Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2000
08/08/2000US6099241 Substrate transfer method and substrate transfer cassette
08/08/2000US6099238 Two-armed transfer robot
08/08/2000US6099059 Device for the transfer of an object between at least two locations
08/08/2000US6099056 Non-contact holder for wafer-like articles
08/08/2000US6098901 Apparatus for dispensing slurry
08/08/2000US6098868 Bump forming method and bump bonder
08/08/2000US6098867 Automated brush fluxing system for application of controlled amount of flux to packages
08/08/2000US6098809 Storage container for precision substrates
08/08/2000US6098808 Cassette case for holding substrates therein
08/08/2000US6098786 Slippable roller conveyor for a cleanroom
08/08/2000US6098643 Bath system for semiconductor wafers with obliquely mounted transducers
08/08/2000US6098641 Motor drive assembly for a semiconductor wafer processing system
08/08/2000US6098639 Wet cleans for composite surfaces
08/08/2000US6098638 Polishing a surface of a semiconductor substrate using polishing cloth by supplying a slurry onto the surface of the substrate, polishing until substrate gets a thickness, causing zeta potential on the abrasive particles
08/08/2000US6098610 Wire saw and method of using it
08/08/2000US6098568 Mixed frequency CVD apparatus
08/08/2000US6098460 Acceleration sensor and shock detecting device using the same
08/08/2000US6098304 Apparatus for reducing delamination within a polycide structure
08/08/2000US6098283 Method for filling vias in organic, multi-layer packages
08/08/2000US6098280 Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes
08/08/2000US6098279 Method for making heat sink device
08/08/2000US6098278 Method for forming conductive epoxy flip-chip on chip
08/08/2000CA2091438C Semiconductor chip assemblies, methods of making same and components for same
08/03/2000WO2000045442A1 Method for producing a thin film
08/03/2000WO2000045439A1 Device providing protection against electrostatic discharges for microelectronic components on a soi-type substrate
08/03/2000WO2000045437A1 Method of setting back bias of mos circuit, and mos integrated circuit
08/03/2000WO2000045436A1 Method and apparatus for elimination of parasitic bipolar action in complementary oxide semiconductor (cmos) silicon on insulator (soi) circuits
08/03/2000WO2000045435A1 Polyimides used as microelectronic coatings
08/03/2000WO2000045434A1 Integrated circuit device, electronic module for chip card using said device and method for making same
08/03/2000WO2000045433A1 Contactor holding mechanism and automatic change mechanism for contactor
08/03/2000WO2000045432A1 Drivingly rotatable mechanism of specimen loading table and specimen loading mechanism
08/03/2000WO2000045431A1 Method of packaging semiconductor device using anisotropic conductive adhesive
08/03/2000WO2000045429A1 Method for fabricating semiconductor integrated circuit device
08/03/2000WO2000045428A1 Method for levelling the edge of a semiconductor wafer and corresponding levelling machine
08/03/2000WO2000045427A1 Method and apparatus for plasma processing
08/03/2000WO2000045426A1 Method for fabricating thin film semiconductor devices
08/03/2000WO2000045425A1 Etching system and etching chamber
08/03/2000WO2000045424A1 Morphed processing of semiconductor devices
08/03/2000WO2000045422A2 Inflatable slit/gate valve
08/03/2000WO2000045421A2 Wafer edge engineering method and device
08/03/2000WO2000045244A1 Integration of security modules on an integrated circuit
08/03/2000WO2000045223A1 Positively photosensitive resin composition
08/03/2000WO2000045222A1 Photolithography mask and method of manufacturing thereof
08/03/2000WO2000045196A2 Method and device for optically examining structured surfaces of objects
08/03/2000WO2000045182A1 Deflection device
08/03/2000WO2000045067A1 Method and device for vibration control
08/03/2000WO2000044867A1 Acidic composition containing fluoride for removal of photoresists and etch residues
08/03/2000WO2000044653A1 Substrate carrier as batchloader
08/03/2000WO2000036892A8 Device for increasing heat transfer
08/03/2000WO2000028578A3 Improved megasonic cleaner
08/03/2000WO2000019509A3 Method of manufacturing a semiconductor device with a field effect transistor
08/03/2000WO2000007915A9 Port door retention and evacuation system
08/03/2000WO2000007030A9 Particle beam current monitoring technique
08/03/2000WO2000005763A9 Method of producing an interconnect structure for an integrated circuit
08/03/2000WO2000003422A3 Gas flow control in a substrate processing system
08/03/2000WO1999065065B1 Etching process for producing substantially undercut free silicon on insulator structures
08/03/2000DE19962868A1 Burn-in-board for performing burn-in-test of semiconductor device e.g. LSI, IC, has substrate consisting of protrusion and connector which are connected to burn-in-apparatus
08/03/2000DE19905080A1 Connecting hump processing method, on contact surface area of chip
08/03/2000DE19903486A1 Verfahren und Vorrichtung zur optischen Untersuchung von strukturierten Oberflächen von Objekten Method and apparatus for optical examination of structured surfaces of objects
08/03/2000DE19903245A1 Leistungshalbleitermodul The power semiconductor module
08/03/2000DE19902450A1 Miniaturized electronic system has chip and carrier mechanically and electrically connected by direct chip bonding using flip-chip technology via annular bond seal(s) and contact bump(s)
08/03/2000DE19853060A1 Cutting or grinding jig especially for preparing and polishing silicon wafers
08/03/2000DE10003073A1 Covered electrical connection used for testing semiconductor wafers contains a connecting track electrically joined to one end of a connecting structure made of conducting material on a substrate
08/03/2000DE10003066A1 Semiconductor sensor, e.g. an acceleration, yaw rate or vibration sensor, has electrical insulators between a frame portion and a mobile or stationary electrode
08/03/2000DE10003065A1 Light emitting semiconductor device, especially LED, production comprises low rate growth of a highly mismatched layer on an upper cladding layer
08/03/2000DE10002121A1 Herstellung einer Halbleitervorrichtung mit flachen Sperrschichten Manufacturing a semiconductor device having flat barrier layers
08/02/2000EP1024565A2 Method for fabricating a semiconductor optical device
08/02/2000EP1024537A2 Insulated gate field effect transistor having a buried region and method of making the same
08/02/2000EP1024536A2 Semiconductor integrated circuit having an improved grounding structure
08/02/2000EP1024534A2 Device comprising thermally stable, low dielectric constant material
08/02/2000EP1024533A2 Thick-film paste with insoluble additive
08/02/2000EP1024532A2 Semiconductor device and method of producing the same
08/02/2000EP1024531A2 Semiconductor wafer and device having columnar electrodes
08/02/2000EP1024530A1 Semiconductor power module
08/02/2000EP1024529A2 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board
08/02/2000EP1024528A2 Semiconductor device and method for manufacturing same
08/02/2000EP1024527A2 Method for obtaining a multi-value ROM in an EEPROM process flow
08/02/2000EP1024526A1 An integrated circuit device having a planar interlevel dielectric layer
08/02/2000EP1024525A1 Integrated power structure for radio-frequency applications
08/02/2000EP1024524A2 Deposition of dielectric layers using supercritical CO2
08/02/2000EP1024523A1 Method for fabricating thin film semiconductor devices
08/02/2000EP1024522A1 Exposure method and aligner
08/02/2000EP1024521A2 Process for production of semiconductor device
08/02/2000EP1024520A2 Reticle adapter for a reactive ion etch system
08/02/2000EP1024519A2 Ion beam implantation using conical magnetic scanning
08/02/2000EP1024499A2 Semiconductor memory device and method of operation
08/02/2000EP1024498A2 Semiconductor memory device and method of operation
08/02/2000EP1024497A2 Semiconductor memory device and method of operation
08/02/2000EP1024431A2 Antifuse circuitry for post-package dram repair
08/02/2000EP1024408A2 EUV condenser with non-imaging optics
08/02/2000EP1024369A1 Characterization of a semiconductor/dielectric interface by photocurrent measurements
08/02/2000EP1024366A1 Test method of semiconductor device and anisotropic conductive film therefor
08/02/2000EP1024210A1 Apparatus and method for producing tungsten nitride film
08/02/2000EP1023932A1 Gas purifying cyclone
08/02/2000EP1023771A1 Electrical impedance matching system and method
08/02/2000EP1023745A1 Reduction of gate-induced drain leakage in semiconductor devices
08/02/2000EP1023744A1 Process for the preparation of silicon wafers having a controlled distribution of oxygen precipitate nucleation centers
08/02/2000EP1023743A2 Composite electrical contact structure and method for manufacturing the same
08/02/2000EP1023681A1 System for logic extraction from a layout database
08/02/2000EP1023645A1 Automated substrate processing systems and methods
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