Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2000
04/20/2000WO2000022205A1 Large-diameter high temperature stable semiconductor substrate wafer
04/20/2000WO2000022203A2 Production of bulk single crystals of aluminum nitride, silicon carbide and aluminum nitride:silicon carbide alloy
04/20/2000WO2000022202A1 p-TYPE ZnO SINGLE CRYSTAL AND METHOD FOR PRODUCING THE SAME
04/20/2000WO2000022198A1 Thermally annealed, low defect density single crystal silicon
04/20/2000WO2000022197A1 Epitaxial silicon wafers substantially free of grown-in defects
04/20/2000WO2000022193A2 Electrodeposition of metals in small recesses using modulated electric fields
04/20/2000WO2000022169A1 DETECTION USING Snz AND Sno GENES AND PROTEINS
04/20/2000WO2000021860A1 Magnetic hard disk transportation system
04/20/2000WO2000021721A1 Robot arm
04/20/2000WO2000021716A1 Sandblasting agent, wafer treated with the same, and method of treatment with the same
04/20/2000WO2000021715A2 Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
04/20/2000WO2000021714A1 A carrier head with a flexible membrane for chemical mechanical polishing
04/20/2000WO2000021692A1 Fast single-article megasonic cleaning process
04/20/2000WO2000004570A3 Workpiece chuck
04/20/2000WO2000004555A3 Storage cell system in which an electric resistance of a storage element represents an information unit and can be influenced by a magnetic field, and method for producing same
04/20/2000WO2000003845A3 Device for the automated machining of workpieces
04/20/2000WO1999067683A3 Optical system, especially a projection light facility for microlithography
04/20/2000DE19947015A1 Cutting and separating arcuate board into individual small parts, such as semiconductor chips, using cutting machine with clamping table
04/20/2000DE19946447A1 Particle-optical imaging system for lithographical purposes has lens arrangement with ring pre-electrode facing mask holder to form grid lens having negative refractive index with mask foil
04/20/2000DE19942484A1 Inspection procedure for exposure of pattern data, involves computing error corresponding to predicted value of pattern width
04/20/2000DE19932960A1 Chip card module manufacture comprises adhering leadframe set to surface of semiconductor wafer and electrically connecting to contact bumps before separation of individual chip card modules
04/20/2000DE19931886A1 Semiconductor wafer has dividing lines from which is formed semiconductor component
04/20/2000DE19911150C1 Microelectronic structure, especially semiconductor memory, production comprising physically etching a conductive layer from a substrate such that removed material is transferred onto a layer structure side wall
04/20/2000DE19904571C1 Three-dimensional IC, e.g. a DRAM cell array, is produced by electron beam passage through a substrate to locate an alignment structure in a bonded second substrate for mask alignment
04/20/2000DE19847368A1 Window etching through indium-gallium phosphide layer, especially emitter region of heterojunction bipolar transistor, e.g. for a high power microwave amplifier, involves using a silicon nitride mask
04/20/2000DE19847100A1 Contamination free comminution of semiconductor material, such as silicon, using liquid jet in manufacture of solar cells, memory components, and microprocessors.
04/20/2000DE19847098A1 Verfahren und Vorrichtung zur Bearbeitung von Halbleitermaterial Method and apparatus for processing semiconductor material
04/20/2000DE19846662A1 Electronic module used in the production of high density interconnects and quad flat pack packages has the assembly side of the wiring adhered to a hermetic housing
04/20/2000DE19846063A1 Verfahren zur Herstellung eines Double-Gate MOSFETs A method for producing a double-gate MOSFETs
04/20/2000DE19845665A1 Verfahren zur Herstellung eines Trägerelements für einen IC-Baustein zum Einbau in Chipkarten A process for producing a carrier element for an IC module for installation in smart card
04/20/2000DE19845607A1 Schlagfeste Epoxidharz-Zusammensetzungen Resistant epoxy resin compositions
04/20/2000DE19845504A1 Hordenaufnahmevorrichtung Horde recording device
04/20/2000DE19845374A1 Method to manufacture cooler for electric or electronic components with parallel, spaced cooling baffles
04/20/2000DE19845033A1 Halbleiterbauelement Semiconductor device
04/20/2000DE19843641A1 Grabenkondensator mit Isolationskragen und entsprechendes Herstellungsverfahren Grave capacitor insulation collar and manufacturing method thereof
04/20/2000DE19832084C1 Substrate transport device e.g. for handling CD's or DVD's, has curved transport path sections provided by pivot devices rotated about respective axes lying at spaced points along common line
04/20/2000DE19830512A1 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs
04/20/2000CA2346240A1 Electrostatic sensing chuck using area matched electrodes
04/20/2000CA2344826A1 Fabrication process for flex circuit applications
04/20/2000CA2314109A1 Electrodeposition of metals in small recesses using modulated electric fields
04/19/2000EP0994556A1 Semiconductor device including an integrated circuit for realizing a DC converter
04/19/2000EP0994515A2 Method of manufacturing silicon-based thin-film photoelectric conversion device
04/19/2000EP0994514A1 Method of manufacturing a semiconductor device by joining two substrates
04/19/2000EP0994513A1 A simplified process for defining the tunnel area in semiconductor non-volatile non-aligned memory cells
04/19/2000EP0994512A1 Simplified DPCC process for manufacturing FLOTOX EEPROM non-autoaligned semiconductor memory cells
04/19/2000EP0994511A1 Semiconductor device and manufacturing method of the same
04/19/2000EP0994508A1 Semiconductor device comprising bump contacts
04/19/2000EP0994507A2 Flip chip metallization for an electronic assembly
04/19/2000EP0994506A1 Method of making memory cell capacitor
04/19/2000EP0994505A2 Method of cleaning substrates
04/19/2000EP0994504A2 Surface preparation method and semiconductor device
04/19/2000EP0994503A1 Structure comprising a thin layer composed of material containing conductive and isolation regions and method for manufacturing the structure
04/19/2000EP0994502A2 Dynamic blending gas delivery system and method
04/19/2000EP0994501A2 Device for storing and commissioning workpieces, in particular disk-like worpieces such as wafers or the like
04/19/2000EP0994483A1 Apparatus and method for noise reduction in DRAM
04/19/2000EP0994440A1 Noncontact ic card
04/19/2000EP0994378A2 Proximity exposure method by oblique irradiation with light
04/19/2000EP0994328A2 Electronic parts checking apparatus
04/19/2000EP0994203A2 Dosimetry cup charge collection in plasma immersion ion implantation
04/19/2000EP0994118A2 Complex for the high dielectric film deposition and the method of deposition
04/19/2000EP0993953A2 Method for manufacturing ferroelectric thin film device, ink jet recording head, and ink jet printer
04/19/2000EP0993907A1 Work outer periphery polishing device
04/19/2000EP0993688A1 Power devices in wide bandgap semiconductor
04/19/2000EP0993686A1 Method and apparatus for inspection of pin grid array packages for bent leads
04/19/2000EP0993685A1 Methods and apparatus for improving microloading while etching a substrate
04/19/2000EP0993627A2 Device for transferring structures
04/19/2000EP0775367A4 Semiconductor device with integrated rc network and schottky diode
04/19/2000EP0738185A4 Spin-on-glass process with controlled environment
04/19/2000EP0695376B1 Magnetic roller gas gate employing transonic sweep gas flow
04/19/2000CN1251210A Photovoltaic element and method for mfg. same
04/19/2000CN1251207A Method for producing vertical MOS-transistor
04/19/2000CN1251206A Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor
04/19/2000CN1251142A Method and apparatus for mfg. thin film, thin film laminate, and electronic parts
04/19/2000CN1250973A Semiconductor device of integrated circuit having ac-dc voltage converter
04/19/2000CN1250951A Semiconductor device and its mfg. method
04/19/2000CN1250950A Method for making bottom storage node of stacked capacitor
04/19/2000CN1250948A Method for making integrated semiconductor device with nonvolatile floating grid memory and the device
04/19/2000CN1250947A Method for making dual-inlaid contact window
04/19/2000CN1250946A Method for makig fork-type lower electrode of capacitor
04/19/2000CN1250945A Semiconductor substrate and its mfg. method
04/19/2000CN1250944A Semiconductor substrate and its mfg. method
04/19/2000CN1250778A Novel monomer and its polymer used for anti-photoetching agent, and their compositions
04/19/2000CN1051645C Structure and mfg. method for chip of semiconductor diode and their main insulating casing
04/19/2000CN1051644C 半导体器件 Semiconductor devices
04/19/2000CN1051643C 功率集成电路 Power IC
04/19/2000CN1051642C Semiconductor device and method for mfg. same
04/19/2000CN1051641C Method for mfg. semiconductor
04/19/2000CN1051640C Semiconductor device and method for fabricating same
04/19/2000CN1051554C Metalorganic compounds
04/19/2000CN1051553C Preparation of metalorganic compounds for growing epitaxial semiconductor layers
04/18/2000USRE36663 Planarized selective tungsten metallization system
04/18/2000US6052653 Spreading resistance profiling system
04/18/2000US6052626 Parametric analyzing method for calculating light intensity
04/18/2000US6052518 Logical circuit automatical design method and system, and computer readable medium for storing a program for performing automatically designing process therein
04/18/2000US6052516 Automatic layout apparatus and method used in analog LSI layout design
04/18/2000US6052478 Automated photomask inspection apparatus
04/18/2000US6052324 Semiconductor memory device capable of fast sensing operation
04/18/2000US6052318 Repairable semiconductor memory circuit having parrel redundancy replacement wherein redundancy elements replace failed elements
04/18/2000US6052301 Semiconductor memory device
04/18/2000US6052271 Ferroelectric capacitor including an iridium oxide layer in the lower electrode