Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2000
09/05/2000US6113754 Sputtering apparatus having a target backing plate equipped with a cooling line and sputtering method using the same
09/05/2000US6113750 Method of forming thin metal films
09/05/2000US6113736 Gas ring apparatus for semiconductor etching
09/05/2000US6113734 Apparatus for opening/closing a process chamber door of ovens used for manufacturing semiconductor devices
09/05/2000US6113733 Apparatus and method for optical evaluation, apparatus and method for manufacturing semiconductor device, method of controlling apparatus for manufacturing semiconductor device, and semiconductor device
09/05/2000US6113732 Deposited film forming apparatus
09/05/2000US6113731 Magnetically-enhanced plasma chamber with non-uniform magnetic field
09/05/2000US6113730 Metal-foil-clad composite ceramic board and process for the production thereof
09/05/2000US6113728 Forming filmy adhesive layer comprising liquid epoxy resin, solid resin and micro-capsule curing agent on surfaces of projecting electrodes of semiconductor wafer; cutting wafer along with adhesive layer to form chips; curing adhesive
09/05/2000US6113721 Method of bonding a semiconductor wafer
09/05/2000US6113718 Method for manufacturing a solar cell module having photovoltaic cell sandwiched between covering materials
09/05/2000US6113709 Method of preparing a conductive bonding pad
09/05/2000US6113705 High-speed rotational vapor deposition apparatus and high-speed rotational vapor deposition thin film method
09/05/2000US6113704 Substrate-supporting device for semiconductor processing
09/05/2000US6113703 Method and apparatus for processing the upper and lower faces of a wafer
09/05/2000US6113702 Wafer support system
09/05/2000US6113701 Semiconductor device, manufacturing method, and system
09/05/2000US6113700 Gas diffuser having varying thickness and nozzle density for semiconductor device fabrication and reaction furnace with gas diffuser
09/05/2000US6113699 Purging gas control structure for CVD chamber
09/05/2000US6113698 Degassing method and apparatus
09/05/2000US6113697 Method of and apparatus for coating a wafer with a minimal layer of photoresist
09/05/2000US6113695 Coating unit
09/05/2000US6113694 Substrate treatment apparatus
09/05/2000US6113691 Subjecting substrate to organometallic and hydride precursor compounds in epitaxy reactor at ultra low pressure, whereby organometallic and hydride precursor compounds react at substrate surface without substantial reaction in gas phase
09/05/2000US6113689 Method of crystallizing amorphous silicon layer
09/05/2000US6113687 Method for making a silicon single crystal wafer
09/05/2000US6113685 Method for relieving stress in GaN devices
09/05/2000US6113490 Work unloading method and surface polishing apparatus with work unloading mechanism
09/05/2000US6113467 Polishing machine and polishing method
09/05/2000US6113465 Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context
09/05/2000US6113341 Tracking cart system
09/05/2000US6113165 Self-sensing wafer holder and method of using
09/05/2000US6113056 Workpiece vibration damper
09/05/2000US6112975 Method for attaching spherical and/or non-spherical contacts to a substrate
09/05/2000US6112974 Wire bonding method
09/05/2000US6112973 Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe
09/05/2000US6112969 Wire bonding apparatus
09/05/2000US6112905 Automatic semiconductor part handler
09/05/2000US6112795 Fixture for multi-layered ceramic package assembly
09/05/2000US6112697 RF powered plasma enhanced chemical vapor deposition reactor and methods
09/05/2000US6112431 Vacuum processing and operating method
09/05/2000US6112430 Vacuum dryer and method of drying semiconductor device using the same
09/05/2000US6112355 Overflow scrub-washing method and apparatus
09/05/2000CA2299813A1 Method for manufacturing semiconductor device capable of avoiding flaws and erosion caused by metal cmp process
09/05/2000CA2073236C Process and apparatus for the ignition of cvd plasmas
09/03/2000CA2264226A1 Clean box
08/2000
08/31/2000WO2000051188A1 Flash memory cell with self-aligned gates and fabrication process
08/31/2000WO2000051184A1 Semiconductor integrated circuit device
08/31/2000WO2000051179A1 Method of manufacturing a leadframe assembly
08/31/2000WO2000051177A1 Integrated circuit device with air dielectric
08/31/2000WO2000051176A1 Method for producing an integrated electrical circuit
08/31/2000WO2000051175A1 Method for fabricating ferroelectric field effect transistor
08/31/2000WO2000051174A1 A method of processing a polymer layer
08/31/2000WO2000051173A1 Method of treating an insulating layer
08/31/2000WO2000051171A1 MINIATURISED CAPACITOR WITH SOLID DIELECTRIC, ESPECIALLY FOR INTEGRATED SEMICONDUCTOR MEMORIES, E.G. DRAMs, AND METHOD FOR PRODUCING THE SAME
08/31/2000WO2000051170A1 Device and method for thermally treating substrates
08/31/2000WO2000051168A2 Slurry delivery control apparatus and method
08/31/2000WO2000051165A2 Misfet with narrow bandgap source
08/31/2000WO2000051134A1 Semiconductor device
08/31/2000WO2000051012A2 Integrated circuit interconnect system
08/31/2000WO2000050514A1 Resin composition and jig for use in transportation
08/31/2000WO2000050223A1 Microelectronic workpiece support and apparatus using the support
08/31/2000WO2000050198A1 Method for machining work by laser beam
08/31/2000WO2000021860A9 Magnetic hard disk transportation system
08/31/2000WO2000019506A9 Method of plasma etching dielectric materials
08/31/2000DE19962422A1 Multilayer printed circuit board manufacturing method involves electro plating metal layer and etching it after which ink layer and sheet portion between slots are removed
08/31/2000DE19922559A1 IC leadframe mounting method
08/31/2000DE19908749A1 Attaining uniform temperature distribution for semiconductor component soldered on carrier in systems with efficient cooler
08/31/2000DE19908625A1 Vorrichtung und Verfahren zum Aufbringen von Klebermaterial auf flächige Bauteile sowie dessen Verwendung Apparatus and method for applying adhesive material onto planar components and the use thereof
08/31/2000DE19908526A1 Beleuchtungssystem mit Feldspiegeln zur Erzielung einer gleichförmigen Scanenergie Illumination system with field mirrors to achieve a uniform scanning energy
08/31/2000DE19907621A1 Etching mask used in dry etching processes for microelectronics comprises an electrically conducting layer between a masking layer on a structuring layer
08/31/2000DE19907601A1 Verfahren sowie Anordnung zum kontinuierlichen Behandeln von Gegenständen Method and arrangement for the continuous treatment of objects
08/31/2000DE19907497A1 Vorrichtung und Verfahren zum thermischen Behandeln von Substraten Apparatus and method for thermal treatment of substrates
08/31/2000DE19907176A1 Decoder-Anschlußanordnung für Speicherchips mit langen Bitleitungen Decoder connection arrangement for memory chips with long bitlines
08/31/2000DE19906960A1 Forming metal structures in NM range on conductive surfaces of substrates for miniature electronic components
08/31/2000DE19906814A1 Surface material removal, especially for hard mask removal from a semiconductor surface, comprises removing material while protecting the rest of the surface with a temporary layer
08/31/2000DE19906398A1 Verfahren und Vorrichtung zum Behandeln von Substraten Method and apparatus for treating substrates
08/31/2000DE19906209A1 Cutting out individual circuit units from panel, using high speed milling of e.g. 1000 m per min
08/31/2000DE19905807A1 Verfahren zur Herstellung elektrisch leitender Verbindungen A process for producing electrically conductive connections
08/31/2000DE19905751A1 Innenlochsäge und Verfahren zum Justieren einer Düse und eines Sensors einer Innenlochsäge relativ zu einem Sägeblatt der Innenlochsäge Keyhole saw and method for adjusting a nozzle and a sensor relative to an annular saw a saw blade of the annular saw
08/31/2000DE19905750A1 Internal-hole saw with clamping edge protection, with element partly shielding clamping edge
08/31/2000DE19905737A1 New double-sided polished semiconductor wafer has extremely low front face site front surface-referenced least squares ratio planarity values varying insignificantly between the wafer edge and central regions
08/31/2000DE19901291A1 Vorrichtung zur Ätzbehandlung eines scheibenförmigen Gegenstandes An apparatus for etching a wafer-shaped article
08/31/2000DE10000362A1 Detecting structured substrates defects involves scanning charged particle beam over substrate with optical column stationary w.r.t. surface, comparing detected images with reference
08/30/2000EP1032099A2 Semiconductor device and method of fabricating the same
08/30/2000EP1032098A2 Laser oscillating apparatus
08/30/2000EP1032097A2 Laser oscillating apparatus
08/30/2000EP1032052A1 Method of manufacturing silicon based thin film photoelectric conversion device
08/30/2000EP1032048A1 Insulated-gate semiconductor element and method for manufacturing the same
08/30/2000EP1032044A2 Semiconductor memory cell
08/30/2000EP1032043A2 Semiconductor memory device with twisted bit lines
08/30/2000EP1032041A2 Semiconductor device comprising an internal wiring pattern
08/30/2000EP1032040A2 Metal wire fuse structure with cavity
08/30/2000EP1032039A2 Vertical fuse and method of fabrication
08/30/2000EP1032037A2 Resin-moulded semiconductor device, method for manufacturing the same, and leadframe
08/30/2000EP1032036A2 Semiconductor device and process for fabrication thereof
08/30/2000EP1032035A1 Process for manufacturing electronic memory devices with cells matrix having virtual ground
08/30/2000EP1032034A1 Method of making memory device
08/30/2000EP1032033A2 Method of forming dual metal gate structures for CMOS devices
08/30/2000EP1032032A2 Tailoring of a wetting/barrier layer to reduce electromigration in an aluminium interconnect
1 ... 5485 5486 5487 5488 5489 5490 5491 5492 5493 5494 5495 5496 5497 5498 5499 5500 5501 5502 5503 5504 5505 ... 6590