Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2000
02/17/2000DE19937214A1 MOST contact structure, especially a gate contact structure, is produced using an etch-stop layer to protect the gate and adjacent side wall spacer during contact opening etching
02/17/2000DE19935947A1 Multilevel interconnection of a ferroelectric memory device formation method, produces interconnections of same material as ferroelectric capacitor electrodes
02/17/2000DE19935825A1 Electronic device e.g. semiconductor integrated circuit or surface acoustic wave device
02/17/2000DE19929278A1 Negative hydrogen ion beam injection method on substrate
02/17/2000DE19915899A1 Production of a semiconductor device used in the manufacture of LSI semiconductors and liquid crystal displays comprises a multistep process forming a hyperfine pattern on the semiconductor base component
02/17/2000DE19914231A1 Semiconductor device, especially a DRAM cell, has a hydrofluoric acid resistant side wall film on a contact hole extending through an element isolation region to a doped substrate region
02/17/2000DE19913554A1 Manufacturing semiconductor component with barrier layer which is made of titanium, titanium nitride etc. to prevent oxidation of tungsten plug
02/17/2000DE19837490A1 Method to measure two-dimensional potential distribution in CMOS semiconductor element and determine two-dimensional doping distribution, uses electron holography to measure phase of electron wave in transmission electron microscope
02/17/2000DE19835616A1 Method to localize and determine local density of gate oxide defects in metal insulator semiconductor capacitor; provides mapping of gate oxide integrity defect density
02/17/2000DE19835263A1 Integrierte Schaltung mit durch Energieeinwirkung auftrennbaren elektrischen Verbindungstellen Integrated circuit with separable exposure to energy electrical joints
02/17/2000DE19834265A1 Verfahren zur Herstellung von Aerogelen und Anlage zur Herstellung von Aerogelschichten auf Substraten oder aus Aerogelen bestehenden Produkten A process for the preparation of aerogels and plant for the production of airgel on substrates or of aerogels existing products
02/17/2000CA2339359A1 Workpiece vibration damper
02/16/2000EP0980198A1 Detachable tool for making electrically conductive bumps on electronic components
02/16/2000EP0980101A2 Semiconductor integrated circuit and method for manufacturing the same
02/16/2000EP0980100A2 Trench capacitor for integrated circuit
02/16/2000EP0980097A2 Dispersion containing Cu ultrafine particles individually dispersed therein
02/16/2000EP0980096A1 Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device
02/16/2000EP0980095A1 Modular high frequency integrated circuit structure
02/16/2000EP0980094A1 Method for forming Cu-thin film
02/16/2000EP0980093A2 Fabrication of conductivity enhanced MOS-gated semiconductor devices
02/16/2000EP0980092A1 Vacuum processing method and apparatus
02/16/2000EP0980091A2 A method for decreasing channel hot carrier degradation
02/16/2000EP0980088A1 Toroidal filament for plasma generation
02/16/2000EP0980075A1 A semiconductor memory device
02/16/2000EP0980074A1 Combined precharge and equalisation circuit
02/16/2000EP0980065A2 A system and method for a preamplifier write circuit with reduced rise/fall time
02/16/2000EP0979882A1 Method of manufacturing a nitride series III-V group compound semiconductor
02/16/2000EP0979854A1 Circuit connecting material, and structure and method of connecting circuit terminal
02/16/2000EP0979852A2 A dicing tape and a method of dicing a semiconductor wafer
02/16/2000EP0979800A1 Manufacturing of ready-for-use solutions
02/16/2000EP0979531A1 Silicon carbide field conrolled bipolar switch
02/16/2000EP0979530A2 Semiconductor switch devices and their manufacture
02/16/2000EP0979529A1 DESIGN AND FABRICATION OF ELECTRONIC DEVICES WITH InA1AsSb/A1Sb BARRIER
02/16/2000EP0979528A1 Method for making connection balls on electronic circuits or components
02/16/2000EP0979527A2 Thin film transistors and electronic devices comprising such
02/16/2000EP0979414A1 Multi-probe test head
02/16/2000EP0847545B1 Process for improving the contrast in the structuring of 3-dimensional surfaces
02/16/2000CN1244948A Method and device for activating semiconductor impurities
02/16/2000CN1244832A Injection molding encapsulation for an electronic device directly onto a substrate
02/16/2000CN1244733A 低压有源半导体体器件 Low body active semiconductor devices
02/16/2000CN1244731A Semiconductor integrated circuit and its producing method
02/16/2000CN1244730A Semiconductor device and its producing method
02/16/2000CN1244729A Method and apparatus for isolating wet sensitive plastic ball grid array device
02/16/2000CN1244728A Soft and flexible surface layer of inverted packed sheet electronic packing piece
02/16/2000CN1244727A Method for forming self alignment contact
02/16/2000CN1244726A Rubber belt for cutting and method for cutting semiconductor chip
02/16/2000CN1244725A Method for regulating carrier life in semiconductor element
02/16/2000CN1244724A Crystal growth technology and semiconductor device and its producing method
02/16/2000CN1244723A Method for producing semiconductor device and semiconductor device
02/16/2000CN1244598A Method for preparing film by using atom layer deposition
02/16/2000CN1244561A Small graniness adhesive composition for micro electronic device
02/16/2000CN1244513A Alumina sintered body and its producing method
02/15/2000US6026228 Integrated circuit design method, database apparatus for designing integrated circuit and integrated circuit design support apparatus
02/15/2000US6026226 Local compilation in context within a design hierarchy
02/15/2000US6026225 Method of layout of semiconductor integrated circuits
02/15/2000US6026222 System for combinational equivalence checking
02/15/2000US6026049 Semiconductor memory with sensing stability
02/15/2000US6026043 Semiconductor memory device with reduced power consumption and stable operation in data holding state
02/15/2000US6026039 Parallel test circuit for semiconductor memory
02/15/2000US6026038 Wafer burn-in test circuit and method for testing a semiconductor memory
02/15/2000US6026028 Hot carrier injection programming and negative gate voltage channel erase flash EEPROM structure
02/15/2000US6026020 Data line disturbance free memory block divided flash memory and microcomputer having flash memory therein
02/15/2000US6026019 Two square NVRAM cell
02/15/2000US6026017 Compact nonvolatile memory
02/15/2000US6026010 Semiconductor memory device with bit line contact areas and storage capacitor contact areas
02/15/2000US6025995 Integrated circuit module and method
02/15/2000US6025938 Beam homogenizer
02/15/2000US6025748 Precharge device for semiconductor integrated circuit device
02/15/2000US6025740 Clock feeding circuit and method for adjusting clock skew
02/15/2000US6025733 Semiconductor memory device
02/15/2000US6025729 Floating spring probe wireless test fixture
02/15/2000US6025708 System for verifying signal voltage level accuracy on a digital testing device
02/15/2000US6025688 Alignment apparatus
02/15/2000US6025658 Linear motor, and stage apparatus and exposure apparatus using the same
02/15/2000US6025652 Semiconductor device and method of producing same
02/15/2000US6025651 Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads
02/15/2000US6025650 Semiconductor device including a frame terminal
02/15/2000US6025647 Apparatus for equalizing signal parameters in flip chip redistribution layers
02/15/2000US6025646 Vertical MOSFET having penetrating wiring layers
02/15/2000US6025645 Semiconductor device and method of manufacturing the same
02/15/2000US6025642 Ultra high density integrated circuit packages
02/15/2000US6025641 Tape automated bonding (tab) tapes having underlying camber suppressing films to inhibit warping
02/15/2000US6025640 Resin-sealed semiconductor device, circuit member for use therein and method of manufacturing resin-sealed semiconductor device
02/15/2000US6025639 Crack stops
02/15/2000US6025638 Structure for precision multichip assembly
02/15/2000US6025637 Spacer-based antifuse structure for low capacitance and high reliability and method of fabrication thereof
02/15/2000US6025635 Short channel transistor having resistive gate extensions
02/15/2000US6025634 Integrated circuit having formed therein low contact leakage and low contact resistance integrated circuit device electrode
02/15/2000US6025633 Multi-level transistor fabrication method having an inverted, upper level transistor which shares a gate conductor with a non-inverted, lower level transistor
02/15/2000US6025632 Semiconductor integrated circuit with tungston silicide nitride thermal resistor
02/15/2000US6025630 Insulating film formed using an organic silane and method of producing semiconductor device
02/15/2000US6025629 Element isolation structure of a semiconductor device to suppress reduction in threshold voltage of parasitic MOS transistor
02/15/2000US6025628 High breakdown voltage twin well device with source/drain regions widely spaced from fox regions
02/15/2000US6025627 Alternate method and structure for improved floating gate tunneling devices
02/15/2000US6025626 Nonvolatile memory cell
02/15/2000US6025624 Shared length cell for improved capacitance
02/15/2000US6025623 Semiconductor device with high integration density and improved performance
02/15/2000US6025621 Integrated circuit memory devices having independently biased sub-well regions therein and methods of forming same
02/15/2000US6025620 Semiconductor device and method of producing the same
02/15/2000US6025619 Thin films of ABO3 with excess A-site and B-site modifiers and method of fabricating integrated circuits with same