Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2000
12/27/2000EP1063050A2 Mobile workpiece carrier and method of using the same
12/27/2000EP1063049A2 Optical system and apparatus for laser heat treatment and method for producing semiconductor devices by using the same
12/27/2000EP1062849A1 Circuit board features with reduced parasitic capacitance and method therefor
12/27/2000EP1062848A2 Integrated circuit connection using an electrically conductive adhesive
12/27/2000EP1062700A1 Power semiconductor structural part with a mesa edge
12/27/2000EP1062697A1 Method for reducing the capacitance between interconnects by forming voids in dielectric material
12/27/2000EP1062696A1 Integrated electronic circuit and method for producing the same
12/27/2000EP1062695A1 Method for fabricating double sided ceramic circuit boards using a titanium support substrate
12/27/2000EP1062694A1 Process for copper etch back
12/27/2000EP1062693A1 Semiconductor fabrication method and system
12/27/2000EP1062692A1 Devices formable by low temperature direct bonding
12/27/2000EP1062691A1 Selective wet etching of inorganic antireflective coatings
12/27/2000EP1062690A1 Method and apparatus for preventing warp of clamp ring used for wafer coating apparatus
12/27/2000EP1062689A2 Solar cell arrangement
12/27/2000EP1062688A1 Over-voltage protection device for integrated circuits
12/27/2000EP1062687A1 On the fly center-finding during substrate handling in a processing system
12/27/2000EP1062686A1 Installation and method for chemical treatment of microelectronics wafers
12/27/2000EP1062685A1 Integrated large area microstructures and micromechanical devices
12/27/2000EP1062684A2 Trench isolation for micromechanical devices
12/27/2000EP1062683A1 Article holders and holding methods
12/27/2000EP1062682A1 Selective silicon oxide etchant formulation including fluoride salt, chelating agent and glycol solvent
12/27/2000EP1062681A1 Production facility for integrated circuits
12/27/2000EP1062679A1 Plasma etching installation
12/27/2000EP1062669A1 Method of producing carbon with electrically active sites
12/27/2000EP1062667A2 Method to write/read mram arrays
12/27/2000EP1062618A1 Non-lot based method for assembling integrated circuit devices
12/27/2000EP1062545A1 Positive acting photodielectric composition
12/27/2000EP1062539A1 Improved photovaltaic generator circuit
12/27/2000EP1062468A1 Apparatus for packaging contaminant-sensitive articles and resulting package
12/27/2000EP1062377A1 Deposition of copper with increased adhesion
12/27/2000EP1062180A1 Method for processing silicon using etching processes
12/27/2000EP1062172A1 Semiconductor wafer input/output handling system
12/27/2000EP1008177A4 Improved active matrix esd protection and testing scheme
12/27/2000EP0880421B1 Method of bonding insulating wire and device for carrying out this method
12/27/2000EP0815501B1 Apparatus and method for controlling high throughput sputtering
12/27/2000CN2412293Y Doctor for fixing tin ball on chip
12/27/2000CN1278365A Electrical interface to integrated device having high density I/O count
12/27/2000CN1278364A Device with security integrated circuit and method for making same
12/27/2000CN1278363A Component and method for prodn. thereof
12/27/2000CN1278362A Method and apparatus for cleaning semiconductor substrates after polishing of copper film
12/27/2000CN1278361A Transport system
12/27/2000CN1278338A Process for determining possible configurations of machining plant
12/27/2000CN1278308A Method of making a structure with improved material properties by moderate heat treatment of a metal deposit
12/27/2000CN1278229A Semiconductor processing apparatus having wafer re-orientation mechanism
12/27/2000CN1278201A Abrasive articles comprising fluorochemical agent for wafer surface modification
12/27/2000CN1278110A Electroluminescent display element, driving method and electronic device therewith
12/27/2000CN1278109A Electrooptical device and electronic device
12/27/2000CN1278108A Semiconductor device and its mfg. method
12/27/2000CN1278107A Manufacture of grid electrode conductor layer cavity fuse
12/27/2000CN1277966A Method for producing metal-ligand compositions
12/27/2000CN1277904A Ultrasonic vibration welding means
12/27/2000CN1059983C Method for forming dynamic random access memory
12/27/2000CN1059982C Method for welding packaged integrated circuit plate
12/27/2000CN1059913C Method of adhesion to a polymide surface by formation of covalent bonds
12/27/2000CN1059878C Method and apparatus for cleaning electronic parts
12/26/2000USRE36998 Circuit for limiting the output voltage of a power transistor
12/26/2000US6167323 Method and system for controlling gas system
12/26/2000US6167322 Intelligent wafer handling system and method
12/26/2000US6167195 Multizone illuminator for rapid thermal processing with improved spatial resolution
12/26/2000US6167194 Guard ring of a heating device of the light irradiation type
12/26/2000US6166990 Clock reproduction circuit that can reproduce internal clock signal correctly in synchronization with external clock signal
12/26/2000US6166987 Nonvolatile semiconductor memory device having row decoder
12/26/2000US6166975 Dynamic random access memory
12/26/2000US6166958 Semiconductor memory device, method for manufacturing the same, and method for controlling the same
12/26/2000US6166954 Single poly non-volatile memory having a PMOS write path and an NMOS read path
12/26/2000US6166953 Data line disturbance free memory block divided flash memory and microcomputer having flash memory therein
12/26/2000US6166944 Data storing apparatus including integrated magnetic memory cells and semiconductor devices
12/26/2000US6166941 Relaxed layout for storage nodes for dynamic random access memories
12/26/2000US6166940 Semiconductor memory device having a plurality of storage regions
12/26/2000US6166921 Semiconductor device including an integrated circuit for realizing a DC voltage converter
12/26/2000US6166915 Electronic circuits and circuit boards
12/26/2000US6166898 Plasma chamber wafer clamping ring with erosion resistive tips
12/26/2000US6166897 Static chuck apparatus and its manufacture
12/26/2000US6166865 Projection optical system and exposure apparatus
12/26/2000US6166819 System and methods for optically measuring dielectric thickness in semiconductor devices
12/26/2000US6166812 Stage apparatus
12/26/2000US6166794 Liquid crystal device including gate insulating film and layer insulating film having different dielectric constants
12/26/2000US6166786 Semiconductor element with N channel and P region connected only to the channel and liquid crystal display device using the same
12/26/2000US6166785 Thin film transistor and fabricating method thereof having patterned active layer
12/26/2000US6166646 Vacuum-adsorbing apparatus of semiconductor device fabrication facility
12/26/2000US6166588 Power supply circuit
12/26/2000US6166580 CMOS high-to-low voltage buffer
12/26/2000US6166560 Basic cell structure having a plurality of transistors for master slice type semiconductor integrated circuit device
12/26/2000US6166558 Method for measuring gate length and drain/source gate overlap
12/26/2000US6166552 Method and apparatus for testing a semiconductor wafer
12/26/2000US6166509 Detection system for substrate clamp
12/26/2000US6166505 Interlocking apparatus
12/26/2000US6166447 Semiconductor memory device having first and second voltage level shifters
12/26/2000US6166445 Semiconductor device and method for producing same
12/26/2000US6166443 Semiconductor device with reduced thickness
12/26/2000US6166442 Semiconductor device
12/26/2000US6166440 Interconnection for preventing signal interference in a semiconductor device
12/26/2000US6166439 Low dielectric constant material and method of application to isolate conductive lines
12/26/2000US6166438 Ultrathin electronics using stacked layers and interconnect vias
12/26/2000US6166436 High frequency semiconductor device
12/26/2000US6166434 Die clip assembly for semiconductor package
12/26/2000US6166433 Resin molded semiconductor device and method of manufacturing semiconductor package
12/26/2000US6166432 Substrate for use in wafer attracting apparatus and manufacturing method thereof
12/26/2000US6166431 Semiconductor device with a thickness of 1 MM or less
12/26/2000US6166428 Semiconductor devices with a barrier layer of nitrogen doped amorphous silicon or polysilicon and having a hydrogen getter layer formed under the barrier layer; getter layer is removed from portions of the device where salicide layers are to form
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