Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1999
10/26/1999US5971257 Method for use in bonding a chip to a substrate
10/26/1999US5971254 Decoupled xyz stage
10/26/1999US5971248 Steady autorotation of wire bonding capillary
10/26/1999US5971191 Gasket for use in a container
10/26/1999US5971156 Semiconductor chip tray with rolling contact retention mechanism
10/26/1999US5970818 Notch alignment apparatus and adjustment jig for the same
10/26/1999US5970807 Tweezer position checker
10/26/1999US5970717 Cooling method, cooling apparatus and treatment apparatus
10/26/1999US5970621 Semiconductor wafer cassette positioning and detection mechanism
10/26/1999CA2129838C Improved method for isolating sio2 layers from pzt, plzt and platinum layers
10/21/1999WO1999053738A1 Method and device for producing thin-layer structures
10/21/1999WO1999053736A1 Pressure-bonded substrate, liquid crystal device, and electronic device
10/21/1999WO1999053603A1 Electrostatic wafer clamp having low particulate contamination of wafers
10/21/1999WO1999053552A1 Product made of silicon carbide and a method for the production thereof
10/21/1999WO1999053551A1 Product made of silicon carbide and a method for the production thereof
10/21/1999WO1999053549A1 Universal semiconductor wafer for high-voltage semiconductor components
10/21/1999WO1999053546A1 Semiconductor memory and method for producing same
10/21/1999WO1999053544A1 Method for producing a semiconductor storage device
10/21/1999WO1999053543A1 Semiconductor component
10/21/1999WO1999053542A1 Method for forming a multi-layered aluminum-comprising structure on a substrate
10/21/1999WO1999053541A1 Method for producing an soi (silicon on insulator) wafer for low-impedance high-voltage semiconductor components
10/21/1999WO1999053540A1 A method of forming a silicon nitride layer on a semiconductor wafer
10/21/1999WO1999053539A1 Silicon-germanium etch stop layer system
10/21/1999WO1999053538A1 Synchronous multiplexed near zero overhead architecture for vacuum processes
10/21/1999WO1999053537A1 Method for relaxing stress in blanket tungsten film formed by chemical vapor deposition
10/21/1999WO1999053536A1 Chemical vapor deposition fabrication of hybrid electrodes for ferroelectric device structures
10/21/1999WO1999053535A1 Method for selectively forming a silicide after a planarization step
10/21/1999WO1999053534A1 Process system
10/21/1999WO1999053533A1 Apparatus for gas processing
10/21/1999WO1999053532A1 Slurry for chemical-mechanical polishing metal surfaces
10/21/1999WO1999053531A2 Post-cmp wet-hf cleaning station
10/21/1999WO1999053527A2 Method and system for fabricating and testing assemblies containing wire bonded semiconductor dice
10/21/1999WO1999053519A1 Shaped shadow projection for an electron beam column
10/21/1999WO1999053518A1 Detecting registration marks with a low energy electron beam
10/21/1999WO1999053499A1 Non-volatile storage latch
10/21/1999WO1999053378A1 Pattern forming method
10/21/1999WO1999053377A1 Chemically amplified resist composition
10/21/1999WO1999053121A1 Automated chemical process control system
10/21/1999WO1999053120A1 Reduced impedance chamber
10/21/1999WO1999053119A1 Method and apparatus for enhancing adhesion between barrier layer and metal layer formed by plating
10/21/1999WO1999053118A1 Integrated ion implant scrubber system
10/21/1999WO1999053117A2 Film deposition system
10/21/1999WO1999053116A1 Stacked showerhead assembly for delivering gases and rf power to a reaction chamber
10/21/1999WO1999053114A1 Continuous process for sputtering tantalum nitride films
10/21/1999WO1999052970A1 Sheet and method for producing the same
10/21/1999WO1999052686A1 Substrate prealigner
10/21/1999WO1999052654A1 Process and apparatus for treating a workpiece such as a semiconductor wafer
10/21/1999WO1999044752A3 Circuit and method for specifying performance parameters in integrated circuits
10/21/1999DE19914234A1 Vorrichtung umfassend einen Temperaturanzeigeschaltkreis mit Temperaturhysterese Device comprising a temperature indicator circuit with temperature hysteresis
10/21/1999DE19913808A1 Holding unit for definite and repetetive positioning of trays with components for a component handling apparatus
10/21/1999DE19913134A1 Übertragungsvorrichtung für Chipkomponenten Transmission apparatus for chip components
10/21/1999DE19912467A1 Editing apparatus for definition of a physical translation of logic result bit map into physical result bit map
10/21/1999DE19905568A1 Polymer mixture used in chemically amplified photoresists for the manufacture of semiconductor devices
10/21/1999DE19840824C1 Ferroelectric transistor especially for a non-volatile memory cell
10/21/1999DE19822512A1 Semiconductor element separation and positioning method
10/21/1999DE19817359A1 Ceramic multi-layer circuit manufacturing method
10/21/1999DE19817311A1 Manufacture of micromechanical component, such as rotation rate sensor
10/21/1999DE19816739A1 Apparatus for loading/unloading a process reactor with components, in particular wafers
10/21/1999DE19816221A1 Treatment of objects, particularly wafers
10/21/1999DE19816150A1 Making adhesive bond between support plate front and cleaned rear of semiconductor wafer
10/21/1999CA2328295A1 Film deposition system
10/21/1999CA2327421A1 Silicon-germanium etch stop layer system
10/21/1999CA2292645A1 Detecting registration marks with a low energy electron beam
10/21/1999CA2291697A1 Shaped shadow projection for an electron beam column
10/20/1999EP0951077A2 Method for growing nitride compound semiconductor
10/20/1999EP0951076A2 Buried reflectors for light emitters in epitaxial material and method for producing same
10/20/1999EP0951075A1 Semiconductor device with a p-n junction and method for driving the same
10/20/1999EP0951074A2 Multi-emitter bipolar transistor
10/20/1999EP0951072A1 Semiconductor integrated circuit device
10/20/1999EP0951071A1 Semiconductor device
10/20/1999EP0951067A1 Integrated circuit with etch stop layer and method of fabrication
10/20/1999EP0951066A1 Method of manufacturing semiconductor device
10/20/1999EP0951065A2 Method of manufacturing semiconductor device
10/20/1999EP0951064A1 Manufacture of semiconductor device
10/20/1999EP0951063A1 Semiconductor device and process for producing the same
10/20/1999EP0951062A2 Electronic part and manufacturing method therefor
10/20/1999EP0951061A2 Method for forming a FET
10/20/1999EP0951060A1 Method of manufacturing a bipolar transistor using a sacrificial sidewall spacer
10/20/1999EP0951059A2 Method of fabricating ferroelectric integrated circuit using oxygen anneal to inhibit and repair hydrogen degradation
10/20/1999EP0951058A2 Method of fabricating ferroelectric integrated circuit using dry and wet etching
10/20/1999EP0951057A1 Substrate flattening method, and film-coated substrate and semiconductor device manufacturing method
10/20/1999EP0951056A2 Preparation process of semiconductor wafer using a protective adhesive tape
10/20/1999EP0951055A2 Epitaxial material grown laterally within a trench
10/20/1999EP0951054A1 Aligner and method for exposure
10/20/1999EP0951053A2 Field effect devices and capacitors with improved thin film dielectrics
10/20/1999EP0951051A2 A resist processing apparatus and a resist processing method
10/20/1999EP0951050A2 Container for transporting precision substrates
10/20/1999EP0951047A2 Nanostructure, electron emitting device, carbon nanotube device, and method of producing the same
10/20/1999EP0950930A2 Pattern formation method and apparatus using atomic beam holography technology
10/20/1999EP0950727A1 Ferroelectric thin films and solutions for their production
10/20/1999EP0950726A2 Precursor solution for forming thin film of ferroelectric substance and production process thereof
10/20/1999EP0950466A2 Method for chamfering a wafer
10/20/1999EP0950430A1 Separation of CF4 and C2F6 from a perfluorocompound mixture
10/20/1999EP0950265A1 Uniform ballast resistance for a thermally balanced radio frequency power transistor
10/20/1999EP0950262A1 A via structure
10/20/1999EP0950261A1 Semiconductor with metal coating on its rear surface
10/20/1999EP0950260A1 Standardized bonding location process and apparatus
10/20/1999EP0950259A1 Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures
10/20/1999EP0950258A1 Method and device for treating a semiconductor surface
10/20/1999EP0950257A2 Method for making a thin film on a support and resulting structure
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