Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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09/30/1999 | DE19816448C1 Universal-Halbleiterscheibe für Hochspannungs-Halbleiterbauelemente, ihr Herstellungsverfahren und ihre Verwendung Universal wafer for high voltage semiconductor devices, their method of preparation and their use |
09/30/1999 | DE19813910A1 Apparatus for heat treatment of plate-shaped coated substrates |
09/30/1999 | DE19813757A1 Verfahren zur Herstellung einer mit Fluor belgten Halbleiteroberfläche A method of manufacturing a semiconductor surface with fluorine belgten |
09/30/1999 | DE19813744A1 Inspection of defects in a translucid film in the semiconductor process |
09/30/1999 | DE19813684A1 Transport container coupling device to a port at a loading and unloading station as used in e.g. the fabrication of integrated circuits (ICs) |
09/30/1999 | DE19812945A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
09/30/1999 | CA2325535A1 An inductance device |
09/29/1999 | EP0946086A1 Plated leadframes with cantilever leads |
09/29/1999 | EP0945960A2 Power supply apparatus and method, and fabrication apparatus |
09/29/1999 | EP0945905A2 FET channel structure |
09/29/1999 | EP0945904A1 Film-like composite structure and method of manufacture thereof |
09/29/1999 | EP0945902A1 MOS transistor for DRAM memory cell and method of making the same |
09/29/1999 | EP0945901A1 DRAM cell array with vertical transistors and process of manufacture |
09/29/1999 | EP0945900A1 Method for forming interconnection structure |
09/29/1999 | EP0945899A2 Semiconductor device comprising a semi-insulating region and its manufacturing method |
09/29/1999 | EP0945898A2 Surface treatment of an insulating film |
09/29/1999 | EP0945897A1 Organic gate sidewall spacers |
09/29/1999 | EP0945896A1 Plasma etching method |
09/29/1999 | EP0945892A2 System and method for in-process cleaning of an ion source |
09/29/1999 | EP0945873A2 Semiconductor memory device |
09/29/1999 | EP0945764A2 Photoresist composition |
09/29/1999 | EP0945734A2 Method for nondestructive measurement of dopant concentrations |
09/29/1999 | EP0945733A2 Method for nondestructive measurement of minority carrier diffusion length and minority carrier lifetime in semiconductor devices |
09/29/1999 | EP0945530A1 A production method for a discrete structure substrate |
09/29/1999 | EP0945523A1 Method for forming a thin film and apparatus for carrying out the method |
09/29/1999 | EP0945216A2 Notch grinding tool |
09/29/1999 | EP0944923A1 Ultra-low power-delay product nnn/ppp logic devices |
09/29/1999 | EP0944922A1 Chip module and manufacture of same |
09/29/1999 | EP0944921A1 Integrated circuit with differing gate oxide thickness and process for making same |
09/29/1999 | EP0944920A1 Process for dividing a semiconductor wafer |
09/29/1999 | EP0944919A1 Mis transistor with self-aligned metal grid and method for making it |
09/29/1999 | EP0944918A1 Process for producing semiconductor bodies with a movpe-layer sequence |
09/29/1999 | EP0944917A1 Os RECTIFYING SCHOTTKY AND OHMIC JUNCTION AND W/WC/TiC OHMIC CONTACTS ON SiC |
09/29/1999 | EP0944916A1 Very long and highly stable atomic wires, method for making these wires, application in nano-electronics |
09/29/1999 | EP0944915A1 Process for manufacturing a capacitor in a semiconductor arrangement |
09/29/1999 | EP0944909A1 Electroceramic component and method for its manufacture |
09/29/1999 | EP0944851A1 Assembly of optical components optically aligned and method for making this assembly |
09/29/1999 | EP0944840A1 Probe card for high speed testing |
09/29/1999 | EP0944708A1 Non-corrosive cleaning composition for removing plasma etching residues |
09/29/1999 | EP0944685A1 Die attach adhesive compositions |
09/29/1999 | EP0944671A1 Thermally reworkable binders for flip-chip devices |
09/29/1999 | EP0944482A1 Apparatus and method for recovering photoresist developers and strippers |
09/29/1999 | EP0838087A4 A method of manufacturing a monolithic linear optocoupler |
09/29/1999 | EP0719456B1 Charge coupled device, and imaging device comprising such a charge coupled device |
09/29/1999 | EP0663698B1 Semiconductor device and its manufacture |
09/29/1999 | CN1230289A Molecular contamination control system |
09/29/1999 | CN1230030A Insulated-gate type semiconductor device and manufacturing method thereof |
09/29/1999 | CN1230029A Vertical type metal insulator semiconductor field effect transistor and method of its production |
09/29/1999 | CN1230028A Non-volatile semiconductor memory featuring effective cell area reduction using contactless technology |
09/29/1999 | CN1230027A Semiconductor memory device |
09/29/1999 | CN1230026A Semiconductor device with vertical transistor and buried word line |
09/29/1999 | CN1230025A Dynamic random access memory including porous trench capacitor |
09/29/1999 | CN1230024A Semiconductor device |
09/29/1999 | CN1230023A Semiconductor device having protective circuit |
09/29/1999 | CN1230022A Semiconductor device and its mfg. method |
09/29/1999 | CN1230021A Method of making memory unit array |
09/29/1999 | CN1230020A Shallow trench isolation method |
09/29/1999 | CN1230019A Arranging/wiring method of semiconductor device, and semiconductor device arranging |
09/29/1999 | CN1230018A Fabrication of trench capacitors using disposable hard mask |
09/29/1999 | CN1230017A Method of utilizing grain of polysilicon half-ball for etching and shaping capacitor |
09/29/1999 | CN1230016A Contact window tempering method for avoiding generation of mixed diffusion in dielectric layer |
09/29/1999 | CN1230015A Semiconductor device manufacturing apparatus and semiconductor device manufacturing method |
09/29/1999 | CN1230014A Improved method and apparatus for chemical mechanical planarization (CMP) of semiconductor wafer |
09/29/1999 | CN1230013A Mfg. method of semiconductor device and semiconductor device |
09/29/1999 | CN1230012A Method for generating direct drawing data for charged particle beam direct drawing, and method and apparatus for direct drawing |
09/29/1999 | CN1229925A Semiconductor integrated circuit |
09/29/1999 | CN1229757A Transfer apparatus of chip components |
09/29/1999 | CN1229710A Improvements in relating to grinding machines |
09/29/1999 | CN1045350C Unlostable semiconductor memory device and method of correcting over inputing |
09/29/1999 | CN1045349C Semiconductor device with buried bit line cell and mfg. method thereof |
09/29/1999 | CN1045348C Method for forming thin tunneling windows in eeproms |
09/29/1999 | CN1045347C Method for producing semiconductor |
09/29/1999 | CN1045334C Clamp for detecting characteriztic of semiconductor and manufacture and application of same |
09/28/1999 | USRE36314 Insulated gate field effect semiconductor devices having a LDD region and an anodic oxide film of a gate electrode |
09/28/1999 | US5960323 Laser anneal method for a semiconductor device |
09/28/1999 | US5960322 Suppression of boron segregation for shallow source and drain junctions in semiconductors |
09/28/1999 | US5960321 Method of forming a contact via |
09/28/1999 | US5960320 Coating contact surface and via side walls with barrier layer prior to chemical vapor deposition of aluminum wiring material to prevent semiconductor substrate material and aluminum from migrating into each other |
09/28/1999 | US5960319 Forming silicon nitride film over silicon semiconductor substrate; doping so that nitrogen atoms and silicon atoms from the silicon nitride film are incorporated into surface of substrate together with dopant |
09/28/1999 | US5960318 Borderless contact etch process with sidewall spacer and selective isotropic etch process |
09/28/1999 | US5960317 Methods of forming electrical interconnects on integrated circuit substrates using selective slurries |
09/28/1999 | US5960316 Method to fabricate unlanded vias with a low dielectric constant material as an intraline dielectric |
09/28/1999 | US5960315 Tapered via using sidewall spacer reflow |
09/28/1999 | US5960314 Semiconductor processing method of providing an electrically conductive interconnecting plug between an elevationally conductive node and an elevationally outer electrically conductive node |
09/28/1999 | US5960313 Metal wire of semiconductor device and method for forming the same |
09/28/1999 | US5960312 Process for forming a contact electrode |
09/28/1999 | US5960311 Method for forming controlled voids in interlevel dielectric |
09/28/1999 | US5960310 Polishing methods for forming a contact plug |
09/28/1999 | US5960309 Semiconductor integrated circuit and wiring method |
09/28/1999 | US5960308 Process for making a chip sized semiconductor device |
09/28/1999 | US5960307 Method of forming ball grid array contacts |
09/28/1999 | US5960306 Process for forming a semiconductor device |
09/28/1999 | US5960305 Method to improve uniformity/planarity on the edge die and also remove the tungsten stringers from wafer chemi-mechanical polishing |
09/28/1999 | US5960304 Method for forming a contact to a substrate |
09/28/1999 | US5960303 Process of forming titanium silicide interconnects |
09/28/1999 | US5960302 Method of making a dielectric for an integrated circuit |
09/28/1999 | US5960301 Method of forming isolation layer of semiconductor device |
09/28/1999 | US5960300 Method of manufacturing semiconductor device |
09/28/1999 | US5960299 Method of fabricating a shallow-trench isolation structure in integrated circuit |
09/28/1999 | US5960298 Method of fabricating semiconductor device having trench isolation structure |