| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/16/1999 | WO1999046821A2 Semiconductor switch devices and their manufacture |
| 09/16/1999 | WO1999046820A1 Over-voltage protection device for integrated circuits |
| 09/16/1999 | WO1999046819A1 Over-voltage protection system for integrated circuits using the bonding pads and passivation layer |
| 09/16/1999 | WO1999046816A1 Method and device for cleaving semiconductor wafer |
| 09/16/1999 | WO1999046815A1 Integrated electronic circuit and method for producing the same |
| 09/16/1999 | WO1999046814A1 Optical instrument for measuring shape of wafer |
| 09/16/1999 | WO1999046813A1 Method for fabricating double sided ceramic circuit boards using a titanium support substrate |
| 09/16/1999 | WO1999046812A1 Process for copper etch back |
| 09/16/1999 | WO1999046811A1 Selective etching of silicon nitride by means of a wet chemical process |
| 09/16/1999 | WO1999046810A1 Method for processing surface of sample |
| 09/16/1999 | WO1999046809A1 Devices formable by low temperature direct bonding |
| 09/16/1999 | WO1999046808A1 Selective wet etching of inorganic antireflective coatings |
| 09/16/1999 | WO1999046806A1 Article holders and holding methods |
| 09/16/1999 | WO1999046805A1 Holders suitable to hold articles during processing and article processing methods |
| 09/16/1999 | WO1999046804A1 Thermal cycling module |
| 09/16/1999 | WO1999046803A1 Production facility for integrated circuits |
| 09/16/1999 | WO1999046802A1 Installation and method for chemical treatment of microelectronics wafers |
| 09/16/1999 | WO1999046353A1 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film |
| 09/16/1999 | WO1999046084A1 Polishing apparatus |
| 09/16/1999 | WO1999046083A1 Cleaning device for surface plate correcting dresser |
| 09/16/1999 | WO1999046081A1 Multi-step chemical mechanical polishing process and device |
| 09/16/1999 | WO1999046065A1 Micro-environment reactor for processing a microelectronic workpiece |
| 09/16/1999 | WO1999046064A1 Selective treatment of the surface of a microelectronic workpiece |
| 09/16/1999 | WO1999046063A1 Cleaning device |
| 09/16/1999 | WO1999034449A3 A high voltage thin film transistor with improved on-state characteristics and method for making same |
| 09/16/1999 | WO1999031731A3 Silicon oxide insulator (soi) semiconductor having selectively linked body |
| 09/16/1999 | WO1999030353A9 Surface modification of semiconductors using electromagnetic radiation |
| 09/16/1999 | WO1999028955A3 Chemical vapor deposition of titanium on a wafer comprising an in-situ precleaning step |
| 09/16/1999 | WO1999023276A8 Long life high temperature process chamber |
| 09/16/1999 | WO1999021021A3 Semiconductor material characterizing method and apparatus |
| 09/16/1999 | WO1999019906A3 Method and apparatus for packaging high temperature solid state electronic devices |
| 09/16/1999 | DE19905050A1 Vorrichtung für eine thermische Behandlung von Substraten A device for thermal treatment of substrates |
| 09/16/1999 | DE19903104A1 Mounting semiconductor components and modules onto coupling frame |
| 09/16/1999 | DE19854697A1 Automated test method for integrated circuits on wafer |
| 09/16/1999 | DE19846503A1 Production of integrated circuit elements where CD microloading is eliminated or controlled and etching biasing is eliminated or minimized |
| 09/16/1999 | DE19833414A1 Planar etching of semiconductor component |
| 09/16/1999 | DE19819254A1 Semiconductor DRAM component with integral test circuit |
| 09/16/1999 | DE19815039A1 Verfahren zum Wechseln eines in einem Behandlungsbecken enthaltenen Behandlungsmediums und Anlage zur Ausführung des Verfahrens A method for changing a treatment medium and system contained in a treatment tank for performing the method |
| 09/16/1999 | DE19811115A1 Treating and processing wafers during thickness reduction and sawing |
| 09/16/1999 | DE19811080A1 Memory cell arrangement |
| 09/16/1999 | DE19810828A1 Method for bonding two wafers |
| 09/16/1999 | DE19810825A1 Electronic integrated circuit |
| 09/16/1999 | DE19810730A1 Microcontroller circuit, esp. for identification systems such as cash cards, locking systems etc. |
| 09/16/1999 | DE19809081A1 Verfahren und Kontaktstelle zur Herstellung einer elektrischen Verbindung A method and contact point for making an electrical connection |
| 09/16/1999 | CA2309583A1 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film |
| 09/15/1999 | EP0942636A2 Solder bonding printed circuit board |
| 09/15/1999 | EP0942583A1 A display type image sensor |
| 09/15/1999 | EP0942471A2 Circuit with small package for mosfets |
| 09/15/1999 | EP0942469A2 Connecting lead for semiconductor devices and method for fabricating the lead |
| 09/15/1999 | EP0942467A1 Process for fabricating bipolar and bicmos devices |
| 09/15/1999 | EP0942466A1 Process for manufacturing semiconductor device and semiconductor component |
| 09/15/1999 | EP0942465A2 Self aligned buried plate |
| 09/15/1999 | EP0942464A2 Surface passivation using silicon oxynitride |
| 09/15/1999 | EP0942463A2 Method for stripping ion implanted photoresist layer |
| 09/15/1999 | EP0942462A2 Method and structure for protecting a neighbouring area adjacent to an area to be etched and method for forming a fuse |
| 09/15/1999 | EP0942461A2 Reduction of black silicon in semiconductor fabrication |
| 09/15/1999 | EP0942460A1 Process for forming a low resistive Titanum silicide layer on a semiconductor substrate and device obtained thereby |
| 09/15/1999 | EP0942459A1 Method of growing nitride semiconductors, nitride semiconductor substrate and nitride semiconductor device |
| 09/15/1999 | EP0942458A2 Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
| 09/15/1999 | EP0942407A1 Current-driven emissive display device, method for driving the same, and method for manufacturing the same |
| 09/15/1999 | EP0942332A1 Exposure method and apparatus |
| 09/15/1999 | EP0942331A1 Antireflection or light-absorbing coating composition and polymer therefor |
| 09/15/1999 | EP0942330A1 Process for depositing and developing a plasma polymerized organosilicon photoresist film |
| 09/15/1999 | EP0942072A2 Method for fabricating fluorinated diamond-like carbon layers |
| 09/15/1999 | EP0942060A1 Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
| 09/15/1999 | EP0941758A1 Contactor comprising a shell made of fiber-reinforced, composite body having a fluoropolymer inner surface, and method of making such contactor |
| 09/15/1999 | EP0941552A2 Semiconductor device with memory capacitor and method of manufacturing such a device |
| 09/15/1999 | EP0852809A4 Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions |
| 09/15/1999 | CN1228872A Thermal grease insertion and retention |
| 09/15/1999 | CN1228853A Semiconductor circuit, particularly for use in integrated module |
| 09/15/1999 | CN1228851A Alkysulfonyloximes for high-resolution I-line photoresists of high sensitivity |
| 09/15/1999 | CN1228617A Photoconductive thin film, and photovoltaic device making use of the same |
| 09/15/1999 | CN1228616A Semiconductor device having metal silicide film and manufacturing method thereof |
| 09/15/1999 | CN1228615A High performance chip packaging and method |
| 09/15/1999 | CN1228613A Chip carrier |
| 09/15/1999 | CN1228612A Semiconductor device manufacturing method |
| 09/15/1999 | CN1228611A Method for manufacturing semiconductor integrated circuit to triple well structure |
| 09/15/1999 | CN1228610A Self aligned buried plate |
| 09/15/1999 | CN1228609A Method for planarization-etching semiconductor device |
| 09/15/1999 | CN1228608A Guard cell for etching |
| 09/15/1999 | CN1228607A Composite member, its separation method, and preparation method of semiconductor substrate by utilization thereof |
| 09/15/1999 | CN1228602A Thin film capacitor and method of forming the same |
| 09/15/1999 | CN1228597A Reference voltage generating circuit with MOS transistors having floating gate |
| 09/15/1999 | CN1228564A Simulation method of wiring temperature rise |
| 09/15/1999 | CN1228559A Automatic telephone call transfer apparatus in internet connection mode and method of setting and canceling automatic telephone call transfer |
| 09/15/1999 | CN1228367A 晶片抛光装置和抛光方法 Wafer polishing apparatus and polishing method |
| 09/14/1999 | USRE36305 Method for fabrication of close-tolerance lines and sharp emission tips on a semiconductor wafer |
| 09/14/1999 | US5953635 Interlayer dielectric with a composite dielectric stack |
| 09/14/1999 | US5953634 Method of manufacturing semiconductor device |
| 09/14/1999 | US5953633 Method for manufacturing self-aligned titanium salicide using two two-step rapid thermal annealing steps |
| 09/14/1999 | US5953632 Method for manufacturing semiconductor device comprising a silicide film |
| 09/14/1999 | US5953631 Low stress, highly conformal CVD metal thin film |
| 09/14/1999 | US5953630 Suppression of tungsten film deposition on a semiconductor wafer bevel edge with a halogenide purge gas |
| 09/14/1999 | US5953629 Method of thin film forming on semiconductor substrate |
| 09/14/1999 | US5953628 Method for forming wiring for a semiconductor device |
| 09/14/1999 | US5953627 Process for manufacture of integrated circuit device |
| 09/14/1999 | US5953626 Method of fabricating interconnected levels on a semiconductor substrate |
| 09/14/1999 | US5953625 Air voids underneath metal lines to reduce parasitic capacitance |
| 09/14/1999 | US5953624 Bump forming method |
| 09/14/1999 | US5953623 Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection |