Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1999
10/13/1999EP0949673A2 Damascene structure comprising surrounding liner
10/13/1999EP0949672A2 PO Flow for copper metallization
10/13/1999EP0949671A1 Method for forming bumps using dummy wafer
10/13/1999EP0949670A2 Flip-chip mounting method and mounting apparatus of electronic part
10/13/1999EP0949669A2 Method of fabricating semiconductor device
10/13/1999EP0949668A1 Method for forming bump and semiconductor device
10/13/1999EP0949667A1 Electrically programmable memory cell
10/13/1999EP0949666A1 Base emitter region of a submicron bipolar transistor
10/13/1999EP0949665A2 High speed and low parasitic capacitance bipolar transistor and method for fabricating it
10/13/1999EP0949664A2 Method of manufacturing a stacked capacitator in a semiconductor device
10/13/1999EP0949663A2 Deposition of an insulating film comprising carbon
10/13/1999EP0949662A2 Die transfer method and system
10/13/1999EP0949661A2 Cleaning/drying station and production line for semiconductor devices
10/13/1999EP0949660A2 Apparatus and method for assembling semiconductor device
10/13/1999EP0949572A2 Arranging/wiring method of semiconductor device, and semiconductor device arranging/wiring apparatus capable of preventing erroneous operation of actual device, while reducing chip size
10/13/1999EP0949538A2 Membrane mask for projection lithography
10/13/1999EP0949359A1 Process for producing a silicon single crystal by Czochralski method
10/13/1999EP0948879A1 Ceramic composite wiring structures for semiconductor devices and method of manufacture
10/13/1999EP0948818A1 High density trench dmos transistor with trench bottom implant
10/13/1999EP0948816A1 Self-aligned non-volatile storage cell
10/13/1999EP0948814A1 Chip scale ball grid array for integrated circuit package
10/13/1999EP0948813A1 Chip module and method for producing the same
10/13/1999EP0948812A1 Surface connectable semiconductor bridge elements, devices and methods
10/13/1999EP0948810A1 Bump-bonded semiconductor imaging device
10/13/1999EP0948809A1 Wedge device for linear force amplification in a press
10/13/1999EP0948808A1 Integrated circuits and methods for their fabrication
10/13/1999EP0948807A1 Integrated circuit electrode structure and process for fabricating same
10/13/1999EP0948806A2 Holder for a semiconductor substrate, and method of manufacturing a semiconductor device using such a holder
10/13/1999EP0948805A1 Wafer electrical discharge control by wafer lifter system
10/13/1999EP0948804A1 Substrate processing device
10/13/1999EP0883979B1 Method and device for receiving, orientating and assembling of components
10/13/1999EP0859877A4 Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects
10/13/1999EP0843901A4 Electrically erasable, directly overwritable, multibit single cell memory elements and arrays fabricated therefrom
10/13/1999EP0809866A4 Magnetoresistive structure with alloy layer
10/13/1999EP0565079B1 Semiconductor device including voltage stress test shunting circuit
10/13/1999CN1231771A Semiconductor device with a protected barrier for a stack cell
10/13/1999CN1231770A Semiconductor component for high voltage
10/13/1999CN1231768A Process for producing barrier-free semiconductor storage assemblies
10/13/1999CN1231767A Integrated semiconductor storage assembly with buried-plate electrode
10/13/1999CN1231766A Semiconductor storage arrangement with stacked capacitor
10/13/1999CN1231763A Semiconductor read only memory and making method thereof
10/13/1999CN1231762A Method for manufacturing integrated semiconductor memory
10/13/1999CN1231761A Storage assembly with self-aligning non-integrated capacitor arrangement
10/13/1999CN1231760A Process for the manufacture of a highly 'epsilon' dielectric or ferroelectric coating
10/13/1999CN1231623A Removal of material by radiation applied at an oblique angle
10/13/1999CN1231533A Semiconductor device and making method and substrate for making same
10/13/1999CN1231517A Method for driving solid image sensor
10/13/1999CN1231515A High-resistance load static type RAM and making method thereof
10/13/1999CN1231514A Semiconductor memory device
10/13/1999CN1231513A Semiconductor device and design method and the recording medium and support system for said method
10/13/1999CN1231512A MOS pair transistor device
10/13/1999CN1231511A Method for making double-crown electric capacitor
10/13/1999CN1231510A Method for eliminating pin-hole on silicon nitride protective layer
10/13/1999CN1231509A Method of manufacturing monolithic linear optocoupler
10/13/1999CN1231508A Semiconductor storage holder, operation method and production system
10/13/1999CN1231507A Integrated circuit chip, structure body, LCD device and electronic device
10/13/1999CN1231506A High-speed and low parasitic capacitance semiconductor device and making method thereof
10/13/1999CN1231505A Method and apparatus for making semiconductor device
10/13/1999CN1231504A Semiconductor device and making process thereof
10/13/1999CN1231503A Method for making semiconductor device and the semiconductor device
10/13/1999CN1231502A Growth system and technology for uniformly growing film on semiconductor chip
10/13/1999CN1231501A Semiconductor device and making process thereof
10/13/1999CN1231500A Semiconductor device production technology and the used washing device thereof
10/13/1999CN1231499A Reduction of black silicon in semiconductor manufacture
10/13/1999CN1231480A Bus central point holding circuit for high-speed memory read operation
10/13/1999CN1231478A Non-volatile semiconductor memory device and overwriting remedial method thereof
10/13/1999CN1231319A Process for increasing adhesive capacity of polyimide to active metal
10/13/1999CN1045693C Contact structure for interconnections, interposer, semiconductor assembly and method
10/13/1999CN1045688C Method for producing semiconductor film and semiconductor device having the same
10/12/1999US5966694 Method and apparatus for cycle time costing
10/12/1999US5966635 Method for reducing particles on a substrate using chuck cleaning
10/12/1999US5966634 Method of manufacturing semiconductor device having multi-layer wiring structure with diffusion preventing film
10/12/1999US5966633 Method for providing a metallization layer on an insulating layer and for opening through holes in the said insulating layer using the same mask
10/12/1999US5966632 Method of forming borderless metal to contact structure
10/12/1999US5966631 Forced plug processing for high aspect ratio structures
10/12/1999US5966630 Wire bonding method
10/12/1999US5966629 Method for fabricating an electrode structure
10/12/1999US5966628 Process design for wafer edge in vlsi
10/12/1999US5966627 Method of integrated circuit fabrication
10/12/1999US5966626 Method for stabilizing a silicon structure after ion implantation
10/12/1999US5966625 Method for making a slant-surface silicon wafer having a reconstructed atomic-level stepped surface structure
10/12/1999US5966624 Method of manufacturing a semiconductor structure having a crystalline layer
10/12/1999US5966623 Metal impurity neutralization within semiconductors by fluorination
10/12/1999US5966622 Process for fabricating a device
10/12/1999US5966621 Semiconductor processing method of forming field isolation oxide relative to a semiconductor substrate
10/12/1999US5966620 Process for producing semiconductor article
10/12/1999US5966619 Process for forming a semiconductor device having a conductive member that protects field isolation during etching
10/12/1999US5966618 Method of forming dual field isolation structures
10/12/1999US5966617 Multiple local oxidation for surface micromachining
10/12/1999US5966616 Forming channels in silicon body; filling with silicon oxide
10/12/1999US5966615 Method of trench isolation using spacers to form isolation trenches with protected corners
10/12/1999US5966614 Silicon nitride-free isolation methods for integrated circuits
10/12/1999US5966613 Consistent alignment mark profiles on semiconductor wafers using metal organic chemical vapor deposition titanium nitride protective
10/12/1999US5966612 Method of making a multiple mushroom shape capacitor for high density DRAMs
10/12/1999US5966611 Semiconductor processing for forming capacitors by etching polysilicon and coating layer formed over the polysilicon
10/12/1999US5966610 Method of fabricating capacitor plate
10/12/1999US5966609 Method of fabricating dome-shaped semiconductor device
10/12/1999US5966608 Method of forming high voltage device
10/12/1999US5966607 Metal salicide process employing ion metal plasma deposition
10/12/1999US5966606 Method for manufacturing a MOSFET having a side-wall film formed through nitridation of the gate electrode
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