Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2000
08/10/2000WO1997048032A8 Programmable metallization cell and method of making
08/10/2000DE4404445C2 Integrierte Halbleiterschaltung und Verfahren zum Testen derselben A semiconductor integrated circuit and method for testing the same
08/10/2000DE19963864A1 Copper interconnection structure for semiconductor memory, logic circuits, involves exposing interactive connection structure with copper layer to reduction plasma and forming silicon nitride film
08/10/2000DE19945820A1 Semiconductor device has an interlayer of titanium, molybdenum, tungsten or silicides or nitrides between and in contact with a connection layer and a connection pad electrode layer
08/10/2000DE19907168C1 Schichtanordnung sowie Verfahren zu deren Herstellung Layer arrangement, as well as processes for their preparation
08/10/2000DE19907127C1 Integrierte Halbleiterschaltungsanordnung mit stabilisierten Leiterbahnen Semiconductor integrated circuit device with stabilized conductor tracks
08/10/2000DE19904834A1 Mechanism for detaching, separating, and storing thin, fragile disc-shaped substrates for solar cells etc. manufacture
08/10/2000DE19904390A1 Diamond-like carbon structure, used as gate-cathode connection for a gate turn-off thyristor or gate commutated thyristor is produced on a semiconductor substrate by removing layer portions not covered by photosensitive mask
08/10/2000DE19904378A1 Verfahren zur Herstellung von Nitrid-Einkristallen A process for producing nitride crystals
08/10/2000DE19904138A1 Contact bumps, for chip embedding in a thin film structure, are produced by plating bumps in depressions in a chip-size recess filling, forming free-standing leads over the bumps and removing the filling
08/10/2000DE19903798A1 Verfahren und Anordnung zur Wärmebehandlung von flächigen Gegenständen Method and apparatus for heat treatment of flat articles
08/10/2000DE19903652A1 Housed IC units are produced by moulding insulation about circuit units wire bonded to lead element groups on an insulating film and cutting up the film to obtain individual IC units
08/10/2000DE19903597A1 Insulation trench production, for shallow trench isolation in production of dynamic random access memories having trench capacitors, comprises applying an oxidizable auxiliary layer prior to filling the trench with an insulation layer
08/10/2000DE19903200A1 Wafer surface structure production, in IC manufacture, comprises modification of a primary layout to correct manufacturing or technology related faults
08/10/2000DE19903195A1 Multilevel metal wiring used in semiconductor chip production is improved in quality by carrying out an integrated annealing or tempering step at the start of inter-level dielectric deposition
08/10/2000DE19843435C2 Burn-In-Testvorrichtung Burn-in test device
08/10/2000DE10004200A1 MOS transistor is designed such that resistance in the ON state is identical to that in specific electrode connecting supply voltage to source electrode, resulting in constant output impedance, despite manufacturing defects
08/10/2000DE10003671A1 Semiconductor component, especially a surface mountable semiconductor package, has front and back face electrodes connected to metal parts by precious metal-containing bodies or layers
08/10/2000CA2361737A1 Capacitor and method for manufacturing the same
08/10/2000CA2361715A1 Aligning device for assembling microsystems
08/09/2000EP1026929A2 Elemental piece of flexible printed wiring board and flexible printed wiring board
08/09/2000EP1026888A2 A program for use in an internet apparatus
08/09/2000EP1026827A1 Apparatus and method for proctecting a circuit during hot plugging
08/09/2000EP1026757A2 Organic electroluminescent device with a non-conductive fluorocarbon polymer layer
08/09/2000EP1026753A2 Device and method for storing information
08/09/2000EP1026752A2 Semiconductor device and method for its preparation
08/09/2000EP1026751A2 Semiconductor device and method for its preparation
08/09/2000EP1026750A1 Insulated gate field-effect transistors
08/09/2000EP1026749A1 Semiconductor device and method for fabricating the same
08/09/2000EP1026746A2 Gain cell DRAM structure
08/09/2000EP1026745A2 Field-shield-trench isolation for trench capacitor DRAM
08/09/2000EP1026740A2 Formation of isolation layer over trench capacitor
08/09/2000EP1026739A1 Selective salicide process by reformation of nitride sidewall spacers
08/09/2000EP1026738A2 Novel mixed voltage CMOS process for high reliability and high performance core and I/O transistors with reduced mask steps
08/09/2000EP1026737A2 A method for fabricating a merged integrated circuit device
08/09/2000EP1026735A2 Method of dividing a wafer and method of manufacturing a semiconductor device
08/09/2000EP1026734A2 Shallow trench isolation (STI) with bilayer of oxide-nitride for VLSI applications
08/09/2000EP1026733A1 Semiconductor device for use in a light valve device, and process for manufacturing the same
08/09/2000EP1026732A1 A method of forming a high voltage semiconductor device
08/09/2000EP1026731A1 Process for cleaning silicon semiconductor substrates
08/09/2000EP1026730A2 A method to form uniform silicide features
08/09/2000EP1026729A2 Composite member and separating method therefor, bonded substrate stack and separating method therefor, transfer method for transfer layer, and SOI substrate manufacturing method
08/09/2000EP1026728A2 Substrate and method of manufacturing the same
08/09/2000EP1026727A2 Separating apparatus, separating method, and method of manufacturing semiconductor substrate
08/09/2000EP1026726A2 Semiconductor device having an insulating film with voides and method for manufacturing the same
08/09/2000EP1026725A2 Manufacturing method for a semiconductor device
08/09/2000EP1026724A2 Method and arrangement for heat treatment of flat objects
08/09/2000EP1026590A2 Circuit board with self-test
08/09/2000EP1026549A2 Processing system
08/09/2000EP1026547A2 Reflective fly's eye condenser for EUV lithography
08/09/2000EP1026538A2 Narrow band uv laser with visible light alignment laser
08/09/2000EP1026284A1 Sputtering target and part for thin film-forming apparatus
08/09/2000EP1026283A1 Method for preparing high purity ruthenium sputtering target and high purity ruthenium sputtering target
08/09/2000EP1026281A2 Method of producing anti-corrosion member and anti-corrosion member
08/09/2000EP1026217A1 Method of producing adhesive tape for electronic parts
08/09/2000EP1026213A1 Coating fluid for forming low-permittivity silica-based coating film and substrate with low-permittivity coating film
08/09/2000EP1026208A1 Composition for reflection reducing coating
08/09/2000EP1025955A2 Chemical mechanical polishing with a moving polishing sheet
08/09/2000EP1025954A2 Apparatus and methods of substrate polishing
08/09/2000EP1025640A2 Integrated electronic circuit comprising an oscillator and passive circuit elements
08/09/2000EP1025591A1 Vertical mos transistor and method for the production thereof
08/09/2000EP1025587A1 Semiconductor flip-chip package and method for the fabrication thereof
08/09/2000EP1025584A1 Integrated electronic circuit comprising at least an electronic power component
08/09/2000EP1025583A1 Improved gapfill of semiconductor structure using doped silicate glasses with multi-step deposition/anneal process
08/09/2000EP1025582A1 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
08/09/2000EP1025581A1 Method of oxidation of semiconductor wafers in a rapid thermal processing (rtp) system
08/09/2000EP1025580A2 Improved process for production of thin layers of semiconductor material
08/09/2000EP1025579A2 Rapid thermal processing (rtp) system with rotating substrate
08/09/2000EP1025578A1 Robot blade with dual offset wafer supports
08/09/2000EP1025570A2 Method for arrangement of a buried capacitor, and a buried capacitor arranged according to said method
08/09/2000EP1025566A2 Rom and dram fabricated using a dram process
08/09/2000EP1025512A1 Software system and method for extending classifications and attributes in production analysis
08/09/2000EP1025511A1 Software system and method for graphically building customized recipe flowcharts
08/09/2000EP1025470A2 Process for determining possible configurations of machining plants
08/09/2000EP1025463A1 Lens array photolithography
08/09/2000EP1025409A1 Improved chemical drying and cleaning system
08/09/2000EP1025279A1 Introducing process fluid over rotating substrates
08/09/2000EP1025278A1 Vertically-stacked process reactor and cluster tool system for atomic layer deposition
08/09/2000EP1025276A1 Device and method for detecting and preventing arcing in rf plasma systems
08/09/2000EP1024965A1 Process for removing residues from a semiconductor substrate
08/09/2000EP1024953A1 Use of glass laminate as a substrate in semiconductor devices
08/09/2000EP0978146A4 Columnar-grained polycrystalline solar cell substrate and improved method of manufacture
08/09/2000EP0611484B1 PROCESS FOR PRODUCING A Si/FeSi2-HETEROSTRUCTURE
08/09/2000CN1262787A II-VI semiconductor component with at least one junction between Se-containing layer and BeTe containing layer and method for producing said junction
08/09/2000CN1262784A Semiconductor device and method for manufacturing same, circuit substrate, and electronic device
08/09/2000CN1262596A Method for making multi-layer circuit board by substrate with open
08/09/2000CN1262539A Technology for making luminous element of optical ridge waveguide semiconductor
08/09/2000CN1262529A Micro-driver and its manufacturing method
08/09/2000CN1262527A Dynamic RAM
08/09/2000CN1262526A Diffusing buried polar plate slot DRAM unit array
08/09/2000CN1262525A Semiconductor device with common position contact zone
08/09/2000CN1262524A Improved cavity type ball-shaped grid array circuit encapsulating method
08/09/2000CN1262523A Technique for producing semiconductor device
08/09/2000CN1262460A Technique for making X-ray mask
08/09/2000CN1262443A Radiation effect detector for satellite
08/09/2000CN1262342A Ruthenium film
08/09/2000CN1262216A Method for making conveying tray cycle by using module IC to operate lifting unit and device therefor
08/08/2000USRE36813 Semiconductor memory device having an improved wiring and decoder arrangement to decrease wiring delay
08/08/2000USRE36810 Plasma processing apparatus and method
08/08/2000US6101623 Current reduction circuit for testing purpose
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