Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2000
04/25/2000US6054367 Ion implant of the moat encroachment region of a LOCOS field isolation to increase the radiation hardness
04/25/2000US6054366 Two-layered gate structure for a semiconductor device and method for producing the same
04/25/2000US6054365 Process for filling deep trenches with polysilicon and oxide
04/25/2000US6054364 Chemical mechanical polishing etch stop for trench isolation
04/25/2000US6054363 Method of manufacturing semiconductor article
04/25/2000US6054362 Method of patterning dummy layer
04/25/2000US6054361 Preserving the zero mark for wafer alignment
04/25/2000US6054360 Method of manufacturing a semiconductor memory device with a stacked capacitor wherein an electrode of the capacitor is shaped using a high melting point metal film
04/25/2000US6054359 Method for making high-sheet-resistance polysilicon resistors for integrated circuits
04/25/2000US6054358 Semiconductor device and manufacturing method of the same
04/25/2000US6054357 Semiconductor device and method for fabricating the same
04/25/2000US6054356 Transistor and process of making a transistor having an improved LDD masking material
04/25/2000US6054355 Method of manufacturing a semiconductor device which includes forming a dummy gate
04/25/2000US6054354 High voltage field effect transistors with selective gate depletion
04/25/2000US6054353 Short turn around time mask ROM process
04/25/2000US6054352 Method of manufacturing a silicon carbide vertical MOSFET
04/25/2000US6054351 Method of evaluating a tunnel insulating film
04/25/2000US6054350 EPROM cell having a gate structure with sidewall spacers of differential composition
04/25/2000US6054348 Self-aligned source process
04/25/2000US6054347 Thin narrow dielectric
04/25/2000US6054346 DRAM cell, DRAM and method for fabricating the same
04/25/2000US6054344 OTP (open trigger path) latchup scheme using buried-diode for sub-quarter micron transistors
04/25/2000US6054343 Nitride trench fill process for increasing shallow trench isolation (STI) robustness
04/25/2000US6054342 Method of making integrated circuits with tub-ties
04/25/2000US6054341 Method of manufacturing charge-coupled device having different light-receiving region and charge-isolating layer structures
04/25/2000US6054338 Low cost ball grid array device and method of manufacture thereof
04/25/2000US6054337 Method of making a compliant multichip package
04/25/2000US6054336 Method of manufacturing an electronic device
04/25/2000US6054333 Real time etch measurements and control using isotopes
04/25/2000US6054332 Method for fabricating capacitor of semiconductor memory device
04/25/2000US6054331 Apparatus and methods of depositing a platinum film with anti-oxidizing function over a substrate
04/25/2000US6054328 Method for cleaning the surface of a dielectric
04/25/2000US6054206 Vapor deposit of a film of a silica precursor on a substrate in an environment with low oxidant content and removiing all ofthe organic groups; low dielectric constant insulating materials in semiconductor devices
04/25/2000US6054191 Decarbonization of a titanium nitride/silicon interface with an plasma gas activated to react with the carbon present from the organotitanium compound used in the vapor disposition of the nitride layer; transforming to a lower electrical
04/25/2000US6054181 Coating substrates in coating section; transferring to interface section; supplying dehumidified air; loading substrates into boates; transferring boates to heat treatment zone; heat treating substrates
04/25/2000US6054173 Forming patterned aluminum layer on substrate, such that titanium-containing surface is exposed in selected regions; depositing copper from electroless solution onto exposed regions of titanium-containging surface adjacent to catalyst
04/25/2000US6054172 Forming patterned catalyst material on substrate, such that titanium-containing surface is exposed in selected regions; depositing copper from electroless solution onto exposed regions of titanium-containing surface adjacent to catalyst
04/25/2000US6054171 Forming film of organic or polymeric material on top portion of protruding electrode formed on pad and second film of polymeric material to bury base portion of protruding electrode; removing first film after second film is cured
04/25/2000US6054063 Method for plasma treatment and apparatus for plasma treatment
04/25/2000US6054062 Method and apparatus for agitating an etchant
04/25/2000US6054029 Device for gripping, holdings and/or transporting substrates
04/25/2000US6054024 Apparatus for forming transparent conductive film by sputtering and method therefor
04/25/2000US6054016 Magnetically enhanced microwave plasma generating apparatus
04/25/2000US6054015 Apparatus for loading and unloading substrates to a chemical-mechanical planarization machine
04/25/2000US6054014 Exhaust apparatus
04/25/2000US6054013 Parallel plate electrode plasma reactor having an inductive antenna and adjustable radial distribution of plasma ion density
04/25/2000US6054012 Electromagnetic radiation of integrated circuits
04/25/2000US6054008 Process for adhesively attaching a temporary lid to a microelectronic package
04/25/2000US6053983 Wafer for carrying semiconductor wafers and method detecting wafers on carrier
04/25/2000US6053982 Wafer support system
04/25/2000US6053980 Substrate processing apparatus
04/25/2000US6053977 Coating apparatus
04/25/2000US6053975 Crystal holding apparatus
04/25/2000US6053950 Layout method for a clock tree in a semiconductor device
04/25/2000US6053694 Rotatable wafer handler with retractable stops
04/25/2000US6053689 Guide mechanism for aligning a handheld vacuum pickup wand with a selected wafer in a cassette
04/25/2000US6053688 Method and apparatus for loading and unloading wafers from a wafer carrier
04/25/2000US6053687 Cost effective modular-linear wafer processing
04/25/2000US6053686 Device and method for load locking for semiconductor processing
04/25/2000US6053668 Water slide for transferring semiconductor wafers
04/25/2000US6053667 Carrying apparatus for spherical objects
04/25/2000US6053478 Wafer hoist with self-aligning bands
04/25/2000US6053397 Applying a resist or polymer film onto the support substrate as a mask layer, producing holes in mask layer by laser ablation over the copper pad, filling the holes with solder paste to a specific level, reflowing the solder to form bumps
04/25/2000US6053395 Method of flip-chip bonding between a chip element and a wafer-board
04/25/2000US6053241 Cooling method and apparatus for charged particle lenses and deflectors
04/25/2000US6053234 Lead frame transfer device and wire bonding apparatus comprising the same
04/25/2000US6052913 Positioning device and positioning method
04/25/2000US6052893 Process for manufacturing a resin-encapsulated electronic product
04/25/2000US6052855 Liquid flow workpiece cassette washing apparatus
04/25/2000CA2138292C Rotating susceptor semiconductor wafer processing cluster tool module useful for tungsten cvd
04/25/2000CA2004778C Semiconductor integrated circuit
04/20/2000WO2000022899A1 Deposited thin build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates
04/20/2000WO2000022896A1 Fabrication process for flex circuit applications
04/20/2000WO2000022722A1 Electrostatic sensing chuck using area matched electrodes
04/20/2000WO2000022681A1 Melt through contact formation method
04/20/2000WO2000022679A1 Field-effect semiconductor device
04/20/2000WO2000022676A1 Semiconductor device and method of manufacture thereof
04/20/2000WO2000022671A1 Method of making dual damascene conductive interconnections and integrated circuit device comprising same
04/20/2000WO2000022670A1 Integrated circuit rewiring using gas-assisted fib etching
04/20/2000WO2000022669A1 Method for producing a buried material layer in another material
04/20/2000WO2000022668A1 Electronic module, especially a multichip module, with multi-layer metallization and corresponding production method
04/20/2000WO2000022667A1 Apparatus and method for filling a ball grid array
04/20/2000WO2000022665A1 Semiconductor assisted metal deposition for nanolithography applications
04/20/2000WO2000022664A1 Post deposition treatment of dielectric films for interface control
04/20/2000WO2000022663A1 Low imprint ferroelectric material for long retention memory and method of making the same
04/20/2000WO2000022662A1 Inhibition of titanium corrosion
04/20/2000WO2000022661A1 Contaminant removal method
04/20/2000WO2000022660A1 Method and apparatus for surface treatment
04/20/2000WO2000022659A1 Method of forming cobalt-disilicide contacts using a cobalt-carbon alloy thin film
04/20/2000WO2000022658A1 Semiconductor device and method for manufacturing the same
04/20/2000WO2000022657A1 Method for micro-structuring glasses
04/20/2000WO2000022655A1 Detection of wafer fragments in a wafer processing apparatus
04/20/2000WO2000022654A1 Wafer cleaning and vapor drying system and method
04/20/2000WO2000022653A1 Sorting/storage device for wafers and method for handling thereof
04/20/2000WO2000022646A1 Water-cooled coil for a plasma chamber
04/20/2000WO2000022589A1 Wafer mapping system
04/20/2000WO2000022554A1 Method and apparatus for channel routing
04/20/2000WO2000022481A1 A mixed solvent system for positive photoresists
04/20/2000WO2000022445A1 Test socket
04/20/2000WO2000022361A1 Apparatus and method for drying objects with fluids