Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1999
10/05/1999US5962631 2, 7-aryl-9-substituted fluorenes and 9-substituted fluorene oligomers and polymers
10/05/1999US5962385 Cleaning liquid for semiconductor devices
10/05/1999US5962384 Method for cleaning semiconductor devices
10/05/1999US5962347 Semiconductor integrated circuit arrangement fabrication method
10/05/1999US5962346 Fluorine-doped silicate glass hard mask to improve metal line etching profile
10/05/1999US5962345 Method to reduce contact resistance by means of in-situ ICP
10/05/1999US5962344 Plasma treatment method for PECVD silicon nitride films for improved passivation layers on semiconductor metal interconnections
10/05/1999US5962343 Process for producing crystalline ceric oxide particles and abrasive
10/05/1999US5962342 Adjustable method for eliminating trench top corners
10/05/1999US5962341 Semiconductor device and manufacturing method therefor
10/05/1999US5962197 30-80% by weight of a propylene glycol ether; 10-60% by weight of a pyrrolidone; 0.1-5% by weight of potassium hydroxide; 0.1-10% by weight of a surfactant; water content of less than one percent.
10/05/1999US5962195 Method for controlling linewidth by etching bottom anti-reflective coating
10/05/1999US5962194 Selectively irradiating a selected region of the deposited first film to be etched with light to modify a portion of the thickness of the first film to be etched to thereby form a first protective film; photoetching
10/05/1999US5962193 Method and apparatus for controlling air flow in a liquid coater
10/05/1999US5962191 Curable tetrapolymer containing units of (meth)acrylic acid, (meth)acrylamide, adamantyl (meth)acrylate, and a vinyl monomer containing an unsaturated group available for crosslinking.
10/05/1999US5962187 Radiation sensitive composition
10/05/1999US5962186 Polymer for chemical amplified positive photoresist composition containing the same
10/05/1999US5962185 (meth)acrylic acid-methyl (meth)acrylate polymer containing units of an acid-labile protected carboxyalkyloxy- or oxycarbonyloxy-phenylalkyl (meth)acrylate
10/05/1999US5962113 Polysiloxane-amide
10/05/1999US5962097 Protective member for semiconductor wafer
10/05/1999US5962085 Misted precursor deposition apparatus and method with improved mist and mist flow
10/05/1999US5962084 Taking an emission spectrum of said plasma of said mixed gas; and adjusting a ratio of said metal halide and hydrogen in said mixed gas based on said emission spectrum.
10/05/1999US5962070 The present invention relates to methods and apparatus for developing or otherwise treating substrates such as semiconductor wafers, glass substrates for liquid crystal displays, glass substrates for photomasks, and substrates for
10/05/1999US5962069 High electronic quality thin film of a layered superlattice material is fabricated without a high-temperature oxygen anneal.
10/05/1999US5962065 Method of forming polysilicon having a desired surface roughness
10/05/1999US5961916 Method of manufacturing a passage tube for passing plasma producing gas
10/05/1999US5961912 Encapsulating method of substrate based electronic device
10/05/1999US5961877 3.5-15.8 mole percent of hf; 0.2-9.7 mole percent of hno3; 34.8-82.6 mole percent of acetic acid; 12.3-46.5 mole percent of h2o; and wherein the molecular ratio of hno.sub.3 to hf is less than about 0.78.
10/05/1999US5961851 Microwave plasma discharge device
10/05/1999US5961794 A method of manufacturing semiconductor devices having trench isolation.
10/05/1999US5961793 Method of reducing generation of particulate matter in a sputtering chamber
10/05/1999US5961791 Process for fabricating a semiconductor device
10/05/1999US5961775 Ashing
10/05/1999US5961774 Method of holding substrate and substrate holding system
10/05/1999US5961773 Plasma processing apparatus and plasma processing method using the same
10/05/1999US5961772 Atmospheric-pressure plasma jet
10/05/1999US5961768 Apparatus for applying adhesive sheets
10/05/1999US5961732 Treating substrates by producing and controlling a cryogenic aerosol
10/05/1999US5961726 Deposited film forming apparatus and electrode for use in it
10/05/1999US5961724 Techniques for reducing particulate contamination on a substrate during processing
10/05/1999US5961722 Apparatus for establishing reference coordinates for a point on a component
10/05/1999US5961719 Nucleation of diamond films using an electrode
10/05/1999US5961715 Method for pulling a single crystal
10/05/1999US5961713 Method for manufacturing a wafer having a microdefect-free layer of a precisely predetermined depth
10/05/1999US5961380 For transporting a workpiece
10/05/1999US5961377 Chemical mechanical polishing systems including brushes and related methods
10/05/1999US5961375 Shimming substrate holder assemblies to produce more uniformly polished substrate surfaces
10/05/1999US5961373 Process for forming a semiconductor device
10/05/1999US5961369 Methods for the in-process detection of workpieces with a monochromatic light source
10/05/1999US5961361 Method for manufacturing electrode plate for plasma processing device
10/05/1999US5961323 Dual vertical thermal processing furnace
10/05/1999US5961269 Three chamber load lock apparatus
10/05/1999US5961169 Apparatus for sensing the presence of a wafer
10/05/1999US5961168 Pick and place apparatus for transferring objects
10/05/1999US5961032 Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold
10/05/1999US5961029 Wire bonding method
10/05/1999US5961026 Apparatus and method for removing known good die using hot shear process
10/05/1999US5960960 Wafer carrier
10/05/1999US5960959 Wafer retaining mechanism
10/05/1999US5960638 Modular environmental control unit for cleanrooms
10/05/1999US5960562 Processing apparatus of processing wafer sheets
10/05/1999US5960555 Method and apparatus for purging the back side of a substrate during chemical vapor processing
10/05/1999US5960538 Printed circuit board
10/05/1999US5960536 Method for the preparation of a wiring circuit board for mounting of a semiconductor
10/05/1999CA2182342C Method for radiofrequency wave etching
09/1999
09/30/1999WO1999049711A1 Clustering adapter for spherical shaped devices
09/30/1999WO1999049708A1 Method for making electrical connections between conductors separated by a dielectric
09/30/1999WO1999049705A1 Plasma processing apparatus
09/30/1999WO1999049521A1 Method for doping one side of a semiconductor body
09/30/1999WO1999049519A1 Circuit structure with mos-transistor and method for realising the same
09/30/1999WO1999049518A1 Storage cell arrangement and method for producing same
09/30/1999WO1999049517A1 Memory cell arrangement and method of production thereof
09/30/1999WO1999049516A1 Memory cell arrangement and method for producing the same
09/30/1999WO1999049515A1 Method for producing integrated circuits with standard cells
09/30/1999WO1999049513A1 An inductance device
09/30/1999WO1999049510A1 Method for fabricating an electrically addressable silicon-on-sapphire light valve
09/30/1999WO1999049509A1 Wiring method for producing a vertical, integrated circuit structure and vertical, integrated circuit structure
09/30/1999WO1999049508A1 Process for fabricating an integrated circuit with a self-aligned contact
09/30/1999WO1999049507A1 Flip chip mounting technique
09/30/1999WO1999049506A1 Method and apparatus for manufacturing a micromechanical device
09/30/1999WO1999049503A1 Ultra-high resolution liquid crystal display on silicon-on-sapphire
09/30/1999WO1999049502A1 Method and apparatus for testing of sheet material
09/30/1999WO1999049501A2 A high temperature multi-layered alloy heater assembly and related methods
09/30/1999WO1999049500A1 Cluster tool
09/30/1999WO1999049365A1 Method for producing large-surface membrane masks
09/30/1999WO1999049330A1 Compensating for the effects of round-trip delay in automatic test equipment
09/30/1999WO1999049101A1 Apparatus and method for cvd and thermal processing of semiconductor substrates
09/30/1999WO1999048652A1 Transferring substrates with different holding end effectors
09/30/1999WO1999048642A1 Methods and apparatuses for forming solder balls on substrates
09/30/1999WO1999041632A8 Improved photovoltaic generator circuit
09/30/1999WO1999038197A3 Test head structure for integrated circuit tester
09/30/1999WO1999034939A9 Wafer container washing apparatus
09/30/1999WO1999001593A3 Elimination of defects in epitaxial films
09/30/1999DE19911755A1 Semiconductor crystal growth apparatus for manufacturing wafers used in integrated electronic device
09/30/1999DE19903814A1 Microwave-millimeter wave circuit
09/30/1999DE19854886A1 Designing semiconductor component containing MOS transistor on SOI substrate
09/30/1999DE19841402A1 Capacitor manufacture for DRAM
09/30/1999DE19833257C1 Semiconductor wafer production process especially to produce a silicon wafer for fabricating sub-micron line width electronic devices
09/30/1999DE19832330A1 Test holder for integrated circuit with solder ball connections serving as test points
09/30/1999DE19821776C1 Capacitor production in an IC, especially for stacked capacitor production in a DRAM circuit
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