| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/15/2001 | WO2001018852A1 Passivation of material using ultra-fast pulsed laser |
| 03/15/2001 | WO2001018851A1 Method for integration of integrated circuit devices |
| 03/15/2001 | WO2001018850A1 System for controlling the temperature of a reflective substrate during rapid heating |
| 03/15/2001 | WO2001018849A2 Integrated circuit arrangement with at least a capacitor and a method for the production of the said |
| 03/15/2001 | WO2001018848A2 Pre-metal dielectric rapid thermal processing for sub-micron technology |
| 03/15/2001 | WO2001018845A1 Method of determining etch endpoint using principal components analysis of optical emission spectra |
| 03/15/2001 | WO2001018844A1 Processing method using focused ion beam |
| 03/15/2001 | WO2001018843A1 Scanning electron beam microscope having an electrode for controlling charge build up during scanning of a sample |
| 03/15/2001 | WO2001018830A1 Thin-film capacitor |
| 03/15/2001 | WO2001018816A1 Memory cell arrangement and operational method therefor |
| 03/15/2001 | WO2001018815A1 Self-erasing memory cell |
| 03/15/2001 | WO2001018774A1 Electric circuit board, tft array substrate using the same, and liquid crystal display |
| 03/15/2001 | WO2001018623A1 Real-time fault detection |
| 03/15/2001 | WO2001018607A1 Method and apparatus for determining post exposure bake endpoint using residual gas analysis |
| 03/15/2001 | WO2001018606A1 Data path for high performance pattern generator |
| 03/15/2001 | WO2001018603A2 Polymer for chemically amplified resist and a resist composition using the same |
| 03/15/2001 | WO2001018470A1 Thermocapillary dryer |
| 03/15/2001 | WO2001018285A1 Silicon wafer and method for manufacturing the same |
| 03/15/2001 | WO2001017957A1 Prostaglandin e analogues |
| 03/15/2001 | WO2001017927A1 Carbon-containing aluminium nitride sintered compact and ceramic substrate for use in equipment for manufacturing or inspecting semiconductor |
| 03/15/2001 | WO2001017725A1 Polishing pad |
| 03/15/2001 | WO2001017724A2 Ultrasonic transducer slurry dispenser |
| 03/15/2001 | WO2001017699A1 Method for cleaning substrate surfaces |
| 03/15/2001 | WO2001017692A1 Improved apparatus and method for growth of a thin film |
| 03/15/2001 | WO2000079582A9 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 03/15/2001 | WO2000075964A3 Method of fabricating semiconductor device employing copper interconnect structure |
| 03/15/2001 | WO2000068973A3 System for treating wafers |
| 03/15/2001 | WO2000061834A8 Low dielectric mano-porous material obtainable from polymer decomposition |
| 03/15/2001 | WO2000049642A3 Semiconductor structure with a programmable strip conductor |
| 03/15/2001 | WO2000048936A8 Robotic gripping device |
| 03/15/2001 | WO1999060609A3 Multi-function chamber for a substrate processing system |
| 03/15/2001 | US20010000034 Damascene process with anti-reflection coating |
| 03/15/2001 | US20010000033 Tapered thickness of the dielectric regions enhances the degree of uniformity of the electric field along the sidewalls of the trenches and in the mesa; support higher blocking voltages despite a high concentration of dopants; |
| 03/15/2001 | US20010000032 Microelectronic element bonding with deformation of leads in rows |
| 03/15/2001 | US20010000013 High performance sub-system design and assembly |
| 03/15/2001 | US20010000012 Interlayer dielectric with a composite dielectric stack |
| 03/15/2001 | US20010000011 Method for producing semiconductor device |
| 03/15/2001 | DE19944925A1 Vertical layer structure for silicon-based bipolar transistors contains one or more monolayers consisting of doping atoms |
| 03/15/2001 | DE19943064A1 Process for the epitaxial deposition of atoms or molecules comprises feeding first energy amount by heating the deposition surface, and feeding an ionized inert gas temporarily onto the surface to temporarily introduce second energy amount |
| 03/15/2001 | DE19942879A1 Halbleiterelement und Verfahren zur Herstellung des Halbleiterbauelements Semiconductor element and method of manufacturing the semiconductor device |
| 03/15/2001 | DE19942447A1 Speicherzellenanordnung und Verfahren zu deren Betrieb Memory cell arrangement and method of operation |
| 03/15/2001 | DE19942437A1 Selbstlöschende Speicherzelle Self-extinguishing memory cell |
| 03/15/2001 | DE19942282A1 Verfahren zur Reinigung von Substratoberflächen A method for cleaning substrate surfaces |
| 03/15/2001 | DE19941902A1 Verfahren zur Herstellung von mit Stickstoff dotierten Halbleiterscheiben A process for producing nitrogen-doped semiconductor wafers |
| 03/15/2001 | DE19941605A1 Galvanisierungslösung für die galvanische Abscheidung von Kupfer Electroplating solution for the electrodeposition of copper |
| 03/15/2001 | DE19941042A1 Verfahren zur Herstellung oberflächenmikromechanischer Strukturen durch Ätzung mit einem dampfförmigen, flußsäurehaltigen Ätzmedium A process for producing surface micromechanical structures by etching with a vapor, hydrofluoric acid etching medium |
| 03/15/2001 | DE19940758A1 Verfahren zur Herstellung eines HF-FET und HF-FET A process for the preparation of a FET RF and HF-FET |
| 03/15/2001 | DE19940317A1 Production of an integrated switching circuit comprises applying a spacer material to a substrate, partially back etching, masking with a mask and implanting a dopant and back etching the spacer |
| 03/15/2001 | DE19937504A1 Verfahren zur Herstellung einer Isolation A process for the production of an insulation |
| 03/15/2001 | DE19924571C2 Verfahren zur Herstellung eines Doppel-Gate-MOSFET-Transistors A method for producing a double gate MOSFET transistor |
| 03/15/2001 | DE10054161A1 Packing for semiconductor wafers has a surface modified in such a way that it has contamination-reducing properties |
| 03/15/2001 | DE10044408A1 Pin block structure for containment and support of connector pins for use in automatic testing of a wide range of semiconductor structures having different connector pin arrangements |
| 03/15/2001 | DE10039672A1 Substrate processing device e.g. for chemical cleaning of semiconductor wafers, includes substrate lifting device with vertically movable substrate support |
| 03/15/2001 | DE10037697A1 Adaptive mask engineering for inspecting defects uses an algorithm to generate a two-dimensional scatter diagram by plotting grey grades of pixels from a test image in contrast to grey grades of pixels from a reference image. |
| 03/15/2001 | DE10019472A1 Reinigungsvorrichtung Cleaning device |
| 03/15/2001 | DE10018852A1 Silicium enthaltendes Polymer, Verfahren zu seiner Herstellung, dieses verwendende Resistzusammensetzung, Musterbildungsverfahren und Verfahren zur Herstellung einer elektronischen Anordnung Silicon-containing polymer, method for its manufacture, use of this resist composition, and pattern-forming method A method for manufacturing an electronic device |
| 03/15/2001 | DE10014112A1 Multi-bank semiconductor memory device circuit arrangement, has column decoder blocks arranged between adjacent pairs of memory banks in which at least one global E/A line pair extends to adjacent memory bank |
| 03/15/2001 | CA2384463A1 Improved apparatus and methods for integrated circuit planarization |
| 03/15/2001 | CA2384148A1 Prostaglandin e analogues |
| 03/14/2001 | EP1083608A1 Field-effect semiconductor device |
| 03/14/2001 | EP1083607A2 High voltage SOI semiconductor device |
| 03/14/2001 | EP1083606A1 Field-effect semiconductor device |
| 03/14/2001 | EP1083605A2 Field effect transistor with double sided airbridge |
| 03/14/2001 | EP1083604A2 Radiation hardened semiconductor memory |
| 03/14/2001 | EP1083600A2 Multilayered circuit substrate |
| 03/14/2001 | EP1083598A1 Method of disposing lsi |
| 03/14/2001 | EP1083597A2 A method to create a controllable and reproductible dual copper damascene structure |
| 03/14/2001 | EP1083596A1 A method to create a copper dual damascene structure with less dishing and erosion |
| 03/14/2001 | EP1083594A2 Fired body for and manufacture of a substrate |
| 03/14/2001 | EP1083593A1 Etching of silicon nitride by anhydrous halogen gas |
| 03/14/2001 | EP1083592A1 Etching of silicon nitride by anhydrous halogen gas |
| 03/14/2001 | EP1083591A1 Device for plasma processing |
| 03/14/2001 | EP1083590A1 Method for producing thin film semiconductor device |
| 03/14/2001 | EP1083589A2 Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
| 03/14/2001 | EP1083578A1 Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate |
| 03/14/2001 | EP1083571A1 Semiconductor device with decreased power consumption |
| 03/14/2001 | EP1083502A1 Noise checking method and device |
| 03/14/2001 | EP1083470A2 Multi-computer chamber control system, method and medium |
| 03/14/2001 | EP1083463A2 Patterning method and semiconductor device |
| 03/14/2001 | EP1083435A2 Integrated circuit test apparatus |
| 03/14/2001 | EP1083424A2 Particle detection and embedded vision system to enhance substrate yield and throughput |
| 03/14/2001 | EP1083219A1 Cleaning fluid and cleaning method for component of semiconductor-treating apparatus |
| 03/14/2001 | EP1082884A1 Method for producing wirings having solder bumps |
| 03/14/2001 | EP1082764A1 Semiconductor current-switching device having operational enhancer and method therefor |
| 03/14/2001 | EP1082763A1 Nrom cell with improved programming, erasing and cycling |
| 03/14/2001 | EP1082762A1 Laminated integrated circuit package |
| 03/14/2001 | EP1082761A1 Methods for reducing semiconductor contact resistance |
| 03/14/2001 | EP1082760A1 Method of manufacturing a floating gate field-effect transistor |
| 03/14/2001 | EP1082759A1 Method of manufacturing a mis field-effect transistor |
| 03/14/2001 | EP1082758A2 Method of manufacturing a semiconductor device comprising a bipolar transistor |
| 03/14/2001 | EP1082757A1 Semiconductor device with transparent link area for silicide applications and fabrication thereof |
| 03/14/2001 | EP1082756A1 Method and device for transferring wafers |
| 03/14/2001 | EP1082755A1 A wafer buffer station and a method for a per-wafer transfer between work stations |
| 03/14/2001 | EP1082754A1 Gas delivery system |
| 03/14/2001 | EP1082725A1 Magnetoresistive random access memory and method for reading/writing digital information to such a memory |
| 03/14/2001 | EP1082470A1 Microchamber |
| 03/14/2001 | EP1082271A1 Wet processing methods for the manufacture of electronic components using liquids of varying temperature |
| 03/14/2001 | EP1082193A1 Method and device for carrying out working steps on miniaturised modules |
| 03/14/2001 | EP1027732A4 Monolithic inductor |
| 03/14/2001 | EP0865715A4 Process depending on plasma discharges sustained by inductive coupling |