Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2000
12/26/2000US6165847 Nonvolatile semiconductor memory device and method for manufacturing the same
12/26/2000US6165846 Method of eliminating gate leakage in nitrogen annealed oxides
12/26/2000US6165845 Method to fabricate poly tip in split-gate flash
12/26/2000US6165844 Method for forming a textured surface on a semiconductor substrate and a tunneling oxide layer on the textured surface
12/26/2000US6165843 Covered slit isolation between integrated circuit devices
12/26/2000US6165842 Method for fabricating a non-volatile memory device using nano-crystal dots
12/26/2000US6165841 Dry etching a doped amorphous silicon layer using a lower electrode layer pattern; fluorinating the silicon while suppressing oxide formation; hydrogenation to replace the fluorine; desorbing hydrogen to expose bonds for nucleation
12/26/2000US6165840 Method for fabricating a DRAM cell capacitor including forming first multilayer insulator, forming conductive plug, forming second insulator, and etching second and first insulators to form the storage node
12/26/2000US6165839 Process to fabricate a cylindrical, capacitor structure under a bit line structure for a dynamic random access memory cell
12/26/2000US6165838 Method of forming a capacitor
12/26/2000US6165837 Semiconductor integrated memory manufacturing method and device
12/26/2000US6165836 Circuit and method for an open bit line memory cell with a vertical transistor and trench plate trench capacitor
12/26/2000US6165835 Method for producing a silicon capacitor
12/26/2000US6165834 Method of forming capacitors, method of processing dielectric layers, method of forming a DRAM cell
12/26/2000US6165833 Semiconductor processing method of forming a capacitor
12/26/2000US6165831 Method of fabricating a buried contact in a static random access memory
12/26/2000US6165830 Method to decrease capacitance depletion, for a DRAM capacitor, via selective deposition of a doped polysilicon layer on a selectively formed hemispherical grain silicon layer
12/26/2000US6165829 Thin film transistor and fabrication method therefor
12/26/2000US6165828 Structure and method for gated lateral bipolar transistors
12/26/2000US6165827 Semiconductor transistor devices and methods for forming semiconductor transistor devices
12/26/2000US6165826 Transistor with low resistance tip and method of fabrication in a CMOS process
12/26/2000US6165825 Semiconductor device and method for producing the same
12/26/2000US6165824 Method of manufacturing a semiconductor device
12/26/2000US6165823 Thin film transistor and a fabricating method therefor
12/26/2000US6165822 Silicon carbide semiconductor device and method of manufacturing the same
12/26/2000US6165821 P channel radhard device with boron diffused P-type polysilicon gate
12/26/2000US6165820 Package for electronic devices
12/26/2000US6165819 Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
12/26/2000US6165815 Method of fabrication of stacked semiconductor devices
12/26/2000US6165814 Thin film capacitor coupons for memory modules and multi-chip modules
12/26/2000US6165813 Replacing semiconductor chips in a full-width chip array
12/26/2000US6165810 Method of manufacturing semiconductor device and display device
12/26/2000US6165806 Fault isolation within an inner lead bond region of a μBGA (micro ball grid array) package for an integrated circuit die
12/26/2000US6165805 Scan tool recipe server
12/26/2000US6165804 Scalable high dielectric constant capacitor
12/26/2000US6165803 Magnetic random access memory and fabricating method thereof
12/26/2000US6165802 Method of fabricating ferroelectric integrated circuit using oxygen to inhibit and repair hydrogen degradation
12/26/2000US6165801 Method for making a monolithic integrated high-Tc superconductor-semiconductor structure
12/26/2000US6165697 Antihalation compositions
12/26/2000US6165695 Photoresists on dielectric layers
12/26/2000US6165694 Method for preventing the formation of recesses in borophosphosilicate glass
12/26/2000US6165692 Method for manufacturing a semiconductor device and an exposure mask used therefor
12/26/2000US6165682 Radiation sensitive copolymers, photoresist compositions thereof and deep UV bilayer systems thereof
12/26/2000US6165680 Photosensitivity polymers
12/26/2000US6165677 Photoresist composition
12/26/2000US6165675 Photoresists of photosensitive component and novolak resin in solvent
12/26/2000US6165674 Polymers and photoresist compositions for short wavelength imaging
12/26/2000US6165659 Method of manufacturing ceramic electronic parts
12/26/2000US6165656 Overlay error determination mark considering influence of aberration
12/26/2000US6165652 Photomasking a gate pattern in multilayer semiconductors, controlling and development
12/26/2000US6165649 Methods for repair of photomasks
12/26/2000US6165629 Compensator with metal layer having etched opening with knife edge configuration and conforming polymer coating; dimensional stability
12/26/2000US6165622 Ferroelectric thin film, substrate provided with ferroelectric thin film, device having capacitor structure and method for manufacturing ferroelectric thin film
12/26/2000US6165613 Carrier reacts with resin or vaporizes
12/26/2000US6165567 Using ionized metal plasma physical vapor deposition
12/26/2000US6165556 High dielectric constant thin film structure, method for forming high dielectric constant thin film, and apparatus for forming high dielectric constant thin film
12/26/2000US6165555 From 1,1,1,5,5,5-hexafluoro-2,4-pentanedionato(vinyltrimethoxysilan e) copper(i) and 1,1,1,5,5,5-hexafluoro-2,4-pentanedione
12/26/2000US6165552 Positioning process liquid supply nozzle above rectangular substrate and supplying process liquid to portion at rotation center portion of rectangular substrate to form film, rotating rectangular substrate in cup to adjust film thickness
12/26/2000US6165413 Pre-packing a powder bed by hot pressing or vibration between metal plates, followed by hot isostatic pressing for making integrated circuits
12/26/2000US6165405 Press for encapsulating electronic components and methods for use of the press
12/26/2000US6165377 Plasma etching method and apparatus
12/26/2000US6165376 Work surface treatment method and work surface treatment apparatus
12/26/2000US6165375 Plasma etching method
12/26/2000US6165334 Dry etching apparatus
12/26/2000US6165328 Low pressure pump such as cryopump coupled to the processing chamber with a throttle plate; valve mechanism couples noble gas to chamber so noble gas flows in continuously and is pumped out with cryopump, getter pump removes impurity gases
12/26/2000US6165314 Apparatus for performing jet vapor reduction of the thickness of process layers
12/26/2000US6165311 Inductively coupled RF plasma reactor having an overhead solenoidal antenna
12/26/2000US6165310 Apparatus and method for removing parts from an adhesive film
12/26/2000US6165279 Method for cleaning a semiconductor wafer
12/26/2000US6165277 Method of rinsing and drying semiconductor wafers in a chamber with a movable side wall
12/26/2000US6165276 Apparatus for preventing plasma etching of a wafer clamp in semiconductor fabrication processes
12/26/2000US6165274 Plasma processing apparatus and method
12/26/2000US6165273 Equipment for UV wafer heating and photochemistry
12/26/2000US6165271 Temperature controlled process and chamber lid
12/26/2000US6165270 Process solution supplying apparatus
12/26/2000US6165268 Wafer carrier adapter and method for use thereof
12/26/2000US6165267 Spin coating apparatus
12/26/2000US6165265 Method of deposition of a single-crystal silicon region
12/26/2000US6165264 Method for semiconductor crystal growth
12/26/2000US6165247 Methods for producing platinum powders
12/26/2000US6165232 Method and apparatus for securely holding a substrate during dicing
12/26/2000US6165056 Polishing machine for flattening substrate surface
12/26/2000US6165052 Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation
12/26/2000US6165051 Monitoring system for dicing saws
12/26/2000US6165050 Method of manufacturing semiconductor device using precision polishing apparatus with detecting means
12/26/2000US6165048 Chemical-mechanical-polishing system with continuous filtration
12/26/2000US6164963 Semiconductor furnace processing vessel base
12/26/2000US6164946 Ball grid array (BGA) encapsulation mold
12/26/2000US6164899 Disk transfer apparatus
12/26/2000US6164894 Method and apparatus for integrated wafer handling and testing
12/26/2000US6164816 Tuning a substrate temperature measurement system
12/26/2000US6164633 Multiple size wafer vacuum chuck
12/26/2000US6164530 Disk carrier with transponder
12/26/2000US6164523 Electronic component and method of manufacture
12/26/2000US6164522 Method of manufacturing a thick film circuit with constrained adhesive spreading
12/26/2000US6164518 Wire bonding method and apparatus
12/26/2000US6164516 Soldering apparatus and method
12/26/2000US6164454 Apparatus and method for storing semiconductor objects
12/26/2000US6164300 Substate-treating device
12/26/2000US6164297 Cleaning and drying apparatus for objects to be processed