Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2000
04/18/2000US6051459 Method of making N-channel and P-channel IGFETs using selective doping and activation for the N-channel gate
04/18/2000US6051458 Drain and source engineering for ESD-protection transistors
04/18/2000US6051456 Semiconductor component and method of manufacture
04/18/2000US6051455 Method of making plurality of FETs having different threshold values
04/18/2000US6051454 Semiconductor device and method for fabricating the same
04/18/2000US6051453 Forming a non-single crystal semiconductor film comprising silicon and hydrogen on an insulating surface, ejecting hydrogen from non-single crystal semiconductor film, crystallizing the semiconductor film by irradiating a light
04/18/2000US6051452 Method for manufacturing a semiconductor device with ion implantation
04/18/2000US6051451 Amorphizing an unmasked portion of polysilicon layer, etching the unmasked portion, forming an oxide-nitride-oxide layer, implanting silicon ions and germanium ions into the unmasked portion through the exposed oxynitride layer
04/18/2000US6051450 Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus
04/18/2000US6051449 Attaching a semiconductor device to a lead frame by using a quick curable adhesive
04/18/2000US6051448 Method of manufacturing an electronic component
04/18/2000US6051443 Method for assessing the effects of plasma treatments on wafers of semiconductor material
04/18/2000US6051442 CMOS integrated circuit device and its inspecting method and device
04/18/2000US6051441 High-efficiency miniature magnetic integrated circuit structures
04/18/2000US6051380 Hybridizing dna in an electrophoresis system using a low conductivity, zwitterionic buffer; transporting dna toward a microlocation where ph of buffer is below the isoelectric point, enhancing hybridization of dna to probe
04/18/2000US6051371 Uniformly heating a substrate in a container containing heating plates and heat unifying plates; photolithographic processes on a semiconductor substrate such as a liquid crystal display
04/18/2000US6051370 Radiation-sensitive mixture
04/18/2000US6051369 Lithography process using one or more anti-reflective coating films and fabrication process using the lithography process
04/18/2000US6051346 Process for fabricating a lithographic mask
04/18/2000US6051321 Low dielectric constant materials and method
04/18/2000US6051303 Semiconductor supporting device
04/18/2000US6051283 Forming a silicide layer or region near the interface region of two dissimilar materials
04/18/2000US6051282 Surface treatment of antireflective layer in chemical vapor deposition process
04/18/2000US6051281 Subjecting the substrate to the plasma processing in an atmosphere of the mixed gas of nitrogen gas and hydrogen gas, thereby nitriding a surface layer of the titanium film to form thereon a nitride layer
04/18/2000US6051153 Etching method
04/18/2000US6051122 Deposition shield assembly for a semiconductor wafer processing system
04/18/2000US6051120 Thin film forming apparatus
04/18/2000US6051119 Plating structure for a pin grid array package
04/18/2000US6051114 Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition
04/18/2000US6051101 Substrate processing apparatus, substrate transport apparatus and substrate transfer apparatus
04/18/2000US6051100 High conductance plasma containment structure
04/18/2000US6051093 Mounting method of semiconductor element
04/18/2000US6051074 Thermal conditioning apparatus
04/18/2000US6051072 Method and apparatus for semiconductor filming
04/18/2000US6051067 Wafer securing device and method
04/18/2000US6051030 Emulation module having planar array organization
04/18/2000US6050891 Vacuum processing system with turbo-axial fan in clean-air supply system of front end environment
04/18/2000US6050885 Device for the chemical-mechanical polishing of an object, in particular a semiconductor wafer
04/18/2000US6050884 Polishing apparatus
04/18/2000US6050882 Carrier head to apply pressure to and retain a substrate
04/18/2000US6050878 Processing jig
04/18/2000US6050832 Chip and board stress relief interposer
04/18/2000US6050830 Tape carrier package for liquid crystal display
04/18/2000US6050827 Method of manufacturing a thin-film transistor with reinforced drain and source electrodes
04/18/2000US6050768 Automatic carrier control method in semiconductor wafer cassette transportation apparatus
04/18/2000US6050739 Robot end effector for automated wet wafer processing
04/18/2000US6050481 Method of making a high melting point solder ball coated with a low melting point solder
04/18/2000US6050476 Reworkable microelectronic multi-chip module
04/18/2000US6050446 Pivoting lid assembly for a chamber
04/18/2000US6050389 Carrier apparatus with more than one carrier belts and processing apparatus therewith
04/18/2000US6050332 Extruded, tiered high fin density heat sinks and method of manufacture
04/18/2000US6050287 Purge system and purge joint
04/18/2000US6050276 Apparatus and method for cleaning a precision substrate
04/18/2000US6050275 Apparatus for and method of cleaning objects to be processed
04/18/2000US6050218 Dosimetry cup charge collection in plasma immersion ion implantation
04/18/2000US6050217 Parallel plate plasma CVD apparatus
04/18/2000US6050125 Calibrating wafer and method for the production of a calibrating wafer
04/18/2000US6049996 Device and fluid separator for processing spherical shaped devices
04/18/2000US6049976 Method of mounting free-standing resilient electrical contact structures to electronic components
04/18/2000US6049975 Method of forming a thin multichip module
04/18/2000US6049974 Magnetic alignment apparatus and method for self-alignment between a die and a substrate
04/18/2000US6049972 Universal unit strip/carrier frame assembly and methods
04/18/2000CA2200124C Method of making an inp-based device comprising semiconductor growth on a non-planar surface
04/18/2000CA2078731C Positional deviation measuring device and method thereof
04/13/2000WO2000021346A1 Soldering of a semiconductor chip to a substrate
04/13/2000WO2000021345A1 Manufacturing method of wiring circuit board, and wiring circuit board
04/13/2000WO2000021144A2 VERTICAL GEOMETRY InGaN LED
04/13/2000WO2000021140A1 Semiconductor device, a method of manufacturing the same, and a semiconductor device protective circuit
04/13/2000WO2000021139A1 Low stress polysilicon film and method for producing same
04/13/2000WO2000021135A1 Semiconductor device and method for manufacturing the same
04/13/2000WO2000021129A1 In situ titanium aluminide deposit in high aspect ratio features
04/13/2000WO2000021128A1 Techniques for triple and quadruple damascene fabrication
04/13/2000WO2000021127A1 Method and device for compensating wafer bias in a plasma processing chamber
04/13/2000WO2000021126A1 Semiconductor copper bond pad surface protection
04/13/2000WO2000021125A1 Self aligned symmetric intrinsic process and device
04/13/2000WO2000021124A1 Semiconductor device and method for manufacturing the same
04/13/2000WO2000021123A1 METHOD FOR FORMING AN ANTIREFLECTING SiON FILM, NON-POLLUTING FOR LIGHT-SENSITIVE RESINS FOR FAR-ULTRAVIOLET RADIATION
04/13/2000WO2000021122A1 Semiconductor wafer manufacturing method
04/13/2000WO2000021121A1 Semiconductor device and method for producing the same
04/13/2000WO2000021120A1 Method and apparatus for depositing material upon a semiconductor wafer using a transition chamber of a multiple chamber semiconductor wafer processing system
04/13/2000WO2000021119A1 An apparatus for holding a semiconductor wafer
04/13/2000WO2000021118A2 Method for producing a double gate of a vertical mosfet
04/13/2000WO2000021092A1 Semiconductor device
04/13/2000WO2000021027A1 Method for producing a supporting element for an integrated circuit module for placement in chip cards
04/13/2000WO2000020927A1 Photosensitive polysilazane composition and method of forming patterned polysilazane film
04/13/2000WO2000020916A2 Nanoparticle-based electrical, chemical, and mechanical structures and methods of making same
04/13/2000WO2000020900A2 Silicon carbide for use as a low dielectric constant anti-reflective coating and its deposition method
04/13/2000WO2000020879A1 Imaging using spatial frequency filtering and masking
04/13/2000WO2000020663A1 Substrate plating device
04/13/2000WO2000020662A1 Submicron metallization using electrochemical deposition
04/13/2000WO2000020655A1 Internally heated exhaust unit
04/13/2000WO2000020519A2 Preparations containing fine-particulate inorganic oxides
04/13/2000WO2000020483A2 Impact-resistant epoxide resin compositions
04/13/2000WO2000020330A1 Method and apparatus for purification of hydride gas streams
04/13/2000WO2000020154A1 Method and apparatus for placing solder balls on a substrate
04/13/2000WO2000007228A8 Epitaxial growth furnace
04/13/2000WO2000003252A3 Multi-point probe
04/13/2000DE19947557A1 Image processing device for objects, determines angle of inclination based upon edge detection
04/13/2000DE19947174A1 Mask holder with clamps on disc-shaped frame for exposure of semiconductor wafers in ion lithography
04/13/2000DE19942885A1 Semiconductor device has an electrode or wiring layer of a thick aluminum layer below a nickel layer to prevent an aluminum-nickel intermetallic compound from reaching the underlying substrate
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