Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2000
04/11/2000US6048650 Half tone phase shift mask comprising second pattern layer on backside of substrate
04/11/2000US6048648 Mask including optical shield layer having variable light transmittance
04/11/2000US6048647 Masking of attenuation type and semitransparent filns
04/11/2000US6048588 Flow of inert gas over substrate surface while irradiating the undesired material with energetic photons.
04/11/2000US6048576 Carboxylic group-containing acrylonitrile-butadiene copolymer, a mixed epoxy resin, a compound having at least two intramolecular maleimide groups, an aromatic diamine compound, an epoxy-containing liquid silicon resin, a filler and a
04/11/2000US6048483 Resin sealing method for chip-size packages
04/11/2000US6048475 Gapfill of semiconductor structure using doped silicate glasses
04/11/2000US6048435 Plasma etch reactor and method for emerging films
04/11/2000US6048434 Substrate holding system including an electrostatic chuck
04/11/2000US6048424 Method for manufacturing ceramic laminated substrate
04/11/2000US6048420 Method for surface mounting electrical components to a substrate
04/11/2000US6048411 Silicon-on-silicon hybrid wafer assembly
04/11/2000US6048409 Washing apparatus and washing method
04/11/2000US6048406 Benign method for etching silicon dioxide
04/11/2000US6048405 Megasonic cleaning methods and apparatus
04/11/2000US6048403 Multi-ledge substrate support for a thermal processing chamber
04/11/2000US6048400 Substrate processing apparatus
04/11/2000US6048399 SOG coater nozzle pot
04/11/2000US6048397 Formed by doping a constant composition layer with nitrogen
04/11/2000US6048395 Method for producing a silicon single crystal having few crystal defects
04/11/2000US6048259 Wafer loading and unloading mechanism for loading robot
04/11/2000US6048256 Apparatus and method for continuous delivery and conditioning of a polishing slurry
04/11/2000US6048162 Wafer handler for multi-station tool
04/11/2000US6048154 High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock
04/11/2000US6048011 Apparatus for contactless capturing and handling of spherical-shaped objects
04/11/2000US6047877 Lead penetrating clamping system
04/11/2000US6047717 Mandrel device and method for hard disks
04/11/2000US6047480 Method of processing a semiconductor device
04/11/2000US6047470 Singulation methods
04/11/2000US6047468 Lead finger clamp assembly and method of stabilizing lead frame elements
04/06/2000WO2000019775A1 Wafer level burn-in and test thermal chuck and method
04/06/2000WO2000019592A1 Dechucking method and apparatus for workpieces in vacuum processors
04/06/2000WO2000019573A1 Protective circuit on an integrated circuit
04/06/2000WO2000019539A1 Cell based array having compute/drive ratios of n:1
04/06/2000WO2000019538A1 Self-aligned non-volatile contactless memory cell with reduced surface
04/06/2000WO2000019536A1 Electronic switching device with at least two semiconductor components
04/06/2000WO2000019535A1 Semiconductor structure for semiconductor components
04/06/2000WO2000019534A1 Nitride etch stop for poisoned unlanded vias
04/06/2000WO2000019533A1 Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame
04/06/2000WO2000019531A1 Backside electrical contact structure for a module having an exposed backside
04/06/2000WO2000019530A1 Vertical field effect transistor with an interior gate and method for producing the same
04/06/2000WO2000019529A1 Integrated circuit comprising vertical transistors, and a method for the production thereof
04/06/2000WO2000019528A1 Dram cell system and method for producing same
04/06/2000WO2000019527A1 Dram cell system and method for producing same
04/06/2000WO2000019526A1 Semiconductor memory cell and method for producing the same
04/06/2000WO2000019525A1 Substrate with an indentation for an integrated circuit device and method for the production thereof
04/06/2000WO2000019524A2 Ic interconnect structures and methods for making same
04/06/2000WO2000019523A1 High-performance dual-damascene interconnect structures
04/06/2000WO2000019522A1 Improved methods for barrier layer formation
04/06/2000WO2000019521A1 Chuck with integrated piezoelectric sensors for wafer detection
04/06/2000WO2000019520A1 Methods and apparatus for determining an etch endpoint in a plasma processing system
04/06/2000WO2000019519A1 Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors
04/06/2000WO2000019518A1 Optical inspection equipment for semiconductor wafers with precleaning
04/06/2000WO2000019517A1 Semiconductor chip and manufacture method thereof
04/06/2000WO2000019516A1 Semiconductor device, connection method for semiconductor chip, circuit board and electronic apparatus
04/06/2000WO2000019515A1 Semiconductor device and manufacturing method thereof, circuit board and electronic equipment
04/06/2000WO2000019514A1 Semiconductor package and flip-chip bonding method therefor
04/06/2000WO2000019512A1 Pseudomorphic high electron mobility transistors
04/06/2000WO2000019511A1 Deposition of oxide layer on the gate
04/06/2000WO2000019510A2 Elevated channel mosfet
04/06/2000WO2000019509A2 Method of manufacturing a semiconductor device with a field effect transistor
04/06/2000WO2000019508A1 Silicon carbide deposition method and use as a barrier layer and passivation layer
04/06/2000WO2000019507A1 Method of plasma-assisted film deposition
04/06/2000WO2000019506A1 Method of plasma etching dielectric materials
04/06/2000WO2000019505A1 Method and apparatus for improving accuracy of plasma etching process
04/06/2000WO2000019504A2 Methods for fabricating interpoly dielectrics in non-volatile stacked-gate memory structures
04/06/2000WO2000019503A1 Method for producing transistors
04/06/2000WO2000019502A1 Vertical furnace and wafer boat for vertical furnace
04/06/2000WO2000019501A1 Method and apparatus for plasma processing
04/06/2000WO2000019500A1 Semiconductor substrate and its production method, semiconductor device comprising the same and its production method
04/06/2000WO2000019499A1 Method for the transfer of thin layers of monocrystalline material onto a desirable substrate
04/06/2000WO2000019498A1 In situ deposition of low k si carbide barrier layer, etch stop, and anti-reflective coating for damascene applications
04/06/2000WO2000019495A2 Chamber liner for semiconductor process chambers
04/06/2000WO2000019493A2 Wafer load lock with internal wafer transport
04/06/2000WO2000019492A2 Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system
04/06/2000WO2000019491A1 Method for cleaning a process chamber
04/06/2000WO2000019490A2 Dummy fill cell for reducing layer-to-layer interaction
04/06/2000WO2000019483A1 Vacuum treatment chamber and method for treating surfaces
04/06/2000WO2000019481A2 Low contamination high density plasma processing chamber and methods for processing a semiconductor substrate
04/06/2000WO2000019441A2 Magnetoresistive memory having improved interference immunity
04/06/2000WO2000019440A2 Magnetoresistive memory with low current density
04/06/2000WO2000019343A2 Block based design methodology
04/06/2000WO2000019276A1 Novel photosensitive resin compositions
04/06/2000WO2000019275A1 Novel photosensitive resin compositions
04/06/2000WO2000019274A1 Method for forming micropattern of resist
04/06/2000WO2000019273A1 Novel photosensitive polybenzoxazole precursor compositions
04/06/2000WO2000019272A1 Methods of reducing proximity effects in lithographic processes
04/06/2000WO2000019224A1 Circuit configuration with a scan path that can be deactivated
04/06/2000WO2000019215A1 Thermal isolation plate for probe card
04/06/2000WO2000019187A2 Apparatus for x-ray analysis in grazing exit conditions
04/06/2000WO2000018990A1 Method for removing defects of single crystal material and single crystal material from which defects are removed by the method
04/06/2000WO2000018982A1 Method and apparatus for forming polycrystalline and amorphous silicon films
04/06/2000WO2000018980A1 An in-line sputter deposition system
04/06/2000WO2000018979A1 Sputter deposition apparatus
04/06/2000WO2000018848A1 Pressure-sensitive adhesive sheet exfoliative with heat
04/06/2000WO2000018847A1 Coating fluid for forming low-permittivity silica-based coating film and substrate with low-permittivity coating film
04/06/2000WO2000018547A1 Substrate transport apparatus
04/06/2000WO2000018542A1 Chemical mechanical polishing conditioner
04/06/2000WO2000018523A1 Method and apparatus for cleaning low k dielectric and metal wafer surfaces
04/06/2000WO2000003418B1 Intelligent wafer handling system and method