Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2000
08/24/2000WO2000014776A3 Non-oxygen precipitating czochralski silicon wafers
08/24/2000WO2000013236A3 Layered dielectric on silicon carbide semiconductor structures
08/24/2000WO2000003419A3 Wafer cleaning apparatus
08/24/2000WO2000002234A3 Method and device for cleaning substrates
08/24/2000DE19917064A1 Manufacture of laminated structure with lower and top layers, between which can be sandwiched intermediate layer for manufacture of semiconductor on insulator (SOI) discs
08/24/2000DE19906396A1 Automatic defective pattern identification device for wafer inspection, obtains defective pattern vector by multiplying test result vector with conversion matrix
08/24/2000DE19906384A1 Insulated gate bipolar transistor with electric pn-junction insulation of adjacent components
08/24/2000DE19906291A1 Semiconductor structure, especially a word line structure for memory circuit MOS transistor programming, comprises a conductor line separated from a substrate insulating layer by a cavity and enclosed by an insulating cover
08/24/2000DE19906224A1 Drawing off unit, e.g. for drawing off particles in the production of electronic components, comprises a main suction pipe, inner and outer suction pipes, and a cleansing fluid.
08/24/2000DE10007983A1 Circuit for measuring power currents circuit for measuring power currents for burn-in test; sets current measurement circuit and power supply circuit for high currents and measurement and power supply circuit for weak currents
08/24/2000DE10003014A1 SOI structure, for merged logic DRAMs, is produced by forming a protective side wall over a trench side wall oxide layer prior to trench filling
08/24/2000DE10002809A1 Variable resistor for signal transmission line, has lower wiring layer connected with resistance layer by contact group which encloses a portion for connecting upper wiring layer and resistance layer of element
08/24/2000CA2371771A1 Method for producing building components, use thereof, airbearing workpiece and vacuum treatment chamber
08/24/2000CA2362694A1 Wafer processing reactor having a gas flow control system and method
08/24/2000CA2328907A1 Electrode for semiconductor device and its manufacturing method
08/23/2000EP1030535A1 Heat treatment device of the light irradiation type
08/23/2000EP1030444A2 Surface acoustic wave device and method for manufacturing the same
08/23/2000EP1030378A2 Semiconductor luminescent element and method of manufacturing the same
08/23/2000EP1030373A1 Power semiconductor diode with insulated gate and manufacturing method thereof
08/23/2000EP1030372A2 Method of making an IGBT device
08/23/2000EP1030371A1 Field-effect transistor
08/23/2000EP1030369A1 Multichip module structure and method for manufacturing the same
08/23/2000EP1030367A2 Integrated semiconductor device with stabilized conductive lines
08/23/2000EP1030366A2 Printed wiring board for semiconductor plastic package
08/23/2000EP1030364A2 Laminated ceramic with multilayer electrodes and method of fabrication
08/23/2000EP1030363A2 Integration of bipolar and CMOS devices for sub-0.1 micrometer transistors
08/23/2000EP1030362A2 Method of forming trench capacitor DRAM cell
08/23/2000EP1030361A1 Manufacturing method of semiconductor device using a dual damascene process
08/23/2000EP1030360A2 Electrical test structure on a semiconductor substrate and testing method
08/23/2000EP1030359A2 Layered structure and method of making it
08/23/2000EP1030358A1 Flip-chip member, sheetlike sealing material, semiconductor device, and process for manufacturing the same
08/23/2000EP1030356A2 Process of fabricating semiconductor device
08/23/2000EP1030353A1 Anisotropic plasma etching of a dielectric, organic polymer material
08/23/2000EP1030352A2 Method and apparatus for forming materials layers from atomic gases
08/23/2000EP1030350A1 System and method for producing and supplying highly clean dry air
08/23/2000EP1030349A2 Method and apparatus for treating components mounted on a substrate, in particular semiconductor chips
08/23/2000EP1030347A1 Device for treatment of a substrate
08/23/2000EP1030344A2 Continuously variable aperture for high-energy ion implanter
08/23/2000EP1030343A2 Method & system for operating a variable aperture in an ion implanter
08/23/2000EP1030311A1 Decoder connection for memory chips with long bit lines
08/23/2000EP1030221A1 Photoresist compositions comprising blends of photoacid generators
08/23/2000EP1030126A1 Dehumidification/humidification air supply apparatus
08/23/2000EP1030089A2 Method and apparatus for removing processing liquid from a processing liquid path
08/23/2000EP1029948A2 Using electroplated cu as cold layer for cold/hot deposition
08/23/2000EP1029943A1 Process for producing barrier film
08/23/2000EP1029942A1 Drive mechanism for vacuum device and vacuum device
08/23/2000EP1029907A1 Process for mechanical chemical polishing of a layer of aluminium or aluminium alloy conducting material
08/23/2000EP1029632A2 Abrasive machine
08/23/2000EP1029600A1 Cleaning device
08/23/2000EP1029369A1 Process for fabricating organic semiconductor devices using ink-jet printing technology and device and system employing same
08/23/2000EP1029368A1 Semiconductor substrate and method for making the same
08/23/2000EP1029365A1 Shielded integrated circuit capacitor
08/23/2000EP1029364A1 Memory device having a crested tunnel barrier
08/23/2000EP1029363A2 A SEMICONDUCTOR DEVICE OF SiC AND A TRANSISTOR OF SiC HAVING AN INSULATED GATE
08/23/2000EP1029362A1 Semiconductor component
08/23/2000EP1029360A2 Vertical interconnect process for silicon segments with dielectric isolation
08/23/2000EP1029359A1 Quantum ridges and tips
08/23/2000EP1029355A1 Asic routing architecture
08/23/2000EP1029354A1 Porous silicon oxycarbide integrated circuit insulator
08/23/2000EP1029349A1 Titanium nitride contact plug formation
08/23/2000EP1029348A1 A system for identifying defective electronic devices
08/23/2000EP1029347A1 Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device
08/23/2000EP1029346A1 Vertical interconnect process for silicon segments with thermally conductive epoxy preform
08/23/2000EP1029345A1 Self-cleaning etch process
08/23/2000EP1029344A1 Borderless vias with hsq gap filled patterned metal layers
08/23/2000EP1029343A1 ELIMINATION OF THE TITANIUM NITRIDE FILM DEPOSITION IN TUNGSTEN PLUG TECHNOLOGY USING PE-CVD-Ti AND IN-SITU PLASMA NITRIDATION
08/23/2000EP1029342A1 Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components
08/23/2000EP1029341A1 Monitor of plasma processes with multivariate statistical analysis of plasma emission spectra
08/23/2000EP1029340A1 Apparatus and method for secondary electron emission microscope
08/23/2000EP1029257A1 Method of molecular-scale pattern imprinting at surfaces
08/23/2000EP1029251A1 Polymer optical waveguide and method for fabricating the same
08/23/2000EP1029249A2 Test head structure for integrated circuit tester
08/23/2000EP1029231A1 Method and apparatus employing external light source for endpoint detection
08/23/2000EP1029109A1 Long life high temperature process chamber
08/23/2000EP1029106A1 Method of fabricating iridium-based materials and structures on substrates, and iridium source reagents therefor
08/23/2000EP1029099A2 Apparatus and method for adjusting density distribution of a plasma
08/23/2000EP1028905A1 Integrated intrabay buffer, delivery, and stocker system
08/23/2000EP1028904A1 Disk container
08/23/2000EP1028797A1 Semiconductor manufacturing system with getter safety device
08/23/2000EP1018290A4 A system and method for packaging integrated circuits
08/23/2000EP0770266B1 Method of manufacturing a semiconductor device suitable for surface mounting
08/23/2000EP0767972B1 Linear capacitors for high temperature applications
08/23/2000EP0748518B1 Method of etching conductive lines without undercutting
08/23/2000CN1264498A Microelectronic components and electronic networks comprising DNA
08/23/2000CN1264495A Method and device for producing chip-substrate-lin
08/23/2000CN1264494A Semiconductor device, mounting structure thereof and method of fabrication thereof
08/23/2000CN1264493A Method and apparatus for chip placement
08/23/2000CN1264219A Surface sonic wave device and manufacture method thereof
08/23/2000CN1264180A Semiconductor device and manufacture method
08/23/2000CN1264179A Three-layer polycrystal cilicon inserted non-volatile memory unit and manufacture method thereof
08/23/2000CN1264178A 半导体装置 Semiconductor device
08/23/2000CN1264177A Manufacture equipment for circuit device
08/23/2000CN1264176A LOC semiconductor packaging and manufacture method thereof
08/23/2000CN1264175A 功率半导体模块 Power Semiconductor Modules
08/23/2000CN1264174A Semiconductor device sealed with resin
08/23/2000CN1264173A Semiconductor device and manufacture method
08/23/2000CN1264172A Method for producing semiconductor with double-insert technology
08/23/2000CN1264171A Method for manufacturing semiconductor device
08/23/2000CN1264170A Dyamic RAM
08/23/2000CN1264169A Device and method for testing integral circuit packaging pin welding
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