Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1999
10/19/1999US5968610 Multi-step high density plasma chemical vapor deposition process
10/19/1999US5968593 Semiconductors with heaters, chemical tube reactors, feeding
10/19/1999US5968592 Depositing a resist coating on semiconductor wafers, spinning at speeds
10/19/1999US5968587 Systems and methods for controlling the temperature of a vapor deposition apparatus
10/19/1999US5968441 Ablating a transparent material, laser beam absorption layer
10/19/1999US5968389 Method and machine for hybridization by refusion
10/19/1999US5968383 Laser processing apparatus having beam expander
10/19/1999US5968382 Laser cleavage cutting method and system
10/19/1999US5968379 High temperature ceramic heater assembly with RF capability and related methods
10/19/1999US5968374 Methods and apparatus for controlled partial ashing in a variable-gap plasma processing chamber
10/19/1999US5968333 Method of electroplating a copper or copper alloy interconnect
10/19/1999US5968327 Ionizing sputter device using a coil shield
10/19/1999US5968324 Stabilization of plasma enhanced vapor deposition process by adding a flow of inert gas to deposition gases to form thin antireflective film on semiconductor wafer
10/19/1999US5968285 Immersion in rinse liquid in enclosed chambers; drainage, displacement
10/19/1999US5968282 Brush with thinner bristles; soft rubber cleaner with inorganic filler; semiconductors
10/19/1999US5968279 Method of cleaning wafer substrates
10/19/1999US5968278 High aspect ratio contact
10/19/1999US5968276 Heat exchange passage connection
10/19/1999US5968275 Methods and apparatus for passivating a substrate in a plasma reactor
10/19/1999US5968273 Wafer stage for manufacturing a semiconductor device
10/19/1999US5968268 Coating apparatus and coating method
10/19/1999US5968266 Apparatus for manufacturing single crystal of silicon
10/19/1999US5968264 Method and apparatus for manufacturing a silicon single crystal having few crystal defects, and a silicon single crystal and silicon wafers manufactured by the same
10/19/1999US5968262 Method of fabricating silicon single crystals
10/19/1999US5968260 Method for fabricating a single-crystal semiconductor
10/19/1999US5968239 Polishing slurry
10/19/1999US5968150 Processor element having a plurality of CPUs for use in a multiple processor system
10/19/1999US5967889 Fixture for mechanical grinding and inspection of failed or defective semiconductor devices
10/19/1999US5967881 Chemical mechanical planarization tool having a linear polishing roller
10/19/1999US5967804 Circuit member and electric circuit device with the connecting member
10/19/1999US5967794 Method for fabricating a field effect transistor having elevated source/drain regions
10/19/1999US5967740 Device for the transport of objects to a destination
10/19/1999US5967578 Tool for the contact-free support of plate-like substrates
10/19/1999US5967577 Apparatus for dispensing fluid in an array pattern
10/19/1999US5967571 Vacuum actuated mechanical latch
10/19/1999US5967401 Wire bonding method
10/19/1999US5967328 Part carrier strip
10/19/1999US5967159 Substrate conveying device and substrate conveying method
10/19/1999US5967156 Processing a surface
10/19/1999US5966940 Semiconductor thermal conditioning apparatus and method
10/19/1999US5966903 High speed flip-chip dispensing
10/19/1999US5966803 Ball grid array having no through holes or via interconnections
10/19/1999US5966766 Apparatus and method for cleaning semiconductor wafer
10/19/1999US5966765 Cleaning apparatus
10/15/1999CA2234835A1 Electric terminal connection method
10/14/1999WO1999052213A1 Agp/ddr interfaces for full swing and reduced swing (sstl) signals on an integrated circuit chip
10/14/1999WO1999052209A1 Surface acoustic wave device package and method
10/14/1999WO1999052155A1 Semiconductor structure having photovoltaic component
10/14/1999WO1999052151A1 A cmos integrated circuit having pmos and nmos devices with different gate dielectric layers
10/14/1999WO1999052150A1 Guard structure for bipolar semiconductor device
10/14/1999WO1999052149A1 Use of the constructional characteristics of an electronic component as a reference for positioning the component
10/14/1999WO1999052146A1 Method of forming a local interconnect
10/14/1999WO1999052145A1 Heat treatment method for semiconductor substrates
10/14/1999WO1999052144A1 Electrostatic chuck power supply
10/14/1999WO1999052143A1 Alignment processing mechanism and semiconductor processing device using it
10/14/1999WO1999052142A1 Transfer device for body to be treated
10/14/1999WO1999052141A1 Method and apparatus for wafer processing, and method and apparatus for exposure
10/14/1999WO1999052140A1 Container
10/14/1999WO1999052139A1 Probe device
10/14/1999WO1999052138A1 A bipolar transistor having low extrinsic base resistance
10/14/1999WO1999052137A1 Alignment method using a block-out mask for a bipolar transistor
10/14/1999WO1999052136A1 Method of manufacturing interconnection structural body
10/14/1999WO1999052135A1 Method for etching low k dielectrics
10/14/1999WO1999052134A1 Cold processes for cleaning and stripping photoresist from surfaces of semiconductor wafers
10/14/1999WO1999052133A1 Depositing a material of controlled, variable thickness across a surface for planarization of that surface
10/14/1999WO1999052132A1 Method and apparatus for detecting plasma-processing end point, and method and apparatus for manufacturing semiconductor device by means of the same
10/14/1999WO1999052131A1 Semiconductor contact fabrication method
10/14/1999WO1999052126A1 Direct temperature control for a component of a substrate processing chamber
10/14/1999WO1999052125A1 Method and device for specifically manipulating and depositing particles
10/14/1999WO1999052013A1 Tft array substrate for liquid crystal display and method of producing the same, and liquid crystal display and method of producing the same
10/14/1999WO1999051796A1 Method for removing photoresist and plasma etch residues
10/14/1999WO1999051398A1 Apparatus and methods for slurry removal in chemical mechanical polishing
10/14/1999WO1999051397A1 Polishing device
10/14/1999WO1999051357A1 Energy emission system for photolithography
10/14/1999WO1999051356A1 Fluid nozzle system, energy emission system for photolithography and its method of manufacture
10/14/1999WO1999044204A3 Memory cell arrangement and method for producing the same
10/14/1999WO1999041434A3 Plating apparatus and method
10/14/1999WO1999027586A3 INxGa1-xP STOP-ETCH LAYER FOR SELECTIVE RECESS OF GALLIUM ARSENIDE-BASED EPTITAXIAL FIELD EFFECT TRANSISTORS AND PROCESS THEREFOR
10/14/1999WO1999021215A3 Methods of forming power semiconductor devices having merged split-well body regions therein and devices formed thereby
10/14/1999DE19916575A1 Semiconductor module with resistor in one circuit
10/14/1999DE19915745A1 Assembly structure of electronic parts prevents the formation of cracks in adhesive substrate
10/14/1999DE19915572A1 Immersion lens for electron beam projection system
10/14/1999DE19914697A1 Depletion MOS semiconducting component for MOS power IC
10/14/1999DE19907956A1 Vorrichtung und Verfahren zur Oberflächenbehandlung von aufwärts gewendeten Wafern Apparatus and method for surface treatment of upward-turned wafers
10/14/1999DE19860884A1 Verfahren zur Herstellung eines Dram-Zellenkondensators A process for preparing a DRAM cell capacitor
10/14/1999DE19857356A1 Heterojunction bipolar transistor especially a high output power HBT with a multi-finger structure used in high frequency and high power components
10/14/1999DE19853433A1 Semiconductor device e.g. a PMOS, NMOS or CMOS transistor, a MOS capacitor or a Bi-MOS device
10/14/1999DE19817530A1 Manufacture of thin film structures
10/14/1999DE19815874A1 Halbleiter-Speichervorrichtung und Verfahren zu deren Herstellung The semiconductor memory device and methods for their preparation
10/14/1999DE19815873A1 Verfahren zur Herstellung einer Halbleiter-Speichervorrichtung A method of manufacturing a semiconductor memory device
10/14/1999DE19815114A1 Determining generation life duration and effective surface generation speed at metal insulator semiconductor structures (MOS structures)
10/13/1999EP0949689A2 Epitaxial semiconductor substrate and manufacturing method thereof; manufacturing method of semiconductor device and of solid-state imaging device
10/13/1999EP0949684A2 Trench capacitor with epitaxial buried layer
10/13/1999EP0949683A1 Zener diodes assembly
10/13/1999EP0949682A2 Ferroelectric memory device with improved ferroelectric capacitor characteristics
10/13/1999EP0949681A1 Semiconductor memory device
10/13/1999EP0949680A2 A trench capacitor with isolation collar
10/13/1999EP0949677A1 Semiconductor device and method of manufacturing the same
10/13/1999EP0949676A1 Semiconductor device and method of manufacturing the same
10/13/1999EP0949674A2 Method of forming buried strap for trench capacitor