Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2000
08/22/2000US6106618 Photoresist application for a circlet wafer
08/22/2000US6106613 Semiconductor substrate having compound semiconductor layer, process for its production, and electronic device fabricated on semiconductor substrate
08/22/2000US6106582 Motor containing stator and reaction plate; semiconductors
08/22/2000US6106378 Carrier head with a flexible membrane for a chemical mechanical polishing system
08/22/2000US6106367 Method and device for analysis of flip chip electrical connections
08/22/2000US6106259 Transfer molding apparatus with a cull-block having protrusion
08/22/2000US6106222 Method of peeling off chips using peeling plate with integrally formed first and second protrusions
08/22/2000US6106213 Automated door assembly for use in semiconductor wafer manufacturing
08/22/2000US6106167 Apparatus for photolithography process with gas-phase pretreatment
08/22/2000US6105852 Etched glass solder bump transfer for flip chip integrated circuit devices
08/22/2000US6105851 Method of casting I/O columns on an electronic component with a high yield
08/22/2000US6105848 Wire bonding method, wire bonding apparatus and semiconductor device produced by the same
08/22/2000US6105846 Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
08/22/2000US6105782 Storage container for precision substrates
08/22/2000US6105781 Thin-plate supporting container with unitary porous gasket
08/22/2000US6105592 Gas intake assembly for a wafer processing system
08/22/2000US6105588 Exposing the photoresist on the wafer surface to a first plasma with a reducing agent to reduction and then exposing the photoresist on the surface to a second plasma with an oxidizing agent to oxidation
08/22/2000US6105567 Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation
08/22/2000US6105534 Apparatus for plasma jet treatment of substrates
08/22/2000US6105518 Durable plasma treatment apparatus and method
08/22/2000US6105274 Cryogenic/phase change cooling for rapid thermal process systems
08/22/2000US6105245 Method of manufacturing a resin-encapsulated semiconductor package
08/22/2000US6105243 Method of fabricating multilayer printed circuit board
08/22/2000US6105241 Flip fixture for assembling components to a heat sink
08/22/2000CA2208162C Reactive pvd with neg pump
08/17/2000WO2000048313A1 Surface wave device connected to a base with conductive adhesive
08/17/2000WO2000048278A1 Method for forming an optical silicon layer on a support and use of said method in the production of optical components
08/17/2000WO2000048254A1 Nitride semiconductor device and its manufacturino method
08/17/2000WO2000048253A1 Integrated circuit comprising an inductor which prevents latch-up and a method for its manufacture
08/17/2000WO2000048252A2 Electrostatic discharge protection of integrated circuits
08/17/2000WO2000048251A1 Methods for packaging integrated circuit devices including cavities adjacent active regions and related structures
08/17/2000WO2000048250A1 Method for the production of a chip-card type portable storage medium
08/17/2000WO2000048248A1 Semiconductor device with deep substrate contacts
08/17/2000WO2000048247A1 Semiconductor device, method of manufacture thereof, electronic device
08/17/2000WO2000048246A1 Method of manufacturing a vertical metal connection in an integrated circuit
08/17/2000WO2000048245A1 Patterned silicon-on-insulator devices
08/17/2000WO2000048244A1 Device and method for heat-treating wafer
08/17/2000WO2000048242A1 Method for producing electrically conductive connections
08/17/2000WO2000048241A1 Integrated circuit device and its manufacturing method
08/17/2000WO2000048240A1 Process for forming thin dielectric layers in semiconductor devices
08/17/2000WO2000048239A1 Heteroepitaxial growth with thermal expansion- and lattice-mismatch
08/17/2000WO2000048238A1 Multilayer structure with controlled internal stresses and method for making same
08/17/2000WO2000048236A1 Methods of fabricating etched structures
08/17/2000WO2000048235A1 Semiconductor cleaning apparatus and method
08/17/2000WO2000048234A1 Device and method for handling substrates by means of a self-levelling vacuum system in epitaxial induction reactors
08/17/2000WO2000048233A1 Device for transporting objects
08/17/2000WO2000048226A1 High-density plasma source for ionized metal deposition
08/17/2000WO2000048225A1 Charged particle ray exposure device and method of manufacturing semiconductor device
08/17/2000WO2000048224A1 Electron gun and electron beam exposure device
08/17/2000WO2000048046A1 Vacuum ultraviolet transmitting silicon oxyfluoride lithography glass
08/17/2000WO2000048044A1 Photosensitive resin composition
08/17/2000WO2000048043A1 Extreme-uv lithography condenser
08/17/2000WO2000047953A1 A non-invasive system and method for diagnosing potential malfunctions of semiconductor equipment components
08/17/2000WO2000047501A1 Reticle transfer system
08/17/2000WO2000047391A1 Method and apparatus for producing semiconductor preforms
08/17/2000WO2000047369A1 Method of polishing semiconductor wafers
08/17/2000WO2000047368A1 Work holding disc for polishing, work polishing apparatus, and work polishing method
08/17/2000WO2000047366A2 Apparatus and method for grinding, lapping and polishing semiconductor wafers
08/17/2000WO2000047343A1 Method and apparatus for etching coated substrates
08/17/2000WO2000032835A8 Electro-chemical deposition system
08/17/2000WO2000018979A8 Sputter deposition apparatus
08/17/2000WO2000014806A9 Vertical bipolar transistor and method for the production thereof
08/17/2000WO2000013222A9 Silane-based nanoporous silica thin films
08/17/2000WO2000013208A9 Selectively doped trench device isolation
08/17/2000DE19963705A1 Electronic component has terminals with leads arranged parallelly whose surface and resin surface of pad, are made offset
08/17/2000DE19959169A1 Microactuator has piezoelectric element on which grooves are etched and is connected to voltage application line via upper electrode of substrate
08/17/2000DE19904548A1 Verfahren und Vorrichtung zum Reinigen von Substraten Method and apparatus for cleaning substrates
08/17/2000DE19904379A1 Mikroelektronische Struktur Microelectronic structure
08/17/2000DE19904305A1 Convex structure formation involves changing etching removal rate of base material as function of etching time depending on base material
08/17/2000DE19900879A1 Optischer Detektor mit einer Filterschicht aus porösem Silizium und Herstellungsverfahren dazu Optical detector with a filter layer of porous silicon and production method thereof
08/17/2000DE10005804A1 Production of a semiconductor device comprises using a gas plasma during the formation of the trench and protective film and etching of the base of the trench
08/17/2000DE10004629A1 Process for removing particles from a table holding a semiconductor wafer during semiconductor device processing comprises placing a resin film on the table and removing the film from the table
08/17/2000DE10003240A1 Control procedure for wire saw involves controlling feed rate of workpiece based on comparison between calculated cutting load and predetermined reference value
08/17/2000CA2367064A1 Methods of fabricating etched structures
08/17/2000CA2362920A1 Integrated circuit comprising an inductor which prevents latch-up and a method for its manufacture
08/17/2000CA2362736A1 Surface wave device connected to a base with conductive adhesive
08/17/2000CA2362428A1 Electrostatic discharge protection of integrated circuits
08/17/2000CA2356868A1 Semiconductor device with deep substrate contacts
08/16/2000EP1028502A2 Smart laser with automated beam quality control
08/16/2000EP1028473A2 Trench MOS-gated device manufactured with few masks
08/16/2000EP1028472A2 Coulomb-blockade element and method of manufacturing the same
08/16/2000EP1028469A2 Semiconductor device and method of manufacturing the same
08/16/2000EP1028468A1 Biasing circuit for isolation region in integrated power circuit
08/16/2000EP1028464A1 Semiconductor device with improved interconnections between the chip and the terminals, and process for its manufacture
08/16/2000EP1028463A1 Flexible package having very thin semiconductor chip, module and multi chip module (MCM) assembled by the package, and method for manufacturing the same
08/16/2000EP1028462A1 Electronic module of extra thin construction
08/16/2000EP1028460A2 Dual damascene misalignment tolerant techniques for vias and sacrificial etch segments
08/16/2000EP1028459A2 Method of fabricating semiconductor device
08/16/2000EP1028458A2 Chemical vapor deposition of silicate high dielectric constant materials
08/16/2000EP1028457A1 Method of plasma processing
08/16/2000EP1028456A1 Stage device, a scanning aligner and a scanning exposure method, and a device manufactured thereby
08/16/2000EP1028455A2 Cutting-and-transferring system and pellet transferring apparatus
08/16/2000EP1028454A2 Wafer support apparatus
08/16/2000EP1028431A2 Shielded bitlines for static rams
08/16/2000EP1028354A1 Positive photosensitive resin composition, method of forming relief pattern, and electronic part
08/16/2000EP1028328A2 Process for fabricating article exhibiting substantial three-dimensional order and resultant article
08/16/2000EP1028176A1 Substrate holder and method for its use
08/16/2000EP1028175A1 Accelerated plasma cleaning
08/16/2000EP1028173A2 Titanium nitride barrier layers
08/16/2000EP1027949A1 Internal diameter saw and method for adjusting a nozzle and a sensor relative to a saw blade of same
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