Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2000
08/30/2000EP1032031A2 Electronic power device monolithically integrated on a semiconductor and comprising edge protection structures having a limited planar dimension
08/30/2000EP1032030A2 Flip chip bump bonding
08/30/2000EP1032029A1 Process for manufacturing semiconductor integrated electronic memory devices having a virtual ground cells matrix
08/30/2000EP1032028A2 Improved semiconductor trench MOS device
08/30/2000EP1032027A2 Method for forming a bonded substrate containing a planar intrinsic gettering zone and substrate formed by said method
08/30/2000EP1032026A2 Method of photoresist ash residue removal
08/30/2000EP1032025A2 Process for patterning a semiconductor wafer and lithography exposure masks
08/30/2000EP1032024A2 Clamp ring
08/30/2000EP1032023A2 Method and arrangement for continuously treating objects
08/30/2000EP1032001A1 Inductive component, integrated transformer, in particular for a radio frequency circuit, and associated integrated circuit with such inductive component or integrated transformer
08/30/2000EP1031992A2 Flash EEPROM system
08/30/2000EP1031990A2 Reference voltage generator for an integrated circuit such as a dynamic random access memory (DRAM)
08/30/2000EP1031986A2 Sense amplifier device with fused diffusion areas and a distributed driver system
08/30/2000EP1031985A2 Integrated memory
08/30/2000EP1031884A2 Resist stripping agent and process of producing semiconductor devices using the same
08/30/2000EP1031882A2 Illumination system with field mirrors for producing uniform scanning energy
08/30/2000EP1031876A2 System and method for automated defect inspection of photomasks
08/30/2000EP1031873A2 Semiconductor device and fabrication method thereof
08/30/2000EP1031647A2 Apparatus and method for plating a wafer
08/30/2000EP1031641A2 Method and apparatus for depositing an insulating film
08/30/2000EP1031640A1 Trap apparatus
08/30/2000EP1031398A2 Polishing media stabilizer
08/30/2000EP1031261A1 Multiple head dispensing system and method
08/30/2000EP1031166A1 Method and apparatus for chemical mechanical polishing
08/30/2000EP1031165A1 Intergrated manufacturing tool comprising electroplating, chemical-mechanical polishing, clean and dry stations, and method therefor
08/30/2000EP1030788A1 Plasma processing methods and apparatus
08/30/2000EP1030745A1 All-surface biasable and/or temperature-controlled electrostatically-shielded rf plasma source
08/30/2000EP0970520A4 Mounting structure and mounting process from semiconductor devices
08/30/2000EP0928498B1 Method for producing a titanium monophosphide layer and its use
08/30/2000EP0855071B1 Enhanced security semiconductor device, semiconductor circuit arrangement, and method of production thereof
08/30/2000EP0843897B1 Monolithically integrated planar semi-conductor arrangement with temperature compensation
08/30/2000EP0836749B1 Thyristor with a layer of charge carriers having a reduced lifetime
08/30/2000EP0745274B1 Process for producing a three-dimensional circuit
08/30/2000EP0706716B1 Transistors and methods for fabrication thereof
08/30/2000EP0631298B1 A method for the production of semiconductor epitaxial substrate
08/30/2000EP0586579B1 Microwave plasma processing device
08/30/2000EP0462270B1 Method of using a semiconductor device comprising a substrate having a dielectrically isolated semiconductor island
08/30/2000CN1265262A System and method for packaging integrated circuits
08/30/2000CN1265230A Inorganic hydrogen compounds, separation methods, and fuel applications
08/30/2000CN1265227A Semiconductor structure with silicon carbide material base, with several electrically different sub-regions
08/30/2000CN1265226A Device and method for producing chip-substrate connection
08/30/2000CN1265225A Integrated circuit, components thereof and mfg. method
08/30/2000CN1265224A Process for fabricating layered superlattice materials and ABO3, type metal oxides and making electronic devices including same without exposure to oxygen
08/30/2000CN1265223A Method for washing silicon wafer
08/30/2000CN1265222A Method and appts. for ionized sputtering of materials
08/30/2000CN1265163A Single body injector and deposition chamber
08/30/2000CN1265131A Polishing agent for semiconductor substrates
08/30/2000CN1265110A Organosilicon nanocluster and process for producing same
08/30/2000CN1264957A High frequency amplifier and amplifying component
08/30/2000CN1264924A Memory assembly and its making method
08/30/2000CN1264923A Semiconductor device and its mfg. method
08/30/2000CN1264922A Method for mfg. semiconductor device
08/30/2000CN1264921A Method and device for arranging test in measuring dynamic logic circuit
08/30/2000CN1264920A Separator, separating method and method for mfg. semiconductor lining
08/30/2000CN1264850A Electron beam exposuring system and method thereof
08/30/2000CN1264636A Mechanical chemical polishing method for aluminium or aluminium alloy conducting layer
08/30/2000CN1056015C Metal film forming method
08/29/2000USRE36837 Structure of contact between wiring layers in semiconductor integrated circuit device
08/29/2000USRE36836 Semiconductor device for driving a light valve
08/29/2000US6112130 Semiconductor product manufacturing execution system and semiconductor product manufacturing method
08/29/2000US6111799 Semiconductor memory in which access to broken word line is inhibited
08/29/2000US6111782 Magnetoresistance effect device, and magnetoresistance effect type head, memory device, and amplifying device using the same
08/29/2000US6111781 Magnetic random access memory array divided into a plurality of memory banks
08/29/2000US6111780 Radiation hardened six transistor random access memory and memory device
08/29/2000US6111778 Body contacted dynamic memory
08/29/2000US6111756 Universal multichip interconnect systems
08/29/2000US6111744 Capacitor constructions having silicon nitride dielectric materials
08/29/2000US6111742 Implementation of an intermetallic capacitor
08/29/2000US6111722 Magnetoresistance effect element having improved biasing films, and magnetic head and magnetic recording device using the same
08/29/2000US6111680 Transmitting a signal using duty cycle modulation
08/29/2000US6111649 Thickness measuring apparatus using light from slit
08/29/2000US6111637 Apparatus and method for examining wafers
08/29/2000US6111634 Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
08/29/2000US6111628 Liquid crystal display device including plural bump electrodes
08/29/2000US6111619 Method of forming polycrystalline silicon TFTs with TiN/Cu/TiN interconnections for a liquid crystal display pixel array
08/29/2000US6111513 Apparatus for detecting open circuits in parallel-wired thermo modules
08/29/2000US6111457 Internal power supply circuit for use in a semiconductor device
08/29/2000US6111439 High-speed switching regulator drive circuit
08/29/2000US6111428 Programmable logic array
08/29/2000US6111427 Logic circuit having different threshold voltage transistors and its fabrication method
08/29/2000US6111423 Method and apparatus for measuring pinch-off voltage of a field effect transistor
08/29/2000US6111325 Gettering regions and methods of forming gettering regions within a semiconductor wafer
08/29/2000US6111324 Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package
08/29/2000US6111323 Reworkable thermoplastic encapsulant
08/29/2000US6111322 Semiconductor device and manufacturing method thereof
08/29/2000US6111321 Ball limiting metalization process for interconnection
08/29/2000US6111320 Semiconductor device having a barrier film for preventing penetration of moisture
08/29/2000US6111319 Method of forming submicron contacts and vias in an integrated circuit
08/29/2000US6111318 Comprising copper tantalum for which tantalum is added in copper as a base and wherein copper tantalum has tantalum precipitated at grain boundaries of copper
08/29/2000US6111315 Semiconductor package with offset die pad
08/29/2000US6111312 Semiconductor device with leads engaged with notches
08/29/2000US6111309 Semiconductor device
08/29/2000US6111306 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
08/29/2000US6111304 Semiconductor diffused resistor and method for manufacturing the same
08/29/2000US6111298 Etch stop layer formed within a multi-layered gate conductor to provide for reduction of channel length
08/29/2000US6111297 MOS-technology power device integrated structure and manufacturing process thereof
08/29/2000US6111296 MOSFET with plural channels for punch through and threshold voltage control
08/29/2000US6111295 Semiconductor device having channel stopper portions integrally formed as part of a well
08/29/2000US6111293 Silicon-on-insulator MOS structure
08/29/2000US6111292 Semiconductor fabrication employing self-aligned sidewall spacers laterally adjacent to a transistor gate
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