Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/1999
12/28/1999US6007920 Facilitates expansion to be conducted after the wafer dicing
12/28/1999US6007877 Aqueous developable high performance photosensitive curable aromatic ether polymers
12/28/1999US6007868 Method of manufacturing ferroelectric bismuth-titanate layers on a substrate from solution
12/28/1999US6007867 Printing and drying layer of conductor paste to form dried, un-fired conductor trace; printing and drying feature definition layer of dielectric paste that is co-firable with conductor paste; co-firing dielectric and conductor pastes
12/28/1999US6007733 Hard masking method for forming oxygen containing plasma etchable layer
12/28/1999US6007732 Forming a photoresist film on the amorphous carbon film, selectively exposing and developing the photoresist film to form a photoresist pattern, successively dry-etching the amorphous carbon film and the patterning layer
12/28/1999US6007730 Method of manufacturing diamond heat sink
12/28/1999US6007729 Carrier tape and manufacturing method of said carrier tape
12/28/1999US6007684 Process for forming improved titanium-containing barrier layers
12/28/1999US6007675 Wafer transfer system and method of using the same
12/28/1999US6007673 Apparatus and method of producing an electronic device
12/28/1999US6007672 Dustless process using an electrode having a specific flatess and a camber of the front surface side of the being recessed and the back is projecting; fine patterns for semiconductor wafers for integrated circuits and optical apparatus
12/28/1999US6007671 Having a vacuum chamber where part of an inside wall is silicon oxide; controlling the temperature of the silicon dioxide to prevent hydrogen atoms from deposit and recombining on the internal wall
12/28/1999US6007668 Tape automated bonding (tab) formed by bonding a conductor metal foil onto an adhesive layer on a metal plate; coating the metal plate with a protective plating inert to the etchant and etching the foil; hermetic sealing
12/28/1999US6007654 Noncontact method of adhering a wafer to a wafer tape
12/28/1999US6007641 Cleaning with an aqueous solution of hydrogen peroxide; exposing silicon and demetallizing (calcium) by removing silicon dioxide with an aqueous hydrogen fluoride and nitricacid solution; rinsing; drying; oxidation to pure
12/28/1999US6007635 Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing
12/28/1999US6007633 Single-substrate-processing apparatus in semiconductor processing system
12/28/1999US6007631 Multiple head dispensing system and method
12/28/1999US6007629 Substrate processing apparatus
12/28/1999US6007624 Process for controlling autodoping during epitaxial silicon deposition
12/28/1999US6007317 Ball grid array (BGA) encapsulation mold
12/28/1999US6007292 Work piece transfer apparatus
12/28/1999US6007286 Driving screw and a method for forming lubricating film thereon
12/28/1999US6006977 Wire bonding capillary alignment display system
12/28/1999US6006919 Storage container for precision substrates and a positioning mechanism therefor and a method of positioning the storage container for precision substrates
12/28/1999US6006765 Megasonic cleaning methods and apparatus
12/28/1999US6006764 Method of stripping photoresist from Al bonding pads that prevents corrosion
12/28/1999US6006737 Device and method for cutting semiconductor-crystal bars
12/28/1999US6006736 Method and apparatus for washing silicon ingot with water to remove particulate matter
12/28/1999US6006701 Vaporizer in a liquid material vaporizing and feeding apparatus
12/28/1999US6006694 Plasma reactor with a deposition shield
12/28/1999US6006593 Method using cantilever to measure physical properties
12/28/1999US6006428 Polytetrafluoroethylene thin film chip carrier
12/28/1999US6006426 Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
12/28/1999US6006424 Method for fabricating inner leads of a fine pitch leadframe
12/28/1999US6006391 Workpiece cleaning element with improved rib configuration
12/28/1999CA2176270C Hybrid microcircuit glass-to-metal seal repair process
12/28/1999CA2029970C Radiation curable organosiloxane gel composition
12/28/1999CA2018988C Photoresist
12/26/1999CA2276458A1 Semiconductor device
12/23/1999WO1999066769A1 Plasma processor
12/23/1999WO1999066565A1 Method and apparatus for producing group-iii nitrides
12/23/1999WO1999066559A1 Integrated silicon-on-insulator integrated circuit with decoupling capacity and method for making such a circuit
12/23/1999WO1999066558A1 Semiconductor device and production method thereof
12/23/1999WO1999066557A1 Semiconductor device
12/23/1999WO1999066551A1 Scaleable integrated data processing device
12/23/1999WO1999066550A1 Substrate transfer device
12/23/1999WO1999066549A1 Method and apparatus for dechucking a substrate from an electrostatic chuck
12/23/1999WO1999066548A1 Method for determining parameter distributions of object properties
12/23/1999WO1999066547A1 Method and device for forming bump
12/23/1999WO1999066546A1 Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context
12/23/1999WO1999066545A1 Process for removing oxide using hydrogen fluoride vapor
12/23/1999WO1999066544A1 A technique for chemical mechanical polishing silicon
12/23/1999WO1999066540A2 An integrated inorganic/organic complementary thin-film transistor circuit and a method for its production
12/23/1999WO1999066539A2 Lateral thin-film soi devices with graded top oxide and graded drift region
12/23/1999WO1999066533A1 Semiconductor process chamber electrode and method for making the same
12/23/1999WO1999066532A1 Cleaning process end point determination using throttle valve position
12/23/1999WO1999066531A1 Plasma processing apparatus
12/23/1999WO1999066530A1 Method and device for correcting proximity effects
12/23/1999WO1999066445A1 Method for producing an integrated circuit card and card produced according to said method
12/23/1999WO1999066337A2 Device for measuring and analyzing electrical signals of an integrated circuit component
12/23/1999WO1999066286A1 Ellipsometric method and control device for making a thin-layered component
12/23/1999WO1999066221A1 Static pressure gas bearing, stage device using it, and optical device using it
12/23/1999WO1999066101A1 Dual channel gas distribution plate
12/23/1999WO1999065839A1 Alkaline water-based solution for cleaning metallized microelectronic workpieces and methods of using same
12/23/1999WO1999065803A1 Automated opening and closing of ultra clean storage containers
12/23/1999WO1999065617A1 Chemical vapor deposition of a copolymer of p-xylylene and a multivinyl silicon/oxygen comonomer
12/23/1999WO1999065592A1 Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization
12/23/1999WO1999050889A3 Printed insulators for active and passive electronic devices
12/23/1999WO1999045588A3 Semiconductor device comprising a glass supporting body onto which a substrate with semiconductor elements and a metallization is attached by means of an adhesive
12/23/1999DE19927873A1 Testing of chip-scale-housings for ICs with which plate is provided on which several chip-scale-housings are applied
12/23/1999DE19927727A1 Voltage surge suppression circuit for transistors with isolated gates
12/23/1999DE19926711A1 Ferroelectric DRAM device and manufacture
12/23/1999DE19926701A1 Contact plug for testing semiconductor disc of encased LSI component or printed circuit board for component to be tested
12/23/1999DE19925657A1 Self aligned contact with interlayer to fill spaces between stacked patterns with contact holes and spacers on sidewalls of patterns
12/23/1999DE19924239A1 Method to produce contact point on conductor, for electrical contacting to electric part
12/23/1999DE19922736A1 Compound semiconductor single crystal is produced by the vertical Bridgman method
12/23/1999DE19920332A1 Process reactor especially a diffusion furnace for phosphoryl chloride treatment of semiconductor substrates
12/23/1999DE19918360A1 Determining recombinant life duration of metal-insulator-semiconductor structures used as important control parameter with development and monitoring of silicon based semiconductor materials and technologies
12/23/1999DE19916568A1 Component tray transfer arm of semiconductor IC test device
12/23/1999DE19913922A1 Verfahren zum Bestimmen von Parameterverteilungen von Objekteigenschaften A method for determining parameter distributions of object properties
12/23/1999DE19906192A1 Semiconducting arrangement having high density capacitance
12/23/1999DE19860704A1 Semiconductor wafer inspecting method using a scanning electron microscope (SEM)
12/23/1999DE19860119A1 Semiconducting device for memory cell
12/23/1999DE19858364A1 Semiconducting device with memory circuit and logic circuit mixed on single chip
12/23/1999DE19857095A1 Semiconductor component with dual-gate oxide layers of different thicknesses especially in a chip having an integrated DRAM and a mounted logic device
12/23/1999DE19848444A1 Method of forming a selective metal layer to fill contact hole in manufacture of semiconductor capacitor
12/23/1999DE19845350C1 Work trolley for wafer cassette production machine
12/23/1999DE19840421A1 Thin substrate layers, especially thin IC chips, are produced from two bonded substrates
12/23/1999DE19838106A1 Thermally stable tungsten silicide layer formation, especially in gate structure of a MOS device
12/23/1999DE19827686A1 Semiconductor component especially a surface shaping stencil or support structure, e.g. for a DRAM or SDRAM capacitor plate
12/23/1999DE19827603A1 Projection light exposure system for microlithography
12/23/1999DE19827602A1 Verfahren zur Korrektur nicht-rotationssymmetrischer Bildfehler A method of correcting non-rotationally symmetric aberrations
12/23/1999DE19827414A1 Verfahren zum Herstellen eines Metall-Keramik-Substrates A method for producing a metal-ceramic substrate
12/23/1999DE19827202A1 Rapid and reliable nondestructive detection and characterization of crystal defects in single crystal semiconductor material, e.g. silicon rods or wafers
12/23/1999DE19827124A1 Transport of flat circular disc-shaped workpieces to and from working stations
12/23/1999DE19813239C1 Verdrahtungsverfahren zur Herstellung einer vertikalen integrierten Schaltungsstruktur und vertikale integrierte Schaltungsstruktur A wiring method for producing a vertical integrated circuit structure and vertical integrated circuit structure
12/23/1999CA2335175A1 Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization
12/23/1999CA2333790A1 Method for producing an integrated circuit card and card produced according to said method
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