Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1999
10/06/1999EP0947881A2 Control of critical dimensions
10/06/1999EP0947835A2 Micromechanical component having a moving dielectric element and a method of manufacture
10/06/1999EP0947610A2 A single crystal-manufacturing equipment and a method for manufacturing the same
10/06/1999EP0947604A1 Method and apparatus for reforming a substrate surface
10/06/1999EP0947603A2 Film depositing method and apparatus
10/06/1999EP0947593A2 Mo-W material for formation of wiring, Mo-W target and method for production thereof, and Mo-W wiring thin film
10/06/1999EP0947469A2 Abrasive
10/06/1999EP0947291A2 Slurry recycling system of CMP apparatus and method of same
10/06/1999EP0947288A2 Carrier and CMP apparatus
10/06/1999EP0947047A1 Method of and apparatus for matching a load to a source
10/06/1999EP0946991A1 Non-volatile storage cell
10/06/1999EP0946989A1 Ferroelectric based memory devices utilizing low curie point ferroelectrics and encapsulation
10/06/1999EP0946988A1 Memory redundancy circuit using single polysilicon floating gate transistors as redundancy elements
10/06/1999EP0946987A1 Mos transistor, and production of layers for that type of transistor
10/06/1999EP0946985A1 Memory cell arrangement and process for manufacturing the same
10/06/1999EP0946984A1 Semiconductor storage arrangement with stacked capacitor
10/06/1999EP0946983A1 Lateral bipolar field effect mode hybrid transistor and method for the same
10/06/1999EP0946982A1 Tab tape ball grid array package with vias laterally offset from solder ball bond sites
10/06/1999EP0946981A1 Method for manufacturing a memory cell configuration
10/06/1999EP0946980A1 Improved integrated circuit structures and methods to facilitate accurate measurement of the ic devices
10/06/1999EP0946979A1 Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
10/06/1999EP0946978A1 Uv/halogen treatment for dry oxide etching
10/06/1999EP0946977A1 Multiple local oxidation for surface micromachining
10/06/1999EP0946976A1 Aqueous cleaning solution for a semiconductor substrate
10/06/1999EP0946974A1 Forming a crystalline semiconductor film on a glass substrate
10/06/1999EP0946973A1 Integrated circuit tray with flexural bearings
10/06/1999EP0946972A1 Molecular contamination control system
10/06/1999EP0946971A1 Substrate treatment device
10/06/1999EP0946970A1 Substrate treatment device
10/06/1999EP0946969A1 Two-stage kinematic mount
10/06/1999EP0946900A1 Lithographic pneumatic support device with controlled gas supply
10/06/1999EP0946894A1 Beam homogenizer
10/06/1999EP0946890A2 Layer with a porous layer area, an interference filter containing such a layer and a method for the production thereof
10/06/1999EP0946783A1 Semiconducting devices and method of making thereof
10/06/1999EP0946782A1 Chemical vapor deposition apparatus
10/06/1999EP0946780A1 Vacuum treatment equipment
10/06/1999EP0946646A1 Thermosetting encapsulants for electronics packaging
10/06/1999EP0946411A1 Method for the synthesis of group iii nitride crystals
10/06/1999EP0946407A1 Device and method for the storage, transportation and production of active fluorine
10/06/1999EP0876689B1 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
10/06/1999EP0845122B1 Memory tester providing fast repair of memory chips
10/06/1999CN2342466Y 集成电路块 IC block
10/06/1999CN2342465Y Automatic material feeder for chip frame
10/06/1999CN1231099A Internet television apparatus
10/06/1999CN1231065A Method of transferring thin film device, thin film device, thin film integrated circuit device, active matrix substrate, liquid crystal display and electronic apparatus
10/06/1999CN1231064A Semiconductor device and method of fabricating the same
10/06/1999CN1231063A Liquid source formation of thin film using hexamethyl-disilazane
10/06/1999CN1230974A Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-range
10/06/1999CN1230828A Device and method for monitoring operation of industrial installation
10/06/1999CN1230790A Semiconductor device with conductor flug and fabrication method thereof
10/06/1999CN1230788A Buried patterned conductor planes for semiconductor-on-insulator integrated circuit
10/06/1999CN1230787A Flash memory unit with high coupling ratio and its manufacture
10/06/1999CN1230786A Hierarchic flash memory structure and its manufacture
10/06/1999CN1230785A Semiconductor memory device and method of fabricating the same
10/06/1999CN1230784A Method for manufacturing capacitor of semiconductor device having dielectric layer of high dielectric constant
10/06/1999CN1230781A Manufacturing method of cylindrical stacked electrode
10/06/1999CN1230780A Improved policide
10/06/1999CN1230779A Semiconductor device and method for fabricating thereof
10/06/1999CN1230778A Method for fabricating dram cell capacitor
10/06/1999CN1230777A Integrated circuit and method of manufacturing same
10/06/1999CN1230776A Semiconductor component and its manufacturing method
10/06/1999CN1230775A Method for manufacture of semiconductor integrated circuit device
10/06/1999CN1230774A Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage
10/06/1999CN1230773A Die bonding apparatus
10/06/1999CN1230772A Die bonding apparatus
10/06/1999CN1230771A Method for manufacturing bipolar transistor capable of supressing deterioration of transistor characteristics
10/06/1999CN1230770A Lamp annealer and method for annealing semiconductor wafer
10/06/1999CN1230769A Manufacturing method of semiconductor device
10/06/1999CN1230768A Cleaning/drying station and production line for semiconductor devices
10/06/1999CN1230767A Method for manufacturing discrete substrate
10/06/1999CN1230751A Semiconductor memory device
10/06/1999CN1230725A Design and methodology for manufacturing data processing systems having multiple processors
10/06/1999CN1230704A Photoresist compositions
10/06/1999CN1230691A IC testing device
10/06/1999CN1230471A Method for using high density compressed liquefied gases in cleaning applications
10/06/1999CN1045502C Read amplifier circuit and semiconductor memory element
10/05/1999USRE36328 Semiconductor manufacturing apparatus including temperature control mechanism
10/05/1999US5963881 Method and system for enhancing the identification of causes of variations in the performance of manufactured articles
10/05/1999US5963841 From a semiconductor wafer stack
10/05/1999US5963840 Methods for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions
10/05/1999US5963839 Reduction of polysilicon contact resistance by nitrogen implantation
10/05/1999US5963838 Method of manufacturing a semiconductor device having wiring layers within the substrate
10/05/1999US5963837 Method of planarizing the semiconductor structure
10/05/1999US5963836 Methods for minimizing as-deposited stress in tungsten silicide films
10/05/1999US5963834 Method for forming a CVD film
10/05/1999US5963832 Removal of metal cusp for improved contact fill
10/05/1999US5963830 Method of forming a TiN/W barrier layer for a hot Al plug
10/05/1999US5963829 Method of forming silicide film
10/05/1999US5963828 Method for tungsten nucleation from WF6 using titanium as a reducing agent
10/05/1999US5963827 Method for producing via contacts in a semiconductor device
10/05/1999US5963826 Method of forming contact hole and multilayered lines structure
10/05/1999US5963824 Method of making a semiconductor device with adjustable threshold voltage
10/05/1999US5963823 Manufacturing method of thin film semiconductor device
10/05/1999US5963822 Method of forming selective epitaxial film
10/05/1999US5963821 Method of making semiconductor wafers
10/05/1999US5963820 Method for forming field oxide or other insulators during the formation of a semiconductor device
10/05/1999US5963819 Method of fabricating shallow trench isolation
10/05/1999US5963818 Method for forming a semiconductor structure
10/05/1999US5963817 Bulk and strained silicon on insulator using local selective oxidation
10/05/1999US5963816 Method for making shallow trench marks