Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2000
02/01/2000US6020222 Silicon oxide insulator (SOI) semiconductor having selectively linked body
02/01/2000US6020220 Compliant semiconductor chip assemblies and methods of making same
02/01/2000US6020219 Method of packaging fragile devices with a gel medium confined by a rim member
02/01/2000US6020218 Method of manufacturing ball grid array semiconductor package
02/01/2000US6020217 Multilayer packages with electricity connections via terminal posts
02/01/2000US6020214 Method for manufacturing thin film transistor array substrate
02/01/2000US6020111 Method of manufacturing semiconductor device with patterned lamination of Si film and metal film
02/01/2000US6020107 Exposure photoresist to light; heating
02/01/2000US6020104 Radiation-sensitive resin composition utilizing monooxymonocarboxylic acid ester solvent
02/01/2000US6020092 Partial one-shot electron beam exposure mask and method of forming a partial one-shot electron beam exposure pattern
02/01/2000US6020091 Pad stack; phosphorus doped silica glass
02/01/2000US6020059 Multilayer anisotropic electroconductive adhesive and method for manufacturing same
02/01/2000US6020048 Thick film circuit board and method of forming wire bonding electrode thereon
02/01/2000US6020035 Film to tie up loose fluorine in the chamber after a clean process
02/01/2000US6020024 Nitrided layer prevents the formation of an oxide at the substrate interface and has a dielectric constant greater than 3.9.
02/01/2000US6019932 Method of sealing electronic parts with a resin
02/01/2000US6019906 Microelectronics fabrication.
02/01/2000US6019883 Process for producing a deposit on a removable support
02/01/2000US6019850 Apparatus for making a semiconductor device in a continuous manner
02/01/2000US6019849 A number of air actuated valves are added to a conventional apparatus for treating semiconductor wafers with hexamethyldisilazane vapor to improve the adhesion between the wafers and resist layers.
02/01/2000US6019848 Lid assembly for high temperature processing chamber
02/01/2000US6019847 Apparatus for applying pressure to a coated surface of a workpiece
02/01/2000US6019844 Acoustic wave enhanced spin coater
02/01/2000US6019843 Apparatus for coating a semiconductor wafer with a photoresist
02/01/2000US6019842 Method and apparatus for loading raw material into a quartz crucible
02/01/2000US6019839 Method and apparatus for forming an epitaxial titanium silicide film by low pressure chemical vapor deposition
02/01/2000US6019837 Detecting method of impurity concentration in crystal, method for producing single crystal and apparatus for the pull-up of a single crystal
02/01/2000US6019816 Systems and methods for removing residue from process gases exhausted from microelectronic device fabrication processes
02/01/2000US6019806 High selectivity slurry for shallow trench isolation processing
02/01/2000US6019796 Method of manufacturing a thin film transistor with reduced parasitic capacitance and reduced feed-through voltage
02/01/2000US6019671 Carrier head for a chemical/mechanical polishing apparatus and method of polishing
02/01/2000US6019588 Moulding apparatus with compensation element
02/01/2000US6019563 Automated guided vehicle
02/01/2000US6019274 Semiconductor device and mounting method therefor
02/01/2000US6019250 Liquid dispensing apparatus and method
02/01/2000US6019231 Holding cassette for precision substrates and method for the preparation thereof
02/01/2000US6019166 Pickup chuck with an integral heatsink
02/01/2000US6019164 Workpiece chuck
02/01/2000US6019008 Linear motion apparatus under ultra high vacuum
02/01/2000US6018884 Air blow apparatus for a semiconductor wafer
01/2000
01/29/2000CA2278963A1 Method and apparatus for diffusing zinc into groups iii-v compound semiconductor crystals
01/27/2000WO2000004592A1 Fabricating an mtj with low areal resistance
01/27/2000WO2000004587A2 Nitride based transistors on semi-insulating silicon carbide substrates
01/27/2000WO2000004586A1 Rare-earth electrical contacts for semiconductor devices
01/27/2000WO2000004581A1 Passivation layer for power semiconductors with pn junctions appearing on the surface
01/27/2000WO2000004579A1 Process for mapping metal contaminant concentration on a silicon wafer surface
01/27/2000WO2000004578A1 Method for transferring solder to a device and/or testing the device
01/27/2000WO2000004577A1 Method for producing a ceramic body having an integrated passive electronic component, such a body and use of same
01/27/2000WO2000004576A1 Method and apparatus for plasma processing
01/27/2000WO2000004575A2 Collimated sputtering of semiconductor and other films
01/27/2000WO2000004574A1 Improved gate electrode connection structure by in situ chemical vapor deposition of tungsten and tungsten nitride
01/27/2000WO2000004573A1 Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating
01/27/2000WO2000004572A1 Method for manufacturing thin film semiconductor device, method for manufacturing display, method for manufacturing thin film transistor, and method for forming semiconductor thin film
01/27/2000WO2000004571A1 Method for patterning cavities and enhanced cavity shapes for semiconductor devices
01/27/2000WO2000004570A2 Workpiece chuck
01/27/2000WO2000004555A2 Storage cell system in which an electric resistance of a storage element represents an information unit and can be influenced by a magnetic field, and method for producing same
01/27/2000WO2000004552A1 Low switching field magnetic tunneling junction usable for multi-state magnetic memory cell
01/27/2000WO2000004551A1 Mram with shared word and digit lines
01/27/2000WO2000004488A1 An automated wafer defect inspection system and a process of performing such inspection
01/27/2000WO2000004342A1 System comprising a plurality of sensor groups and method for determining the intactness of same
01/27/2000WO2000004263A1 Pod door to port door retention system
01/27/2000WO2000004213A1 Doping-independent self-cleaning etch process for polysilicon
01/27/2000WO2000004205A1 High throughput organometallic vapor phase epitaxy (omvpe) apparatus
01/27/2000WO2000004203A1 Sputtering target and part for thin film-forming apparatus
01/27/2000WO2000004202A1 Method for preparing high purity ruthenium sputtering target and high purity ruthenium sputtering target
01/27/2000WO2000004083A1 Crosslinkable elastomer composition, sealing material produced from the composition, and filler for use therein
01/27/2000WO2000003845A2 Device for the automated machining of workpieces
01/27/2000WO2000003837A1 Device for the automated tooling of works
01/27/2000WO2000003829A1 Solder ball placement apparatus
01/27/2000WO1999065061A3 A portable laser cleaning device for semiconductor packaging machines
01/27/2000WO1999063542B1 Radiation hardened six transistor random access memory and memory device
01/27/2000WO1999062108A3 Methods for forming self-planarized dielectric layer for shallow trench isolation
01/27/2000WO1999056106A9 Chemical-mechanical-planarization (cmp) slurry quality control process and particle size distribution measuring systems
01/27/2000WO1999045167A8 Method of depositing silicon with high step coverage
01/27/2000DE19934049A1 Multi-column lithography system using charged particle radiation-like electron rays has control unit for adjusting waiting time for each intensifier connected to main deflectors
01/27/2000DE19933480A1 Dynamic random access memory (DRAM) cell capacitor production
01/27/2000DE19932399A1 Encapsulation of semiconductor device using an encapsulation material containing quartz ware filler
01/27/2000DE19932014A1 Pattern data correction controller for one column of a multi-column electron beam exposure apparatus used for e.g. pattering a semiconductor wafer
01/27/2000DE19833756A1 Anordnung zur Herstellung vertikaler Strukturen in Halbleitermaterialien Arrangement for producing vertical structures in semiconductor materials
01/27/2000DE19833512A1 Aktives Hochfrequenzsteuerelement High frequency active control
01/27/2000DE19833315A1 Thin film structure, e.g. a thin film transistor structure for an active matrix LCD, is produced by thermally flowing a photosensitive masking layer over under-etched layer flanks prior to etching an underlying layer
01/27/2000DE19833039A1 Opto-electronic components encapsulated in transparent plastic to make e.g. displays, are rear-injected individually through holes in substrate to prevent undesirable segment cross-illumination
01/27/2000DE19832994A1 Ferroelectric memory arrangement
01/27/2000DE19826583A1 Method for measuring gaseous chemical constituents in process reactor serving for treatment of electrical components, measurements taking place in situ by means of at least one residual gas analysis unit communicating with process chamber
01/27/2000CA2341899A1 Solder ball placement apparatus
01/27/2000CA2334823A1 Nitride based transistors on semi-insulating silicon carbide substrates
01/27/2000CA2334349A1 High throughput organometallic vapor phase epitaxy (omvpe) apparatus
01/26/2000EP0975093A1 Integrated circuit with variable capacitor
01/26/2000EP0975024A2 Semiconductor device with alternating conductivity type layer and method of manufacturing the same
01/26/2000EP0975023A1 Electrostatic discharge protection for salicided devices and method of making same
01/26/2000EP0975022A1 Method for manufacturing electronic devices comprising non-volatile memory cells and LV transistors, with salicided junctions
01/26/2000EP0975020A1 Method for manufacturing electronic devices comprising HV transistors and LV transistors, with salicided junctions
01/26/2000EP0975019A2 Chip mounting board and method of measuring it
01/26/2000EP0975018A1 Method of forming a capacitor within an integrated circuit
01/26/2000EP0975017A2 Silicon oxynitride cap for fluorinated silicate glass film in intermetal dielectric semiconductor fabrication
01/26/2000EP0975016A1 Wafer flattening process and system
01/26/2000EP0975015A1 Wafer cleaning equipment and tray for use in wafer cleaning equipment
01/26/2000EP0975014A1 Enhanced CVD copper adhesion by two-step deposition process
01/26/2000EP0975013A2 Method of manufacturing an oxide layer on a GaAs-based semiconductor body
01/26/2000EP0975012A2 Porous silicon with uniform pore size distribution