| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/29/2000 | US6030510 Hot reflow sputtering method and apparatus |
| 02/29/2000 | US6030491 Use of beta-diketonate-containing compounds in processing e.g., planarizing, polishing, cleaning substrates, such as semiconductor-based substrates, as well as processing equipment |
| 02/29/2000 | US6030489 Apparatus for controlling etch rate when using consumable electrodes during plasma etching |
| 02/29/2000 | US6030488 Chemical and mechanical polishing apparatus |
| 02/29/2000 | US6030487 Wafer carrier assembly |
| 02/29/2000 | US6030486 Magnetically confined plasma reactor for processing a semiconductor wafer |
| 02/29/2000 | US6030485 Method and apparatus for manufacturing a semiconductor device |
| 02/29/2000 | US6030461 Portable cooling system for use with a semiconductor fabrication system |
| 02/29/2000 | US6030460 Chemical vapor deposition reactor having a support for substrate, and at least one inlet port, a source of ozone gas, a source of organometallic compound, a source of ultraviolet radiation |
| 02/29/2000 | US6030459 Low-pressure processing device |
| 02/29/2000 | US6030457 Substrate processing apparatus |
| 02/29/2000 | US6030456 Installation to supply gas |
| 02/29/2000 | US6030455 Substrate holder |
| 02/29/2000 | US6030453 Forming gallium oxide layer on the surface of the wafer structure by thermally evaporating gallium oxide molecules from crystalline, high purity gallium oxide evaporation source onto surface of wafer |
| 02/29/2000 | US6030452 Planarized growth of III-V compound |
| 02/29/2000 | US6030450 Method of fabricating a silicon single crystal |
| 02/29/2000 | US6030425 Slurry for chemical-mechanical polishing comprising high ph solution with particles of catalyst for accelerating polishing rate; catalyst is metal selected from platinum, silver, palladium, copper, rhodium, nickel, and iron |
| 02/29/2000 | US6030266 Process and apparatus for the formation of patterns in a photoresist by continuous laser irradiation, application to the production of microtips emissive cathode electron sources and flat display screens |
| 02/29/2000 | US6030265 Method of manufacturing liquid crystal display device |
| 02/29/2000 | US6030208 Thermal processor |
| 02/29/2000 | US6030197 Insert pin used in an insert molding apparatus |
| 02/29/2000 | US6030013 Method and apparatus for contactless capturing and handling of spherical-shaped objects |
| 02/29/2000 | US6029963 Semiconductor memory device having novel layout pattern |
| 02/29/2000 | US6029882 Plastic solder array using injection molded solder |
| 02/29/2000 | US6029881 Micro-scale part positioning by surface interlocking |
| 02/29/2000 | US6029730 Hot shear apparatus and method for removing a semiconductor chip from an existing package |
| 02/29/2000 | US6029680 Method for in situ removal of particulate residues resulting from cleaning treatments |
| 02/29/2000 | US6029602 Apparatus and method for efficient and compact remote microwave plasma generation |
| 02/29/2000 | US6029427 Method and apparatus for handling semiconductor chips |
| 02/29/2000 | US6029371 Drying treatment method and apparatus |
| 02/29/2000 | US6029369 Methods for spin drying a workpiece |
| 02/29/2000 | US6029344 Composite interconnection element for microelectronic components, and method of making same |
| 02/29/2000 | CA2117119C Method and structure for electronically measuring beam parameters |
| 02/28/2000 | CA2246087A1 Method of cleaving a semiconductor wafer |
| 02/28/2000 | CA2246084A1 Method of patterning semiconductor materials and other brittle materials |
| 02/24/2000 | WO2000010370A1 A flexible circuit with conductive vias and a method of making |
| 02/24/2000 | WO2000010369A1 Method of forming solder bump, method of mounting electronic device, and mounting structure of electronic device |
| 02/24/2000 | WO2000010242A1 Compact planar motor having multiple degrees of freedom |
| 02/24/2000 | WO2000010204A1 Trench-gate semiconductor device |
| 02/24/2000 | WO2000010202A1 Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristics |
| 02/24/2000 | WO2000010201A1 Process for metal gettering in soi substrates |
| 02/24/2000 | WO2000010200A1 Wafer plating method and apparatus |
| 02/24/2000 | WO2000010199A1 Low capacitance dielectric layer etching using hydrogen-nitrogen plasma |
| 02/24/2000 | WO2000010198A1 Method of selectively forming silicide |
| 02/24/2000 | WO2000010197A1 Integrated circuit trenched features and method of producing same |
| 02/24/2000 | WO2000010196A1 Manufacture of electronic devices comprising thin-film circuit elements |
| 02/24/2000 | WO2000010195A2 Preparation of metal-precipitates permeable insulator for soi substrate |
| 02/24/2000 | WO2000010178A1 Magnetoresistive element and the use thereof as storage element in a storage cell array |
| 02/24/2000 | WO2000010172A2 Storage cell array and corresponding production method |
| 02/24/2000 | WO2000010171A1 On-chip word line voltage generation for dram embedded in logic process |
| 02/24/2000 | WO2000010058A1 Reaction force isolation system for a planar motor |
| 02/24/2000 | WO2000010024A1 Device comprising a first and a second ferromagnetic layer separated by a non-magnetic spacer layer |
| 02/24/2000 | WO2000010022A1 Magnetic field sensor with perpendicular to layer sensitivity, comprising a giant magnetoresistance material or a spin tunnel junction |
| 02/24/2000 | WO2000010020A1 Method for measuring two-dimensional potential distribution in cmos semiconductor components |
| 02/24/2000 | WO2000010019A1 Method and apparatus for minimizing semiconductor wafer arcing during semiconductor wafer processing |
| 02/24/2000 | WO2000009976A1 Tuning a substrate temperature measurement system |
| 02/24/2000 | WO2000009623A1 Adhesive for bonding circuit members, circuit board, and method of producing the same |
| 02/24/2000 | WO2000009429A1 Charging neutralizer for floating transportation device and floating transportation system |
| 02/24/2000 | WO2000003576A3 Process and apparatus for manufacturing semiconductor devices |
| 02/24/2000 | WO2000003467A3 Wafer carrier and method for handling of wafers with minimal contact |
| 02/24/2000 | WO2000003418A3 Intelligent wafer handling system and method |
| 02/24/2000 | WO2000002236A3 Radio frequency identification system and method for tracking silicon wafers |
| 02/24/2000 | WO1999059206A3 Semiconductor device and method for making the device |
| 02/24/2000 | WO1999057732A9 Lighting system, especially for extreme ultraviolet lithography |
| 02/24/2000 | WO1999054918A3 Manufacture of trench-gate semiconductor devices |
| 02/24/2000 | WO1999053539A9 Silicon-germanium etch stop layer system |
| 02/24/2000 | WO1999052144A9 Electrostatic chuck power supply |
| 02/24/2000 | WO1998048168A3 In situ getter pump system and method |
| 02/24/2000 | DE19939068A1 Method to test groups of electronic structural elements; involves using response output signal following input of test signal in integrated circuit to be tested with common test signal entered in electronic structural elements of group |
| 02/24/2000 | DE19938796A1 Light activated composition used to prepare chemically amplified photoresists, etc., includes a photoinitiator which will generate an acid when exposed to light at 240-390 nm |
| 02/24/2000 | DE19938142A1 Wafer container for semiconductor wafers, aluminum discs and glass mask substrates has opening with hermetically-sealing lid with guides assisting correct closure |
| 02/24/2000 | DE19937232A1 Development and evaluation system for integrated semiconductor circuits containing region for electronic development automization for developing large scale integration |
| 02/24/2000 | DE19930273A1 High speed system to evaluate patterns under test; has large scale integration test unit simulator to produce test pattern and compares desired pattern suitable for testing specimen with output signal of specimen triggered by test pattern |
| 02/24/2000 | DE19929215A1 Production of a Ball Grid Array semiconductor component used in the manufacture of a Quad Flat Package comprises using a Tape Automated Bonding (TAB) strip |
| 02/24/2000 | DE19912220A1 High density semiconductor memory device, especially an SOI-DRAM, is produced by embedding the capacitor in the insulator underneath an SOI wafer prior to forming the transistor |
| 02/24/2000 | DE19900179C1 Installation for etching substrates by high-density plasmas comprises a phase delay line causing the supply voltages at both ends of the inductively coupled plasma coil to be in counter-phase with one another |
| 02/24/2000 | DE19837946A1 Chip mounting carrier has a solder wettable face that is partly removed or patterned to match the die bonding pads |
| 02/24/2000 | DE19837944A1 Verfahren zur Fertigung eines Halbleiterbauelements A method of manufacturing a semiconductor device |
| 02/24/2000 | DE19837893A1 Semiconductor device production, especially MOSFET production for a DRAM, comprises forming an oxidized silicon interlayer on a tungsten silicide region side wall |
| 02/24/2000 | DE19837715A1 High dielectric constant, low dielectric loss ceramic material, used as a charge storage material for DRAMs, comprises a mixture of strontium titanate and lead-magnesium niobate |
| 02/24/2000 | DE19837041A1 Erzeugung von gebrauchsfertigen Lösungen Production of ready-made solutions |
| 02/24/2000 | DE19836831A1 Production of agent for polishing semiconductor wafers has a specific pH before use |
| 02/24/2000 | DE19836567A1 Memory cell structure with magneto-resistive memory elements comprises a magnetizable yoke surrounding one of the intersecting lines at a memory element location |
| 02/24/2000 | DE19836314A1 Heatsink attachment for semiconductor components, with cooler profiles extruded from special aluminum alloy has a bent semicircular shape |
| 02/24/2000 | DE19836233A1 High voltage lateral SOI-DMOS transistor for an IC has a drift space covered with a thin passivating silicon dioxide layer and overlying thicker silicon nitride and CVD oxide layers |
| 02/24/2000 | DE19832991A1 Speicheranordnung aus einer Vielzahl von resistiven ferroelektrischen Speicherzellen Memory arrangement comprising a multiplicity of resistive ferroelectric memory cells |
| 02/24/2000 | CA2340718A1 Method and apparatus for minimizing semiconductor wafer arcing during semiconductor wafer processing |
| 02/24/2000 | CA2338102A1 A flexible circuit with conductive vias and a method of making |
| 02/23/2000 | EP0981165A1 Thin film transistors |
| 02/23/2000 | EP0981164A2 Low resistance fill for deep trench capacitor |
| 02/23/2000 | EP0981163A1 Semiconductor power device with insulated circuit and process for its manufacture |
| 02/23/2000 | EP0981162A1 Semiconductor chip with surface cover against optical inspection of the circuit structure |
| 02/23/2000 | EP0981161A2 Semiconductor structure including a conductive fuse and process for fabrication thereof |
| 02/23/2000 | EP0981159A1 Method for making microconnections, micrelectronic system, and infrared sensor manufactured using the method |
| 02/23/2000 | EP0981158A2 Method of forming buried strap for trench capacitor |
| 02/23/2000 | EP0981157A2 Circuitry and method of forming the same |
| 02/23/2000 | EP0981156A2 Surface protective pressure-sensitive adhesive sheet for use in semiconductor wafer back grinding and method of use thereof |
| 02/23/2000 | EP0981155A2 Method for manufacturing a semiconductor isolation layer and semiconductor device comprising said semiconductor isolation layer |
| 02/23/2000 | EP0981153A2 Radiant heating apparatus and method |
| 02/23/2000 | EP0981152A2 High speed flip-chip dispensing |