Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2000
09/21/2000DE19911084A1 Vorrichtung zum Behandeln von Substraten Apparatus for processing substrates
09/21/2000DE19910983A1 Vorrichtung und Verfahren zur Bestimmung der lateralen Unterätzung einer strukturierten Oberflächenschicht Apparatus and method for determination of the lateral undercut of a structured surface layer
09/21/2000DE19910353A1 Halbleiter-Festwertspeicheranordnung mit Substratkontakt und Polysilizium-Überbrückungszelle Only semiconductor memory device with substrate contact and polysilicon bridging cell
09/21/2000DE10013327A1 Process for growing semiconductor crystals uses an organometallic compound, a molecular compound and diiodomethane to grow a p-doped compound semiconductor crystal
09/21/2000DE10013067A1 Semiconductor device production method, involves fastening protective layer at assembly mounting device with wafer edge removed from protective layer and wafer connected at side opposite to assembly mounting device
09/21/2000DE10011054A1 Layer structure arrangement used in the production of p-channel field effect transistors has silicon and germanium layers on a single crystalline substrate
09/21/2000CA2368265A1 Electron beam process during damascene processing
09/21/2000CA2365886A1 Calibration of sensors
09/21/2000CA2365868A1 Hydrophone assembly
09/21/2000CA2329539A1 A compact photoemission source, field and objective lens arrangement for high throughput electron beam lithography
09/20/2000EP1037506A2 Heater for high vacuum optical view port
09/20/2000EP1037388A2 Process-tolerant integrated circuit design
09/20/2000EP1037340A2 Electrode structure, process for fabricating electrode structure and semiconductor light-emitting device
09/20/2000EP1037286A1 Symmetrical thyristor with reduced thickness and manufacturing method
09/20/2000EP1037284A2 Heterojunction bipolar transistor and method for fabricating the same
09/20/2000EP1037283A1 Semiconductor memory device
09/20/2000EP1037282A1 Semiconductor memory device
09/20/2000EP1037281A1 Capacitor trench-top dielectric for self-aligned device isolation
09/20/2000EP1037280A2 Memory cell layout for reduced interaction between storage nodes and transistors
09/20/2000EP1037279A2 Display architecture supporting integrated power supply means
09/20/2000EP1037278A2 Semiconductor device structure with specifically dimensioned redundancy fuses for laser repair
09/20/2000EP1037276A1 Method for forming a porous silicon dioxide film
09/20/2000EP1037275A1 Method for forming a porous silicon oxide film
09/20/2000EP1037274A2 Electronic power device monolithically integrated on a semiconductor and comprising a first power region and at least a second region as well as an isolation structure having a limited planar dimension
09/20/2000EP1037273A2 Sense amplifier comprising field effect transistor with short channel length and adjustable threshold voltage
09/20/2000EP1037272A1 Soi substrate and process for preparing the same, and semiconductor device and process for preparing the same
09/20/2000EP1037271A2 Method for forming an interlayer insulating film, and semiconductor device
09/20/2000EP1037270A1 Wiring structure of semiconductor device, electrode, and method for forming them
09/20/2000EP1037268A1 METHOD FOR SYNTHESIZING SINGLE CRYSTAL AlN THIN FILMS OF LOW RESISTANT n-TYPE AND LOW RESISTANT p-TYPE
09/20/2000EP1037265A1 Cup-shaped DRAM capacitor and method of making the same
09/20/2000EP1037264A2 Mechanical gripper for wafer handling robots
09/20/2000EP1037263A2 Apparatus for electro-chemical deposition of copper with the capability of in-situ thermal annealing
09/20/2000EP1037261A2 Etching and cleaning methods and etching and cleaning apparatuses used therefor
09/20/2000EP1037255A2 Scanning wheel for ion implantation process chamber
09/20/2000EP1037149A2 Efficient direct cell replacement fault tolerant architecture supporting completey integrated systems with means for direct communication with system operator
09/20/2000EP1037115A2 Microlithographic projection objective and projection exposure apparatus
09/20/2000EP1037114A2 Stage control method, exposure method, exposure apparatus and device manufacturing method
09/20/2000EP1037109A2 Reticle having discriminative pattern narrower in pitch than the minimum pattern width but wider than minimum width in the pattern recognition
09/20/2000EP1037095A2 Active matrix substrate, method of manufacturing the same, and image sensor incorporating the same
09/20/2000EP1037055A2 Spring probe
09/20/2000EP1036863A1 Method for synthesizing n-type diamond having low resistance
09/20/2000EP1036860A2 Process chamber with inner support
09/20/2000EP1036859A1 Improved copper target for sputter deposition
09/20/2000EP1036858A1 Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck
09/20/2000EP1036836A1 Aqueous dispersion for chemical mechanical polishing
09/20/2000EP1036772A2 Method for producing optical quartz glass for excimer lasers and vertical-type heating furnace
09/20/2000EP1036640A1 Method for reclaiming slurry by a magnetic separator
09/20/2000EP1036632A2 Method and system of manufacturing slurry for polishing, and method and system of manufacturing semiconductor devices
09/20/2000EP1036631A1 Apparatus and method for polishing a semiconductor wafer
09/20/2000EP1036417A1 Self-aligned non-volatile contactless memory cell with reduced surface
09/20/2000EP1036414A1 Chip scale package using large ductile solder balls
09/20/2000EP1036412A1 CO-PLANAR Si AND Ge COMPOSITE SUBSTRATE AND METHOD OF PRODUCING SAME
09/20/2000EP1036411A1 Semiconductor power device manufacture
09/20/2000EP1036410A1 New etch process for forming high aspect ratio trenches in silicon
09/20/2000EP1036409A2 Method of manufacturing a semiconductor device comprising a mos transistor
09/20/2000EP1036408A1 RELAXED In x?GA (1-x)?As GRADED BUFFERS
09/20/2000EP1036407A1 Method of processing wafers with low mass support
09/20/2000EP1036406A2 Improved low mass wafer support system
09/20/2000EP1036222A1 Copper metallization of silicon wafers using insoluble anodes
09/20/2000EP1036214A1 Mixed frequency cvd process and apparatus
09/20/2000EP1036211A1 Sputtering target
09/20/2000EP1036085A1 Self-addressable self-assembling microelectronic integrated systems, component devices, mechanisms, methods, and procedures for molecular biological analysis and diagnostics
09/20/2000EP1035946A1 Method and apparatus for conditioning polishing pads utilizing brazed diamond technology and titanium nitride
09/20/2000EP1035945A1 Manufacturing a memory disk or semiconductor device using an abrasive polishing system, and polishing pad
09/20/2000EP1024965A4 Process for removing residues from a semiconductor substrate
09/20/2000EP0979529A4 DESIGN AND FABRICATION OF ELECTRONIC DEVICES WITH InA1AsSb/A1Sb BARRIER
09/20/2000EP0946894B1 Beam homogenizer
09/20/2000EP0937302A4 Spin dependent tunneling memory
09/20/2000EP0920655B1 Baths for producing microstructures
09/20/2000CN2397605Y Opening-prevention structure for IC sealing box
09/20/2000CN1267396A Multichip module structure and method for mfg. same
09/20/2000CN1267395A Semiconductor device and method of fabricating same
09/20/2000CN1267394A Component with protective layer and method for producing protective layer for component
09/20/2000CN1267393A Method for thermal self-healing of SiC semiconductor area doped by means of implantation and SiC based semiconductor component
09/20/2000CN1267243A Drive assembly for workpiece processing system
09/20/2000CN1267180A Terminal structure to connect electronic component thereon
09/20/2000CN1267091A Semiconductor IC device
09/20/2000CN1267090A 6 1/4 ff DRAM unit structure with arrangement of four node tied by per bit line and two-stage word line
09/20/2000CN1267088A Semiconductor lead frame assembly and method for mfg. semiconductor element
09/20/2000CN1267087A Semiconductor device and its making method
09/20/2000CN1267086A Electronic package method
09/20/2000CN1267085A Chip, and device and method for chamfering chip
09/20/2000CN1267084A Ultrasonic washer and wet treatment nozzle with ultrasonic washer
09/20/2000CN1267083A Projective reinforced mask of improving technique window
09/20/2000CN1267082A Graticule having new identifying pattern
09/20/2000CN1266843A Organic antireflecting coating and its preparation
09/20/2000CN1056706C Apparatus for sealing of semiconductor device with resin
09/19/2000USRE36875 Semiconductor memory device capable of performing test mode operation and method of operating such semiconductor device
09/19/2000US6122702 Memory cells matrix for a semiconductor integrated microcontroller
09/19/2000US6122566 Method and apparatus for sequencing wafers in a multiple chamber, semiconductor wafer processing system
09/19/2000US6122562 Method and apparatus for selectively marking a semiconductor wafer
09/19/2000US6122556 Operating system for fabrication apparatus
09/19/2000US6122440 Optical heating device for rapid thermal processing (RTP) system
09/19/2000US6122439 Rapid thermal heating apparatus and method
09/19/2000US6122397 Method and apparatus for maskless semiconductor and liquid crystal display inspection
09/19/2000US6122215 DRAM having a power supply voltage lowering circuit
09/19/2000US6122196 Semiconductor non-volatile storage device capable of a high speed reading operation
09/19/2000US6122192 Non-volatile semiconductor memory device and fabrication method thereof
09/19/2000US6122190 Semiconductor memory device capable of high speed plural parallel test
09/19/2000US6122188 Non-volatile memory device having multi-bit cell structure and a method of programming same
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