circuit component
09/21/1999US5954260 Fine pitch bonding technique
09/21/1999US5954078 Method and apparatus for handling liquid chemical waste
09/21/1999US5954072 Rotary processing apparatus
09/21/1999US5954068 Device and method for treating substrates in a fluid container
09/21/1999US5953828 Silicon substrate cleaning apparatus
09/21/1999US5953827 Magnetron with cooling system for process chamber of processing system
09/21/1999US5953814 Process for producing flip chip circuit board assembly exhibiting enhanced reliability
09/21/1999US5953812 To remove parts from a tray carrying a plurality of parts
09/21/1999CA2159848C Masks with low stress multilayer films and a process for controlling the stress of multilayer films
09/16/1999WO1999046965A2 Integrated circuit connection using an electrically conductive adhesive