Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2000
02/08/2000US6022779 Method of forming mask ROM
02/08/2000US6022778 Process for the manufacturing of integrated circuits comprising low-voltage and high-voltage DMOS-technology power devices and non-volatile memory cells
02/08/2000US6022777 Method of making semiconductor device
02/08/2000US6022776 Method of using silicon oxynitride to improve fabricating of DRAM contacts and landing pads
02/08/2000US6022775 High effective area capacitor for high density DRAM circuits using silicide agglomeration
02/08/2000US6022774 Forming conductor pattern on semiconductor;oxidation resistant overcoat, dielectrics
02/08/2000US6022773 Method of making a semiconductor device
02/08/2000US6022772 Stacked capacitor having a corrugated electrode
02/08/2000US6022771 Fabrication of semiconductor device having shallow junctions and sidewall spacers creating taper-shaped isolation where the source and drain regions meet the gate regions
02/08/2000US6022770 NVRAM utilizing high voltage TFT device and method for making the same
02/08/2000US6022769 Method of making self-aligned silicided MOS transistor with ESD protection improvement
02/08/2000US6022768 Method and mask structure for self-aligning ion implanting to form various device structures
02/08/2000US6022767 Semiconductor device with insulated gate electrode and method of fabricating the same
02/08/2000US6022765 Semiconductor device having a SOI structure and a manufacturing method thereof
02/08/2000US6022764 Exposure apparatus and method for forming thin film transistor
02/08/2000US6022763 Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof
02/08/2000US6022762 Process for forming a morphological edge structure to seal integrated electronic devices
02/08/2000US6022761 Method for coupling substrates and structure
02/08/2000US6022758 Process for manufacturing solder leads on a semiconductor device package
02/08/2000US6022757 Semiconductor device and manufacturing method
02/08/2000US6022753 Manufacturing methods of liquid crystal displays
02/08/2000US6022751 Production of electronic device
02/08/2000US6022749 Using a superlattice to determine the temperature of a semiconductor fabrication process
02/08/2000US6022672 Method of manufacturing semiconductors having improved temperature control
02/08/2000US6022670 Hydrophobic photoimagable dielectric filmn in solvent;metallization
02/08/2000US6022669 Method of fabricating an integrated circuit using self-patterned thin films
02/08/2000US6022666 Blend of alkali-soluble hydroxy group containing polymer and cyano group-containing oximesulfonate
02/08/2000US6022650 Substrate box; photoresist layer; rotation
02/08/2000US6022645 Double-sided photomask
02/08/2000US6022625 Method for producing thick crack-free coatings from hydrogen silsesquioxane resin
02/08/2000US6022616 Adhesive composition with small particle size for microelectronic devices
02/08/2000US6022587 Prewafer reaction layer is deposited onto a susceptor placed in reaction chamber to form prewafer reaction layer coated susceptor prior to film deposition, deposition gas is fed into reaction chamber to flow over the prewafer to form film
02/08/2000US6022586 Supplying first film-forming gases into process chamber of vessel while heating the chamber so as to form a first pre-coating film on the inner surface of the process vessel, loading semiconductor wafer into chamber, coating
02/08/2000US6022583 Dispensing series of discrete, single-point droplets and series of continuous beads within an area bounded by a dam, the encapsulant material spreading out from droplets and continuous beads to form encapsulating layer over the wire
02/08/2000US6022485 Contacting surface of photoresist-free solid substrate with catalyst having patterns on support in presence of reactant to selectively remove material from those areas of said solid substrate threby transferring geometric pattern to substrate
02/08/2000US6022484 Semiconductor processor with wafer face protection
02/08/2000US6022465 For customizing electrode contact placement on a semiconductor wafer while depositing and/or removing a material on semiconductor wafer
02/08/2000US6022461 Sputtering apparatus
02/08/2000US6022460 Enhanced inductively coupled plasma reactor
02/08/2000US6022458 Method of production of a semiconductor substrate
02/08/2000US6022457 Forming titanium layer on silicon substrate, forming silicon layer and cobalt layer; performing thermal treatment to form cobalt silicide layer
02/08/2000US6022446 Shallow magnetic fields for generating circulating electrons to enhance plasma processing
02/08/2000US6022426 Controlled oxygen content copper clad laminate,
02/08/2000US6022418 Vacuum processing method
02/08/2000US6022417 Support for wafer-shaped objects, in particular silicon wafers
02/08/2000US6022415 Spherical article conveying atmosphere replacing device
02/08/2000US6022414 Single body injector and method for delivering gases to a surface
02/08/2000US6022412 Epitaxial reactor, susceptor and gas-flow system
02/08/2000US6022410 Molecular beam epitaxy chamber
02/08/2000US6022225 Electrical assembly
02/08/2000US6022185 Substrate transferring device
02/08/2000US6022142 Monitor of process temperature and formation of alloy
02/08/2000US6022095 Curable compositions
02/08/2000US6022052 Quartz tank for wet semiconductor wafer processing
02/08/2000US6021991 Active anti-vibration apparatus
02/08/2000US6021904 Chip carrier processing and shipping array and method of manufacture thereof
02/08/2000US6021806 Slurry distribution system for a CMP process in semiconductor device fabrication
02/08/2000US6021791 Method and apparatus for immersion cleaning of semiconductor devices
02/08/2000US6021790 Substrate treating apparatus and method for treating substrate
02/08/2000US6021789 Wafer cleaning system with progressive megasonic wave
02/08/2000US6021786 Rinsing a wafer; rotating drying
02/08/2000US6021785 Procedure and device for cleaning disk-shaped objects in particular wafers by sonification with water as rinsing medium
02/08/2000US6021772 Bandsaw and process for cutting off slices from a workpiece
02/08/2000US6021696 Slicing method for adjusting a force applied to an object
02/08/2000US6021564 Method for reducing via inductance in an electronic assembly and article
02/08/2000CA2153774C Particle detection system with reflective line-to-spot collector
02/03/2000WO2000005816A1 High-speed current switch with complementary stages
02/03/2000WO2000005773A1 Integrated circuit interconnect lines having sidewall layers
02/03/2000WO2000005772A1 Method and device for processing a flat workpiece, especially a semiconductor wafer
02/03/2000WO2000005770A1 Method for double-sided patterning of high temperature superconducting circuits
02/03/2000WO2000005768A1 J-fet semiconductor device
02/03/2000WO2000005767A1 Semiconductor device and method for fabricating the same
02/03/2000WO2000005765A1 Method for producing rewiring substrates for semiconductor chip packages
02/03/2000WO2000005763A1 Method of producing an interconnect structure for an integrated circuit
02/03/2000WO2000005762A1 Transfer arm
02/03/2000WO2000005761A1 Wafer holding hand
02/03/2000WO2000005760A1 Detection of nontransient processing anomalies in vacuum manufacturing process
02/03/2000WO2000005759A1 Method for measuring number of yield loss chips and number of poor chips by type due to defect of semiconductor chips
02/03/2000WO2000005758A1 Electronic component and method for the production thereof
02/03/2000WO2000005757A1 Low temperature process for fabricating layered superlattice materials and making electronic devices including same
02/03/2000WO2000005756A1 Method of etching doped silicon dioxide with selectivity to undoped silicon dioxide with a high density plasma etcher
02/03/2000WO2000005755A1 Method of forming a laterally-varying charge profile in a silicon carbide substrate
02/03/2000WO2000005754A1 Semiconductor thin film and thin film device
02/03/2000WO2000005753A1 Infra-red transparent thermal reactor cover member
02/03/2000WO2000005752A1 Method and apparatus for processing wafers
02/03/2000WO2000005751A1 Method and apparatus for reducing contamination of a substrate in a substrate processing system
02/03/2000WO2000005750A1 Improved substrate support member
02/03/2000WO2000005749A2 Method and apparatus for anisotropic etching
02/03/2000WO2000005748A2 Blind pin placement on circuit boards
02/03/2000WO2000005747A2 Metallization structures for microelectronic applications and process for forming the structures
02/03/2000WO2000005745A1 Physical vapor processing of a surface with non-uniformity compensation
02/03/2000WO2000005722A1 Resistive ferroelectric storage cell
02/03/2000WO2000005721A1 Storage assembly consisting of resistive ferroelectric storage cells
02/03/2000WO2000005720A1 Ferroelectric storage assembly
02/03/2000WO2000005719A1 Storage assembly comprised of a plurality of resistive ferroelectric storage cells
02/03/2000WO2000005431A1 Cvd apparatus
02/03/2000WO2000005430A1 Chemical vapor deposition vaporizer
02/03/2000WO2000005297A1 Method of producing porous calcined polyimide
02/03/2000WO2000005282A1 Water soluble positive-working photoresist composition
02/03/2000WO1999065081A3 Semiconductor arrangement with ohmic contact and a method for contacting a semiconductor arrangement