Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2000
02/09/2000EP0978016A1 Antireflective coating compositions for photoresist compositions and use thereof
02/09/2000EP0978015A1 Light absorbing polymers
02/09/2000EP0977911A1 Preparation of copper-indium-gallium-diselenide precursor films by electrodeposition for fabricating high efficiency solar cells
02/09/2000EP0977906A1 Metered gas control in a substrate processing apparatus
02/09/2000EP0977797A1 Organohydridosiloxane resins with high organic content
02/09/2000EP0977795A1 Synthesis of siloxane resins
02/09/2000EP0977652A1 Abrasive material for the needle point of a probe card
02/09/2000EP0791189B1 Positioning device with a vibration-free object table
02/09/2000EP0775304B1 Method of producing cavity structures
02/09/2000CN1244143A Processf or making a parylene coating
02/09/2000CN1244070A Voltage adaptable interface circuit
02/09/2000CN1244041A Semiconductor device and manufacture thereof
02/09/2000CN1244040A Channel capacitor with epitaxial cover layer
02/09/2000CN1244039A Semiconductor circuits and manufacture thereof
02/09/2000CN1244037A Manufacture of semiconductor device
02/09/2000CN1244036A Device and method for forming controllable isolating layer on top of deep channel
02/09/2000CN1244035A High-temp dynamic ageing device for integrated circuits
02/09/2000CN1244034A Semiconductor device and manufacture thereof, electric circuit board and electronic device therefor
02/09/2000CN1244033A Method for polishing surface of copper boased material mechanically and chemically
02/09/2000CN1244032A Method for forming dielectric layer
02/09/2000CN1244031A Method and apparatus for manufacturing semiconductor layers, and manufacture of photovoltaic solar cell
02/09/2000CN1244030A Phase-shift mask and manufacture thereof
02/09/2000CN1244028A Semiconductor device and manufacture thereof, substrate, electric circuit board and electronic device for manufacturing same
02/09/2000CN1244027A Method for transferring miniature machined block including integrated circuits
02/09/2000CN1244017A Non-volatile magnetic memory unit and component
02/09/2000CN1243948A Method for nondestructively measuring doped concentration and distribution of drift zone of semiconductor device
02/09/2000CN1243856A Chemicomechanical grinding composition for manufacturing semiconductor
02/09/2000CN1049300C Method for the fabrication of a semicodnuctor device
02/09/2000CN1049299C Method for forming contact holes in semiconductor device
02/08/2000US6023666 In-line method of monitoring die attach material adhesive weight
02/08/2000US6023555 Radiant heating apparatus and method
02/08/2000US6023424 Nonvolatile semiconductor memory device having verify function
02/08/2000US6023423 Nonvolatile semiconductor memory device
02/08/2000US6023407 Structure for a thin film multilayer capacitor
02/08/2000US6023405 Electrostatic chuck with improved erosion resistance
02/08/2000US6023338 Overlay alignment measurement of wafers
02/08/2000US6023336 Technique for automated alignment of semiconductor chips
02/08/2000US6023327 System and method for detecting defects in an interlayer dielectric of a semiconductor device
02/08/2000US6023321 Projection exposure apparatus and method
02/08/2000US6023320 Scanning exposure apparatus with surface position detecting system
02/08/2000US6023103 Chip-scale carrier for semiconductor devices including mounted spring contacts
02/08/2000US6023102 Low resistance contact between circuit metal levels
02/08/2000US6023101 Semiconductor device and method for manufacturing the same
02/08/2000US6023100 Metallization stack structure to improve electromigration resistance and keep low resistivity of ULSI interconnects
02/08/2000US6023099 Semiconductor integrated circuit device with dummy pattern for equalizing thickness of inter-level insulating structure
02/08/2000US6023096 Semiconductor device having metal foil integral with sealing resin
02/08/2000US6023095 Semiconductor device and manufacture method thereof
02/08/2000US6023094 Semiconductor wafer having a bottom surface protective coating
02/08/2000US6023093 Deuterated direlectric and polysilicon film-based semiconductor devices and method of manufacture thereof
02/08/2000US6023091 Semiconductor heater and method for making
02/08/2000US6023089 Semiconductor memory device having a SOI structure
02/08/2000US6023088 Semiconductor device formed on an insulator and having a damaged portion at the interface between the insulator and the active layer
02/08/2000US6023087 Thin film transistor having an insulating membrane layer on a portion of its active layer
02/08/2000US6023085 Core cell structure and corresponding process for NAND-type high performance flash memory device
02/08/2000US6023084 Semiconductor integrated circuit device including a memory device having memory cells with increased information storage capacitance and method of manufacturing same
02/08/2000US6023083 Semiconductor device having a conductor pattern side face provided with a separate conductive sidewall
02/08/2000US6023082 Strain-based control of crystal anisotropy for perovskite oxides on semiconductor-based material
02/08/2000US6023081 Semiconductor image sensor
02/08/2000US6023080 Input/output connection structure of a semiconductor device
02/08/2000US6023079 Multilayer
02/08/2000US6023075 Electro-optical device and method for manufacturing the same
02/08/2000US6023067 Blanking system for electron beam projection system
02/08/2000US6023041 Method for using photoabsorptive coatings and consumable copper to control exit via redeposit as well as diameter variance
02/08/2000US6023039 Method of cleaving a brittle material using a point heat source for providing a thermal stress
02/08/2000US6023038 Resistive heating of powered coil to reduce transient heating/start up effects multiple loadlock system
02/08/2000US6022815 Method of fabricating next-to-minimum-size transistor gate using mask-edge gate definition technique
02/08/2000US6022814 Coating a polysiloxane/silsesquioxane on the substrate; heating to a temperature ranging from 250.degree. c. to the glass transition point of the polymer; dielectric film of low density and a large free volume; heat resistance
02/08/2000US6022813 Method and apparatus for manufacturing semiconductor devices
02/08/2000US6022812 Dielectric polysilicate films by vapor deposition of tetra-alkoxysilane(s) on a substrate; exposing to water and acid or base catalyst to gel; drying; high porosity; low dielectric constant; semiconductors; integrated circuits
02/08/2000US6022811 Method of uniform CVD
02/08/2000US6022810 Method of manufacturing semiconductor device
02/08/2000US6022809 Silicon dioxide
02/08/2000US6022808 Filling hole with copper containing dope; annealing to diffuse dope
02/08/2000US6022807 Method for fabricating an integrated circuit
02/08/2000US6022806 Supplying process gases; vapor deposition; rotating wafer
02/08/2000US6022805 Method of fabricating semiconductor device with a multi-layered interconnection structure having a low contact resistance
02/08/2000US6022804 Semiconductor device and its manufacturing method
02/08/2000US6022803 Forming metal film; second film containing platinum in determined pattern by lift-off method; forming photoresis;forming gold plate film; etching; u-shaped gold lines
02/08/2000US6022802 Low dielectric constant intermetal dielectric (IMD) by formation of air gap between metal lines
02/08/2000US6022801 Method for forming an atomically flat interface for a highly disordered metal-silicon barrier film
02/08/2000US6022800 Method of forming barrier layer for tungsten plugs in interlayer dielectrics
02/08/2000US6022799 Low pressure vapor deposition of silicon oxynitride
02/08/2000US6022798 Method of forming an interconnect using thin films of Ti and TiN
02/08/2000US6022797 Method of manufacturing through holes in a semiconductor device
02/08/2000US6022796 Geometrical control of device corner threshold
02/08/2000US6022795 Sputtering titanium nitride; annealing; forming silicide
02/08/2000US6022794 Method of manufacturing a buried contact in a static random access memory
02/08/2000US6022793 Thermal annealing; forming nucleation defects; overcoating with epitaxial layer
02/08/2000US6022792 Semiconductor dicing and assembling method
02/08/2000US6022791 Chip crack stop
02/08/2000US6022790 Semiconductor process integration of a guard ring structure
02/08/2000US6022789 Method of selective oxidation
02/08/2000US6022788 Method of forming an integrated circuit having spacer after shallow trench fill and integrated circuit formed thereby
02/08/2000US6022786 Method for manufacturing a capacitor for a semiconductor arrangement
02/08/2000US6022785 Method of fabricating a metal-oxide-semiconductor transistor
02/08/2000US6022784 Method for manufacturing a semiconductor device
02/08/2000US6022783 NMOS field effect transistors and methods of forming NMOS field effect transistors
02/08/2000US6022782 Method for forming integrated circuit transistors using sacrificial spacer
02/08/2000US6022781 Method for fabricating a MOSFET with raised STI isolation self-aligned to the gate stack
02/08/2000US6022780 Semiconductor device having source and drain regions different in depth from each other and process of fabrication thereof