| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/19/2000 | US6119367 System for drying semiconductor wafers using ultrasonic or low frequency vibration |
| 09/19/2000 | US6119366 Chemical drying and cleaning method |
| 09/19/2000 | US6119337 Method of mounting conductive balls |
| 09/19/2000 | US6119325 High pressure water stream to separate a multi-layer integrated circuit device and package |
| 09/19/2000 | US6119295 Brush assembly apparatus |
| 09/19/2000 | US6119294 Cleaning system with automatically controlled brush pressure |
| 09/19/2000 | CA2291568A1 Flip-chip package with optimized encapsulant adhesion and method |
| 09/19/2000 | CA2199523C Method of manufacturing semiconductor device |
| 09/19/2000 | CA2132768C Photoresist strippers containing reducing agents to reduce metal corrosion |
| 09/14/2000 | WO2000054341A1 Doting pastes for producing p, p+ and n, n+ zones in semiconductors |
| 09/14/2000 | WO2000054339A1 Thin-film transistor, panel, and methods for producing them |
| 09/14/2000 | WO2000054338A1 High speed ge channel heterostructures for field effect devices |
| 09/14/2000 | WO2000054335A1 Semiconductor device comprising a non-volatile memory |
| 09/14/2000 | WO2000054334A1 Semiconductor read-only memory device with substrate contact and polysilicon bridging cells |
| 09/14/2000 | WO2000054332A1 Cooling system for pulsed power electronics |
| 09/14/2000 | WO2000054331A1 Methods of forming local interconnects and conductive lines, and resulting structure |
| 09/14/2000 | WO2000054330A1 High-reliability damascene interconnect formation for semiconductor fabrication |
| 09/14/2000 | WO2000054329A1 Semiconductor device and production method therefor |
| 09/14/2000 | WO2000054328A1 Production method for semiconductor device |
| 09/14/2000 | WO2000054327A1 Method of producing a trench isolation for electrically active components |
| 09/14/2000 | WO2000054326A1 Trench isolation for electrically active components |
| 09/14/2000 | WO2000054325A1 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects |
| 09/14/2000 | WO2000054322A1 Flip chip with integrated flux and underfill |
| 09/14/2000 | WO2000054321A1 Microelectronic joining processes |
| 09/14/2000 | WO2000054320A1 Radical-assisted sequential cvd |
| 09/14/2000 | WO2000054319A1 Method of manufacturing a semiconductor device comprising a bipolar transistor and a capacitor |
| 09/14/2000 | WO2000054318A1 Method for producing a microelectronic structure |
| 09/14/2000 | WO2000054317A1 Improvements relating to annealing |
| 09/14/2000 | WO2000054315A1 Device for plasma processing |
| 09/14/2000 | WO2000054314A1 Method and apparatus for laser heat treatment, and semiconductor device |
| 09/14/2000 | WO2000054313A1 Method for producing thin film semiconductor device |
| 09/14/2000 | WO2000054312A1 Ic-compatible parylene mems technology and its application in integrated sensors |
| 09/14/2000 | WO2000054311A1 Apparatus for raising and lowering an object |
| 09/14/2000 | WO2000054310A1 Method and device for rotating a wafer |
| 09/14/2000 | WO2000054108A1 Reduction of the effects of magnification errors and reticle rotation errors on overlay errors |
| 09/14/2000 | WO2000054107A1 Step and flash imprint lithography |
| 09/14/2000 | WO2000054105A1 Hydroxy-amino thermally cured undercoat for 193 nm lithography |
| 09/14/2000 | WO2000054066A1 Cooling system for test head |
| 09/14/2000 | WO2000053824A1 Method for eliminating copper from microelectronic components |
| 09/14/2000 | WO2000053822A1 A wafer transfer system and methods for using the same |
| 09/14/2000 | WO2000053691A1 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
| 09/14/2000 | WO2000053645A1 Hydroxy-epoxide thermally cured undercoat for 193 nm lithography |
| 09/14/2000 | WO2000033622A3 Improved heat sink and process of manufacture |
| 09/14/2000 | WO2000023920A9 Approach for routing an integrated circuit |
| 09/14/2000 | WO2000021714A9 A carrier head with a flexible membrane for chemical mechanical polishing |
| 09/14/2000 | WO2000020662A9 Submicron metallization using electrochemical deposition |
| 09/14/2000 | WO2000019524A3 Ic interconnect structures and methods for making same |
| 09/14/2000 | WO2000018980A8 An in-line sputter deposition system |
| 09/14/2000 | DE4243592C2 Paralleltestschaltung für einen Halbleiter-Speicherchip Parallel test circuitry for a semiconductor memory chip |
| 09/14/2000 | DE19951269A1 Verfahren zur Charakterisierung elektronischer Eigenschaften eines Halbleiters A method for characterizing the electronic properties of a semiconductor |
| 09/14/2000 | DE19910724A1 Mikrolithographie-Projektionsobjektiveinrichtung sowie Projektionsbelichtungsanlage Microlithography projection lens apparatus and projection exposure apparatus |
| 09/14/2000 | DE19909295A1 Microelectronic structure used in semiconductor memories comprises a base substrate with an oxygen-containing iridium layer between a silicon-containing layer and an oxygen barrier layer |
| 09/14/2000 | DE19909169A1 Bonding wire feed device for semiconductor device manufacture, uses inner and outer sensors having adjoining, partial intersecting or spaced coverage areas and status monitor for controlling reel-off device and bonding process |
| 09/14/2000 | DE19909105A1 Symmetrischer Thyristor mit verringerter Dicke und Herstellungsverfahren dafür Balanced thyristor with reduced thickness and manufacturing method thereof |
| 09/14/2000 | DE19907174C1 Verfahren zum Herstellen einer DRAM-Zelle mit einem Grabenkondensator A method for manufacturing a DRAM cell capacitor having a grave |
| 09/14/2000 | DE19856575A1 Projektions-Mikrolithographiegerät Projection microlithography device |
| 09/14/2000 | DE10012150A1 Rotating wash device for washing and removal residues of grinding or abrasion of semiconductor wafers has first brush device that can be selectively moved from its working to a normal position in relation to second brush device |
| 09/14/2000 | DE10011876A1 III-V compound semiconductor, e.g. for LEDs and laser diodes, comprises two indium-gallium-aluminum nitride based semiconductor layers with an interposed different material pattern for low angle grain boundary suppression |
| 09/14/2000 | DE10006257A1 Field effect transistor has a channel layer containing a semiconducting inorganic-organic hybrid material between source and drain regions, a gate region and an electrically insulating layer |
| 09/14/2000 | DE10004623A1 Semiconductor wafer, useful for highly integrated CMOS device production, comprises a silicon substrate having a thin epitaxial layer of extremely low localized light scatterer defect surface density |
| 09/14/2000 | CA2367137A1 Dopant pastes for the production of p,p+ and n,n+ regions in semiconductors |
| 09/13/2000 | EP1035653A2 Method and apparatus for high speed on-chip signal propagation |
| 09/13/2000 | EP1035590A2 Nonvolatile ferroelectric capacitor and nonvolatile ferroelectric memory |
| 09/13/2000 | EP1035589A2 Iridium composite barrier structure and method for same |
| 09/13/2000 | EP1035588A2 Iridium conductive electrode/barrier structure and method for same |
| 09/13/2000 | EP1035587A1 Semiconductor device and method of producing the same |
| 09/13/2000 | EP1035584A1 Method and device to remove a surface marking from an integrated circuit wafer |
| 09/13/2000 | EP1035583A2 Semiconductor element and fabricating method thereof |
| 09/13/2000 | EP1035582A2 Semiconductor device and method of manufacturing the same |
| 09/13/2000 | EP1035581A2 Multilayer wiring board |
| 09/13/2000 | EP1035580A2 Method and structure for integrated circuit package |
| 09/13/2000 | EP1035579A2 Fabrication method and strcuture of an integrated circuit package |
| 09/13/2000 | EP1035578A1 Process for the production of a finned diamond heatsink |
| 09/13/2000 | EP1035576A2 A processing method of silicon epitaxial growth wafer and a processing apparatus thereof |
| 09/13/2000 | EP1035575A2 Semiconductor device |
| 09/13/2000 | EP1035574A1 Box for transferring semiconductor wafer |
| 09/13/2000 | EP1035573A1 Electrical power component soldered on a support and corresponding mounting method |
| 09/13/2000 | EP1035572A2 Method of coating semiconductor wafer with resin and mold used therefor |
| 09/13/2000 | EP1035571A1 Method of manufacturing a bipolar transistor |
| 09/13/2000 | EP1035570A2 Dry etching method |
| 09/13/2000 | EP1035569A1 Method for forming plasma films |
| 09/13/2000 | EP1035568A1 Method of plasma processing |
| 09/13/2000 | EP1035567A2 A process for fabricating a device with shallow junctions |
| 09/13/2000 | EP1035566A2 Method for forming a buried doped layer with connecting portions within a semiconductive device |
| 09/13/2000 | EP1035565A2 Method of manufacturing semiconductor device including high-temperature heat treatment |
| 09/13/2000 | EP1035564A2 Diffusion barrier for high dielectric constant materials |
| 09/13/2000 | EP1035563A1 A handling device and method for moving a pod |
| 09/13/2000 | EP1035561A2 Refractory coated component for use in thin film deposition and method for making |
| 09/13/2000 | EP1035560A1 Rotatable workpiece support including cylindrical workpiece support surfaces for an ion beam implanter |
| 09/13/2000 | EP1035446A2 Resist stripping composition and process for stripping resist |
| 09/13/2000 | EP1035445A2 Microlithographic reduction objective and projection exposure apparatus |
| 09/13/2000 | EP1035442A2 Planarizing antireflective coating compositions |
| 09/13/2000 | EP1035438A2 Phenolic resins and photoresist compositions comprising same |
| 09/13/2000 | EP1035437A2 A radiation-sensitive resist material and a process for device fabrication using the same |
| 09/13/2000 | EP1035436A1 Resist pattern formation method |
| 09/13/2000 | EP1035434A2 Photomask with unresolved auxiliary patterns |
| 09/13/2000 | EP1035236A1 Silicon single crystal wafer, epitaxial silicon wafer, and method for producing them |
| 09/13/2000 | EP1035235A1 Method for producing silicon single crystal wafer and silicon single crystal wafer |
| 09/13/2000 | EP1035183A1 Coating fluid for forming low-permittivity silica-based coating film and substrate with low-permittivity coating film |
| 09/13/2000 | EP1035084A2 Synthetic fused silica glass member |