Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2000
08/01/2000US6096174 Cathode sputtering; applying voltage to sustain gas discharge plasma between anode and cathode; rhythmic interruptions to short circuit; ion bombardment
08/01/2000US6096165 Method and apparatus for application of adhesive tape to semiconductor devices
08/01/2000US6096163 Method and apparatus for application of spray adhesive to a leadframe for chip bonding
08/01/2000US6096161 Dry etching apparatus having means for preventing micro-arcing
08/01/2000US6096160 Helicon wave plasma processing apparatus
08/01/2000US6096135 Method and apparatus for reducing contamination of a substrate in a substrate processing system
08/01/2000US6096134 Liquid delivery system
08/01/2000US6096130 Method of crystal growth of a GaN layer over a GaAs substrate
08/01/2000US6096129 Method of and apparatus for producing single-crystalline diamond of large size
08/01/2000US6096111 Pressing agglutinating particle mixture to form compact; melting; powder metallurgy
08/01/2000US6096100 Applying pressurized gas stream aligned with slots
08/01/2000US6095908 Polishing apparatus having a material for adjusting a surface of a polishing pad and method for adjusting the surface of the polishing pad
08/01/2000US6095898 Process and device for polishing semiconductor wafers
08/01/2000US6095897 Grinding and polishing machines
08/01/2000US6095806 Semiconductor wafer boat and vertical heat treating system
08/01/2000US6095741 Dual sided slot valve and method for implementing the same
08/01/2000US6095582 Article holders and holding methods
08/01/2000US6095398 Solder ball arrangement device
08/01/2000US6095397 Solder deposit support
08/01/2000US6095396 Bonding load correction method and wire bonding apparatus
08/01/2000US6095335 Wafer support device having a retrofit to provide size convertibility
08/01/2000US6095167 Rinse/dry apparatus including a chamber with a moveable side wall
08/01/2000US6095161 Processing and post-processing compositions and methods of using same
08/01/2000US6095083 Vacuum processing chamber having multi-mode access
08/01/2000US6094812 Dishing avoidance in wide soft metal wires
08/01/2000CA2014296C Integrated circuit
07/2000
07/29/2000CA2296135A1 Testing system for circuit board self-test
07/27/2000WO2000044071A1 Electric module for connection to external electric circuits and method of producing the same
07/27/2000WO2000044047A1 Microelectronic structure
07/27/2000WO2000044045A1 Microcircuit die-sawing protector and method
07/27/2000WO2000044044A1 Method for reducing the capacitance between interconnects by forming voids in dielectric material
07/27/2000WO2000044043A1 Semiconductor device and method of manufacturing the same
07/27/2000WO2000044042A1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
07/27/2000WO2000044040A1 Method of wire bonding, semiconductor device, circuit board, electronic device and wire bonder
07/27/2000WO2000044039A1 Reliable via structures having hydrophobic inner wall surfaces and methods for making the same
07/27/2000WO2000044038A1 Plasma enhanced cvd process for rapidly growing semiconductor films
07/27/2000WO2000044037A1 Method of in-situ etching a hard mask and a metal layer in a single etcher
07/27/2000WO2000044036A1 Use of multifunctional si-based oligomer/polymer for the surface modification of nanoporous silica films
07/27/2000WO2000044035A1 Semiconductor fabrication method and system
07/27/2000WO2000044034A1 Methods and cleaning solutions for post-chemical mechanical polishing
07/27/2000WO2000044033A1 Method and apparatus for film deposition
07/27/2000WO2000043836A1 Solvent systems for polymeric dielectric materials
07/27/2000WO2000043731A1 Multiple alignment mechanisms near shared processing device
07/27/2000WO2000043577A1 Cdv method of and reactor for silicon carbide monocrystal growth
07/27/2000WO2000043573A1 Passivating etchants for metallic particles
07/27/2000WO2000043567A1 Film forming device
07/27/2000WO2000043180A1 Drill and drilling method, stage working method, and method of manufacturing exposure device
07/27/2000WO2000043159A1 Improved polishing pads and methods relating thereto
07/27/2000WO2000043130A1 Flow controller
07/27/2000WO2000028580A3 Method and apparatus for cleaning the edge of a thin disc
07/27/2000WO2000021144A3 VERTICAL GEOMETRY InGaN LED
07/27/2000WO2000010058A9 Reaction force isolation system for a planar motor
07/27/2000WO2000008670A9 Dose monitor for plasma-monitor ion implantation doping system
07/27/2000WO2000005749A3 Method and apparatus for anisotropic etching
07/27/2000WO2000002804A9 Opening system compatible with a vertical interface
07/27/2000WO2000002798A9 Cushioned wafer container
07/27/2000WO2000000992A9 Focus ring arrangement for substantially eliminating unconfined plasma in a plasma processing chamber
07/27/2000DE19958789A1 Electron beam tester for semiconductor, produces image of semiconductor from secondary electron emitted from semiconductor
07/27/2000DE19955387A1 Polishing agent feed to semiconductor disc polisher based on chemical-mechanical polishing (CMP) for flattening intermediate insulation foil
07/27/2000DE19941408A1 Photomask used in the manufacture of liquid crystal displays comprises a recessed section in the surface of a transparent substrate, a shadow pattern, and reflection prevention sections
07/27/2000DE19928085A1 Verfahren zur Herstellung einer Ablenkaperturmatrix für Elektronenstrahl-Belichtungsvorrichtungen, Naßätzverfahren und -apparatur zur Herstellung der Aperturmatrix und Elektronenstrahl-Belichtungsvorrichtung mit der Aperturmatrix A process for preparing a Ablenkaperturmatrix for electron beam exposure devices, and wet etching to prepare the -apparatur Aperturmatrix and electron beam exposure apparatus with the Aperturmatrix
07/27/2000DE19902908A1 Chalcogenide layers, especially copper chalcopyrite semiconductor films for thin film solar cells, are produced by interaction of metal and metal compound layers with selenium or sulfur ion beams
07/27/2000DE19902804A1 Lifetime self-indicate polishing pad for chemical mechanical polisher comprises a pad with body having multicolored indicate layers with a top surface
07/27/2000DE19902769A1 Keramisches, passives Bauelement Ceramic passive component
07/27/2000DE19902029A1 Spannungsfester Dünnschichtkondensator mit Interdigitalstruktur Fixed voltage thin film capacitor with an interdigital structure
07/27/2000DE19901623A1 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate Method and apparatus for the thermal connection of connecting surfaces of two substrates
07/27/2000DE19901384A1 Elektronisches Bauelement und Verwendung einer darin enthaltenen Schutzstruktur Electronic device and use a protective structure contained therein
07/27/2000DE19901210A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
07/27/2000DE19901209A1 Semiconductor component manufacturing plant
07/27/2000DE19901162A1 Arrangement for cleaning semiconductor wafers has transport mechanism for wafers producing liquid film; further device feeds cleaning liquid to upper rollers in form of precipitation
07/27/2000DE19901002A1 Verfahren zum Strukturieren einer Schicht A method for patterning a layer
07/27/2000DE19900807A1 Schaftlager Stem Bearing
07/27/2000DE19856082C1 Verfahren zum Strukturieren einer metallhaltigen Schicht A method for patterning a metal-containing layer
07/27/2000DE19850595A1 Verfahren zum Laserlöten und zur Temperaturüberwachung von Halbleiterchips sowie nach diesem Verfahren hergestellte Chipkarte A method of laser soldering and for monitoring the temperature of the semiconductor chip produced by this method as well as smart card
07/27/2000DE10002315A1 Hemispherical grain capacitor, useful in a semiconductor memory device e.g. a dynamic random access memory, has an U-shaped or layered lower electrode with larger hemispherical grains on its inner or upper surface
07/27/2000CA2359473A1 Method for electrolytically forming conductor structures from highly pure copper when producing integrated circuits
07/27/2000CA2296899A1 Reflective fly's eye condenser for euv lithography
07/26/2000EP1022786A2 Semiconductor device and process for production thereof
07/26/2000EP1022784A2 SRAM cell and its fabrication process
07/26/2000EP1022783A2 Integrated circuit device having dual damascene capacitor and associated method for making
07/26/2000EP1022782A2 Improved process for buried-strap self-aligned to deep storage trench
07/26/2000EP1022780A2 Method of forming a flash memory cell
07/26/2000EP1022779A1 Method and device for separating products, mounted on a common substrate, from each other, along (a) cutting line(s)
07/26/2000EP1022778A1 Method of dividing a wafer and method of manufacturing a semiconductor device
07/26/2000EP1022777A1 Air gap formation between metal leads for high speed IC processing
07/26/2000EP1022776A2 Wire bonding to copper
07/26/2000EP1022775A1 Semiconductor device, mounting structure thereof and method of fabrication thereof
07/26/2000EP1022774A2 Flip chip assembly of semiconductor IC chips
07/26/2000EP1022773A2 Chip carrier substrate
07/26/2000EP1022771A2 Improved contact and deep trench patterning
07/26/2000EP1022770A2 Method and apparatus for plating and plating structure
07/26/2000EP1022769A2 Passive ceramic device
07/26/2000EP1022768A2 Voltage-stable thin film capacitor with inter-digital structure
07/26/2000EP1022767A1 Method for mounting semiconductor chips
07/26/2000EP1022746A2 Method of operating a two-transistor flash memory cell
07/26/2000EP1022745A2 Flash memory cell array
07/26/2000EP1022616A2 Exposure device for a strip-shaped workpiece
07/26/2000EP1022615A1 Photomask case, conveying device, and conveying method
07/26/2000EP1022589A1 Diffractive optical element
07/26/2000EP1022355A2 Deposition of copper on an activated surface of a substrate
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