Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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04/04/2000 | US6046792 Differential interferometer system and lithographic step-and-scan apparatus provided with such a system |
04/04/2000 | US6046627 Semiconductor device capable of operating stably with reduced power consumption |
04/04/2000 | US6046546 Stabilizer for switch-mode powered RF plasma |
04/04/2000 | US6046524 Elastic surface wave functional device and electronic circuit using the element |
04/04/2000 | US6046507 Electrophoretic coating methodology to improve internal package delamination and wire bond reliability |
04/04/2000 | US6046506 Semiconductor device with package |
04/04/2000 | US6046505 Method for forming a contact during the formation of a semiconductor device |
04/04/2000 | US6046503 Metalization system having an enhanced thermal conductivity |
04/04/2000 | US6046502 Semiconductor device with improved adhesion between titanium-based metal layer and insulation film |
04/04/2000 | US6046500 Method of controlling the spread of an adhesive on a circuitized organic substrate |
04/04/2000 | US6046495 Semiconductor device having a tab tape and a ground layer |
04/04/2000 | US6046494 High tensile nitride layer |
04/04/2000 | US6046493 Semiconductor device with special emitter connection |
04/04/2000 | US6046492 Semiconductor temperature sensor and the method of producing the same |
04/04/2000 | US6046491 Semiconductor resistor element having improved resistance tolerance and semiconductor device therefor |
04/04/2000 | US6046490 Semiconductor device having a capacitor dielectric element and wiring layers |
04/04/2000 | US6046489 Capacitor with high-dielectric-constant dielectric and thick electrode and fabrication method thereof |
04/04/2000 | US6046488 Semiconductor device having conductive layer and manufacturing method thereof |
04/04/2000 | US6046487 Shallow trench isolation with oxide-nitride/oxynitride liner |
04/04/2000 | US6046484 Gate structure of semiconductor memory |
04/04/2000 | US6046483 Planar isolation structure in an integrated circuit |
04/04/2000 | US6046482 Cell structure for mask ROM |
04/04/2000 | US6046479 Electronic devices comprising thin-film transistors |
04/04/2000 | US6046478 P-channel thin film transistor having a gate on the drain region of a field effect transistor |
04/04/2000 | US6046477 Dense SOI programmable logic array structure |
04/04/2000 | US6046476 SOI input protection circuit |
04/04/2000 | US6046474 Field effect transistors having tapered gate electrodes for providing high breakdown voltage capability and methods of forming same |
04/04/2000 | US6046473 Structure and process for reducing the on-resistance of MOS-gated power devices |
04/04/2000 | US6046472 Graded LDD implant process for sub-half-micron MOS devices |
04/04/2000 | US6046471 Ultra shallow junction depth transistors |
04/04/2000 | US6046469 Semiconductor storage device having a capacitor and a MOS transistor |
04/04/2000 | US6046468 Dynamic random access memory device and method for producing the same |
04/04/2000 | US6046467 Semiconductor device having capacitor |
04/04/2000 | US6046457 Charged particle beam apparatus having anticontamination means |
04/04/2000 | US6046439 System and method for thermal processing of a semiconductor substrate |
04/04/2000 | US6046435 Method of heating a substrate with multiple selectively deactuated heaters |
04/04/2000 | US6046429 Laser repair process for printed wiring boards |
04/04/2000 | US6046410 Interface structures for electronic devices |
04/04/2000 | US6046364 Regeneration of metal CVD precursors |
04/04/2000 | US6046117 Immersing wafer in etchant mixture of concentrated nitric and hydrofluoric acids to minimize loss of substrate material and extend etching bath life |
04/04/2000 | US6046116 Method for minimizing the critical dimension growth of a feature on a semiconductor wafer |
04/04/2000 | US6046115 Method for removing etching residues and contaminants |
04/04/2000 | US6046114 Method for producing a semiconductor device |
04/04/2000 | US6046113 Combined dry and wet etch for improved silicide formation |
04/04/2000 | US6046111 Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates |
04/04/2000 | US6046110 Copper-based metal polishing solution and method for manufacturing a semiconductor device |
04/04/2000 | US6046109 Creation of local semi-insulating regions on semiconductor substrates |
04/04/2000 | US6046108 Coating top dielectric layer and trench surfaces with barrier layer, overfilling trench with copper, thinning copper layer and passivating with silicon or germanium, polishing surface down to dielectric and leaving passivated copper in trench |
04/04/2000 | US6046107 Electroless copper employing hypophosphite as a reducing agent |
04/04/2000 | US6046106 High density plasma oxide gap filled patterned metal layers with improved electromigration resistance |
04/04/2000 | US6046105 Preferential lateral silicidation of gate with low source and drain silicon consumption |
04/04/2000 | US6046104 Low pressure baked HSQ gap fill layer following barrier layer deposition for high integrity borderless vias |
04/04/2000 | US6046103 Borderless contact process for a salicide devices |
04/04/2000 | US6046101 Passivation technology combining improved adhesion in passivation and a scribe street without passivation |
04/04/2000 | US6046100 Method of fabricating a fabricating plug and near-zero overlap interconnect line |
04/04/2000 | US6046099 Plug or via formation using novel slurries for chemical mechanical polishing |
04/04/2000 | US6046098 Process of forming metal silicide interconnects |
04/04/2000 | US6046097 Deposition method with improved step coverage |
04/04/2000 | US6046096 Method of fabricating a device including compound semiconductor crystal and method of fabricating a compound semiconductor layer structure |
04/04/2000 | US6046095 Semiconductor substrate having polysilicon layers and fabrication process of semiconductor device using the same |
04/04/2000 | US6046094 Method of forming wafer alignment patterns |
04/04/2000 | US6046093 Method of forming capacitors and related integrated circuitry |
04/04/2000 | US6046092 Method for manufacturing a capacitor |
04/04/2000 | US6046090 Process to fabricate ultra-short channel MOSFETS with self-aligned silicide contact |
04/04/2000 | US6046089 Selectively sized spacers |
04/04/2000 | US6046088 Method for self-aligning polysilicon gates with field isolation and the resultant structure |
04/04/2000 | US6046086 Method to improve the capacity of data retention and increase the coupling ratio of source to floating gate in split-gate flash |
04/04/2000 | US6046085 Elimination of poly stringers with straight poly profile |
04/04/2000 | US6046084 Isotropic etching of a hemispherical grain silicon layer to improve the quality of an overlying dielectric layer |
04/04/2000 | US6046083 Growth enhancement of hemispherical grain silicon on a doped polysilicon storage node capacitor structure, for dynamic random access memory applications |
04/04/2000 | US6046082 Method for manufacturing semiconductor device |
04/04/2000 | US6046081 Method for forming dielectric layer of capacitor |
04/04/2000 | US6046080 Overcoating polysilicon layer on a dielectric layer with silicon oxynitride, forming layout for load resistor by photolithography, etching to remove silicon oxynitride and polysilicon layers from areas other than load resistor layout |
04/04/2000 | US6046079 Method for prevention of latch-up of CMOS devices |
04/04/2000 | US6046078 Semiconductor device fabrication with reduced masking steps |
04/04/2000 | US6046077 Semiconductor device assembly method and semiconductor device produced by the method |
04/04/2000 | US6046076 Vacuum dispense method for dispensing an encapsulant and machine therefor |
04/04/2000 | US6046075 Oxide wire bond insulation in semiconductor assemblies |
04/04/2000 | US6046073 Process for producing very thin semiconductor chips |
04/04/2000 | US6046071 Plastic molded semiconductor package and method of manufacturing the same |
04/04/2000 | US6046070 Method of post-processing solid-state imaging device |
04/04/2000 | US6046068 Coating substrate surface with aluminum nitride passivating layer having pattern of openings, overcoating with metal, etching metal overlying passivating layer while leaving metal in openings to remain as separate contacts |
04/04/2000 | US6046067 Micromechanical device and method for its production |
04/04/2000 | US6046065 Crystal beam epitaxy to deposit a metamorphic semiconductor mirror layer material that can be crystallized lattice matched to gallium arsenide onto a laser structure wafer surface lattice matched to indium phosphide |
04/04/2000 | US6046064 Method for fabricating chemical semiconductor device |
04/04/2000 | US6046063 Simplification; increasing aperture ratio |
04/04/2000 | US6046062 Method to monitor the kink effect |
04/04/2000 | US6046061 Method of inspecting wafer water mark |
04/04/2000 | US6046060 Method of making a high planarity, low CTE base for semiconductor reliability screening |
04/04/2000 | US6046059 Bombarding the oxide present between plug and electrode with ions and mixing the oxide with materials of the electrode and the plug to increase electroconductivity between the electrode and the plug |
04/04/2000 | US6045981 Method of manufacturing semiconductor device |
04/04/2000 | US6045979 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material |
04/04/2000 | US6045978 Chemically treated photoresist for withstanding ion bombarded processing |
04/04/2000 | US6045972 Coating method using aqueous photopolymerizable compositions |
04/04/2000 | US6045968 Photosensitive composition |
04/04/2000 | US6045967 Method and device using ArF photoresist |
04/04/2000 | US6045892 Metal wiring structures for integrated circuits including seed layer |
04/04/2000 | US6045862 CVD film forming method in which a film formation preventing gas is supplied in a direction from a rear surface of an object to be processed |
04/04/2000 | US6045767 Charge for vertical boat growth process and use thereof |
04/04/2000 | US6045743 Enclosing resin-used electronic parts together with both an oxygen absorbent requiring no moisture for absorption of oxygen and a drying agent in a container having a gas barrier property and then sealing the container and removing oxygen |