Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2000
09/07/2000DE10010871A1 Semiconductor wafer processing system, generating downwards directed pure air laminar stream at front side of drier units
09/07/2000DE10010865A1 Notch-cutting of e.g. thinly-layered laminate forming ceramic capacitors, employs computerized optical examination of first cut to determine alignment of second precision cut, all executed on only one machine
09/07/2000DE10008580A1 Semiconductor memory, especially non-volatile memory with ferroelectric capacitors, has source-drain region formed before producing gate in trench self-aligned with the source-drain region
09/07/2000DE10003505A1 Translucent alumina sintered compact manufacture for fluorescent tube of sodium discharge lamp, by sintering alumina powders with BET surface areas by adding auxiliary sintering agent under hydrogen atmosphere
09/07/2000DE10003101A1 Logic circuit delay restriction generation processing apparatus for logic synthesis, allocates delay restriction value to each hierarchy of logic circuit and outputs to memory for logic synthesis
09/07/2000DE10002316A1 Photomask has transparent base and shading structure contg. polygonal circuit structure with inclined line printed out as series of steps with number of rectangles of defined width
09/06/2000EP1033811A2 Monolithic fixed active equalizer
09/06/2000EP1033763A1 Method of manufacturing a compound semiconductor thin film and a solar cell using the thin film
09/06/2000EP1033759A2 MOS-gated device having a buried gate and process for forming same
09/06/2000EP1033758A2 Bipolar transistor and process for fabricating the same
09/06/2000EP1033757A2 Insulated gate bipolar transistor
09/06/2000EP1033755A2 Semiconductor device and manufacturing method thereof
09/06/2000EP1033753A2 Semiconductor memory device with dummy components in a continuous diffusion region
09/06/2000EP1033752A2 Dual work function CMOS device
09/06/2000EP1033751A2 Method for forming buried layers with top-side contacts and the resulting structure
09/06/2000EP1033750A1 Vacuum processing device
09/06/2000EP1033749A2 Method and producing ceramic multilayer substrate
09/06/2000EP1033748A1 New Indium implanted SiGe alloy transistor and methods of manufacturing it
09/06/2000EP1033747A2 An improved method for depositing and planarizing fluorinated BPSG films
09/06/2000EP1033746A1 Method of forming film by plasma
09/06/2000EP1033745A2 Method for forming a barrier layer for use in a copper interconnect
09/06/2000EP1033744A2 Improved dry photolithography process for deep ultraviolet exposure
09/06/2000EP1033741A2 Charged-particle beam lithography system
09/06/2000EP1033738A1 Device for the electrostatic deflection of a particle beam
09/06/2000EP1033654A1 Buffered communication between entities operating at different data rates
09/06/2000EP1033350A1 Synthetic quartz glass member for use in ArF excimer laser lithography
09/06/2000EP1032949A1 Semiconductor element, especially a solar cell, and method for the production thereof
09/06/2000EP1032948A1 Apparatus for retaining a workpiece
09/06/2000EP1032947A1 Uhv-compatible in-situ pre-metallization clean and metallization of semiconductor wafers
09/06/2000EP1032946A1 Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
09/06/2000EP1032945A1 Method and apparatus for reducing thermal gradients within a ceramic wafer support pedestal
09/06/2000EP1032943A2 Method for producing plasma by microwave irradiation
09/06/2000EP1032723A1 Method and apparatus for misted deposition of thin films
09/06/2000EP1032615A1 Process for preparing metal oxide slurry suitable for semiconductor chemical mechanical polishing
09/06/2000EP1032482A1 Method and device for thermally bonding connecting surfaces of two substrates
09/06/2000EP0880793B1 Large area uniform ion beam formation
09/06/2000EP0875607B1 Silicon single crystal with no crystal defects in peripheral part of wafer
09/06/2000EP0706714B1 Soi substrate fabrication
09/06/2000EP0704145B1 Method of manufacturing a device, by irradiating some parts of the surface of the device directly through a mask, and other parts indirectly through the mask and via a reflecting surface, thereby producing a pattern
09/06/2000EP0698282B1 Method for etching silicon oxide layers using mixtures of HF and carboxylic acid
09/06/2000EP0637402B1 Method of making a dual-poly non-volatile memory device using a third polysilicon layer
09/06/2000CN2395384Y Automatic displacement device for chip welding point gap
09/06/2000CN1265775A Method for configuring semiconductors with high precision, good homogeneity and reproducibility
09/06/2000CN1265618A Improved polishing pads and methods relating thereto
09/06/2000CN1265501A Manufacture of metal band for packing IC card module
09/06/2000CN1265470A Gripping jaw of gripping device for use in modular integrated circuit information processor
09/06/2000CN1265451A Semiconductor device, microdrive, microvalve and microrelay using the same and manufacture thereof
09/06/2000CN1056248C Manufacturing method of electrostatic induction thyration transistor and its device
09/05/2000US6115783 Integrated circuit
09/05/2000US6115538 Steam supplying apparatus and method for controlling same
09/05/2000US6115450 X-ray fluorescence analyzer capable of determining the center of a sample
09/05/2000US6115315 Semiconductor memory device adapted for large capacity and high-speed erasure
09/05/2000US6115309 Sense amplifier having increased drive current capability
09/05/2000US6115301 Semiconductor memory device having defect relieving system using data line shift method
09/05/2000US6115298 Semiconductor device with automatic impedance adjustment circuit
09/05/2000US6115288 Semiconductor memory device
09/05/2000US6115287 Nonvolatile semiconductor memory device using SOI
09/05/2000US6115285 Device and method for multi-level charge/storage and reading out
09/05/2000US6115283 Semiconductor device with programming capacitance element
09/05/2000US6115281 Methods and structures to cure the effects of hydrogen annealing on ferroelectric capacitors
09/05/2000US6115279 System with meshed power and signal buses on cell array
09/05/2000US6115233 Integrated circuit device having a capacitor with the dielectric peripheral region being greater than the dielectric central region
09/05/2000US6115175 UV image forming optical system
09/05/2000US6115120 System and method for detecting particles produced in a process chamber by scattering light
09/05/2000US6115107 Exposure apparatus
09/05/2000US6115094 Reflection type display device and electronic device
09/05/2000US6114923 Switching circuit and semiconductor device
09/05/2000US6114906 Differential amplifier circuit
09/05/2000US6114900 Manufacturing independent constant current power source
09/05/2000US6114889 Phase locked loop for recovering clock
09/05/2000US6114866 Semiconductor device test board and method for evaluating semiconductor devices
09/05/2000US6114864 Probe card with plural probe tips on a unitary flexible tongue
09/05/2000US6114811 Electromagnetic high-frequency apparatus with a transmission wall having antennas
09/05/2000US6114780 Electromagnetic actuating mechanism
09/05/2000US6114768 Surface mount die by handle replacement
09/05/2000US6114767 EEPROM semiconductor device and method of fabricating the same
09/05/2000US6114765 Titanium silicide film which has a high heat resistance and a low sheet resistance comprising a titanium silicide film containing a refractory metal having a higher melting point than titanium in the form of a substitutional solid solution
09/05/2000US6114764 Insulating layer on semiconductor body; titanium nitride barrier metal layer on insulating layer; aluminum based alloy having crystallographic axis inclined by an angle of 0 to 5 degrees with respect to a normal of the barrier metal layer
09/05/2000US6114763 Semiconductor package with translator for connection to an external substrate
09/05/2000US6114762 Atomic wire and atomic wire switch
09/05/2000US6114760 Ball grid array (BGA) semiconductor package member
09/05/2000US6114754 Tape automated bonding film
09/05/2000US6114753 Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
09/05/2000US6114747 Process design for wafer edge in VLSI
09/05/2000US6114746 Vertical PNP transistor and relative fabrication method
09/05/2000US6114744 Semiconductor integration device and fabrication method of the same
09/05/2000US6114743 Well isolation bipolar transistor
09/05/2000US6114742 Semiconductor device including crystal defect
09/05/2000US6114741 Trench isolation of a CMOS structure
09/05/2000US6114738 Intrinsic p-type HgCdTe using CdTe capping layer
09/05/2000US6114736 Prevent migration of dopant atoms from polysilicon(ps) layer into the tungsten silicide(wsi) layer in post gate conductor (gc) heat cycles; gate electrode of: doped ps layer on gate oxide layer; tungsten-nitride dopant barrier layer; wsi layer
09/05/2000US6114735 Conductive gate region comprises a conductive metal nitride layer having laterally opposing dielectric nitride containing regions thereagainst which are thicker than the conductive metal nitride layer
09/05/2000US6114734 Transistor structure incorporating a solid deuterium source for gate interface passivation
09/05/2000US6114733 Surface protective layer for improved silicide formation
09/05/2000US6114732 Field effect transistor
09/05/2000US6114730 Semiconductor device and its manufacturing method
09/05/2000US6114729 Plural wells structure in a semiconductor device
09/05/2000US6114728 MIS semiconductor device having a tapered top gate and a capacitor with metal oxide dielectric material
09/05/2000US6114727 Semiconductor device
09/05/2000US6114725 Structure for folded architecture pillar memory cell