| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/20/2000 | WO2000003419A2 Wafer cleaning apparatus |
| 01/20/2000 | WO2000003418A2 Intelligent wafer handling system and method |
| 01/20/2000 | WO2000003417A1 Device and method for providing a complete wafer stack |
| 01/20/2000 | WO2000003416A2 A wafer carrier having a low tolerance build-up |
| 01/20/2000 | WO2000003415A1 Rf matching network with distributed outputs |
| 01/20/2000 | WO2000003414A1 Feedthrough overlap coil |
| 01/20/2000 | WO2000003413A1 Method for observing specimen and device therefor |
| 01/20/2000 | WO2000003395A1 Ferroelectric ram arrangement |
| 01/20/2000 | WO2000003357A1 Identifying and handling device tilt in a three-dimensional machine-vision image |
| 01/20/2000 | WO2000003345A1 Semiconductor component having a passivation |
| 01/20/2000 | WO2000003339A1 Two-dimensional to three-dimensional vlsi design |
| 01/20/2000 | WO2000003307A1 Maskless photolithography system |
| 01/20/2000 | WO2000003306A1 Composition for stripping photoresist and organic materials from substrate surfaces |
| 01/20/2000 | WO2000003304A1 Method for decontaminating microlithography projection lighting devices |
| 01/20/2000 | WO2000003301A2 Exposure device having a planar motor |
| 01/20/2000 | WO2000003296A1 A reflection system for imaging on a nonplanar substrate |
| 01/20/2000 | WO2000003284A1 Multiplexer for laser lithography |
| 01/20/2000 | WO2000003252A2 Multi-point probe |
| 01/20/2000 | WO2000003234A1 Automatic defect classification with invariant core classes |
| 01/20/2000 | WO2000003232A1 Improved process monitor |
| 01/20/2000 | WO2000003198A1 Machine vision and semiconductor handling |
| 01/20/2000 | WO2000003169A2 Manifold system of removable components for distribution of fluids |
| 01/20/2000 | WO2000003072A1 Method and apparatus for copper plating using electroless plating and electroplating |
| 01/20/2000 | WO2000003071A1 Electroplating reactor including back-side electrical contact apparatus |
| 01/20/2000 | WO2000003065A1 Surface treatment apparatus |
| 01/20/2000 | WO2000003064A1 Gas distributor plate for a processing apparatus |
| 01/20/2000 | WO2000003061A1 Method and apparatus for forming amorphous and polycrystalline silicon germanium alloy films |
| 01/20/2000 | WO2000003059A1 Systems and methods for two-sided etch of a semiconductor substrate |
| 01/20/2000 | WO2000003057A1 Multi-position load lock chamber |
| 01/20/2000 | WO2000003056A1 System and method for reducing particles in epitaxial reactors |
| 01/20/2000 | WO2000002824A1 Heating a substrate support in a substrate handling chamber |
| 01/20/2000 | WO2000002808A1 Robots for microelectronic workpiece handling |
| 01/20/2000 | WO2000002804A1 Opening system compatible with a vertical interface |
| 01/20/2000 | WO2000002803A1 Dual arm substrate handling robot with a batch loader |
| 01/20/2000 | WO2000002798A1 Cushioned wafer container |
| 01/20/2000 | WO2000002708A1 Polishing pads for a semiconductor substrate |
| 01/20/2000 | WO2000002707A1 Polishing pad for a semiconductor substrate |
| 01/20/2000 | WO2000002675A1 Automated semiconductor processing system |
| 01/20/2000 | WO2000002673A1 Wafer edge scrubber |
| 01/20/2000 | WO2000002672A1 Cleaning apparatus |
| 01/20/2000 | WO2000002670A1 Apparatus and method for coating a semiconductor device with fluid |
| 01/20/2000 | WO1999060613A3 Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system |
| 01/20/2000 | DE19933213A1 Apparatus and method for surface treatment of semiconductor substrates, involving collection, detection, analysis and evaluation of infrared (or near infrared) radiation from substrates for purposes of control of treatment conditions |
| 01/20/2000 | DE19932429A1 Blanking aperture array (BAA) arrangement for electron beam lithography |
| 01/20/2000 | DE19932269A1 Verfahren und Vorrichtung zur Herstellung eines Verbundes zwischen einem Trägerkörper und mindestens einer darin enthaltenen Komponente Method and apparatus for producing a bond between a carrier body and at least one component contained therein |
| 01/20/2000 | DE19931149A1 Optical semiconductor device, especially an optoelectronic integrated circuit for wideband optical communications, comprises a zinc oxide film between a gallium arsenide substrate and a gallium nitride-based light emitting-receiving layer |
| 01/20/2000 | DE19928280A1 Ferroelectric memory device, especially a ferroelectric RAM for modern data processing systems, is produced by forming a capacitor with a multilayer ferroelectric layer of titanate content exceeding its zirconate content |
| 01/20/2000 | DE19921015A1 Adjustment mark for detecting location of coupling layer on insulation layer of semiconductor component |
| 01/20/2000 | DE19912490A1 Semiconductor memory with cut fuse layer for controlling redundant circuit |
| 01/20/2000 | DE19909815A1 Gate electrode structure of MOS transistor, which consists of film lamination on gate insulating film on semiconductor substrate |
| 01/20/2000 | DE19903208A1 Fused semiconductor device e.g. semiconductor memory with redundant memory cells has silicon oxide layer on either side of metal fuse for preventing fuse corrosion |
| 01/20/2000 | DE19831550A1 Wire bonding between electric component(s) and substrate with contact pads |
| 01/20/2000 | DE19831032A1 Base module as central transport module for work centers of cluster type for mfr. of microsystems and components on wafers etc. |
| 01/20/2000 | DE19830332A1 Vertikales Halbleiterbauelement mit reduziertem elektrischem Oberflächenfeld Vertical semiconductor component with reduced surface electrical field |
| 01/20/2000 | DE19830162A1 Verfahren und Vorrichtung zum Reinigen von Substraten Method and apparatus for cleaning substrates |
| 01/20/2000 | DE19827198A1 Single crystal aluminum nitride layers, useful as high frequency SAW filters and buffer layers for electronic and optoelectronics component deposition, are grown on silicon using silicon surface construction and reconstruction steps |
| 01/20/2000 | CA2337202A1 Polishing pads for a semiconductor substrate |
| 01/20/2000 | CA2336859A1 Polishing pad for a semiconductor substrate |
| 01/20/2000 | CA2336851A1 Methods and apparatus for electropolishing metal interconnections on semiconductor devices |
| 01/20/2000 | CA2336531A1 Multi-point probe |
| 01/19/2000 | EP0973260A1 Low switching noise logic circuit |
| 01/19/2000 | EP0973206A2 High withstand voltage MIS transistor |
| 01/19/2000 | EP0973205A2 High voltage MOS transistor |
| 01/19/2000 | EP0973204A2 MOS-Transistor with enhanced withstanding voltage and reduced on-resistance |
| 01/19/2000 | EP0973203A2 Semiconductor layer with lateral variable doping and its method of fabrication |
| 01/19/2000 | EP0973201A1 Stacked capacitor and method of making the same |
| 01/19/2000 | EP0973200A1 Reference voltage supply circuit |
| 01/19/2000 | EP0973199A2 Semiconductor device comprising a composite layer structure |
| 01/19/2000 | EP0973198A2 System and method for bonding over active integrated curcuits |
| 01/19/2000 | EP0973197A2 Wafer-scale package structure and circuit board used therein |
| 01/19/2000 | EP0973195A1 Silver metallization by damascene method |
| 01/19/2000 | EP0973194A1 Semiconductor device and manufacturing method thereof |
| 01/19/2000 | EP0973193A2 Method of preparing an electronic package by co-curing adhesive and encapsulant |
| 01/19/2000 | EP0973192A2 Method and apparatus for processing resin sealed lead frame |
| 01/19/2000 | EP0973191A1 Method for manufacturing semiconductor integrated circuit device |
| 01/19/2000 | EP0973190A2 Silicon wafer and method for producing it |
| 01/19/2000 | EP0973189A2 A method for gate-stack formation including a high-K dielectric |
| 01/19/2000 | EP0973188A1 Apparatus for the fabrication of tapered structures in semiconductors |
| 01/19/2000 | EP0973069A2 Monitoring apparatus and method particularly useful in photolithographically processing substrates |
| 01/19/2000 | EP0973068A2 Method and system for controlling the photolithography process |
| 01/19/2000 | EP0972716A1 Cover-carrying thin sheet storage container |
| 01/19/2000 | EP0972612A2 Polishing pad |
| 01/19/2000 | EP0972575A2 Process and device for lacquering or coating a substrate |
| 01/19/2000 | EP0972561A2 Vacuum apparatus |
| 01/19/2000 | EP0972428A1 Plasma etching using polycarbonate etch mask |
| 01/19/2000 | EP0972310A1 Method for fabricating low-resistance contacts on nitride semiconductor devices |
| 01/19/2000 | EP0972309A4 Barrier layer for ferroelectric capacitor integrated on silicon |
| 01/19/2000 | EP0972309A1 Barrier layer for ferroelectric capacitor integrated on silicon |
| 01/19/2000 | EP0972308A1 Interconnect design with controlled inductance |
| 01/19/2000 | EP0972305A1 Process for fabricating a diffused emitter bipolar transistor |
| 01/19/2000 | EP0972304A1 Method for obtaining a thin film, in particular semiconductor, comprising a protected ion zone and involving an ion implantation |
| 01/19/2000 | EP0972303A1 Low dielectric constant material with improved dielectric strength |
| 01/19/2000 | EP0972302A1 Direct vapor delivery of enabling chemical for enhanced hf etch process performance |
| 01/19/2000 | EP0972301A1 Manufacturing a heterobipolar transistor and a laser diode on the same substrate |
| 01/19/2000 | EP0972300A2 Method of manufacturing integrated circuits |
| 01/19/2000 | EP0972299A1 Method and apparatus for control of deposit build-up on an inner surface of a plasma processing chamber |
| 01/19/2000 | EP0972293A1 Electrode structure and method of making for ferroelectric capacitor integrated on silicon |
| 01/19/2000 | EP0972287A1 High-efficiency miniature magnetic integrated circuit structures |
| 01/19/2000 | EP0972284A1 Electric or electronic component and application as non volatile memory and device with surface acoustic waves |
| 01/19/2000 | EP0972094A1 Low defect density, vacancy dominated silicon |