Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2001
04/19/2001DE19944740A1 Shrinkage-free filling of trenches in integrated circuits comprises producing a growth-promoting layer on surfaces parallel to the substrate and then removing on the surfaces that are parallel to bumps
04/19/2001DE19944303A1 Production of integrated semiconductor circuit comprises deforming and/or making smaller mask islands before applying sink dopants to produce low ohmic contacts
04/19/2001DE19943385A1 Production of electrical connection between front and rear sides of semiconductor chips comprises applying metal seed forming layer, radiating the metal seed forming layer and forming conducting path
04/19/2001DE19941148A1 Speicher mit Grabenkondensator und Auswahltransistor und Verfahren zu seiner Herstellung Storage capacitor with grave and selection transistor and method for its preparation
04/19/2001DE19929615C1 Vorrichtung und Verwendung der Vorrichtung zur Überwachung von absichtlichen oder unvermeidbaren Schichtabscheidungen A device and use of the device for monitoring of deliberate or unavoidable layer depositions
04/19/2001DE10050636A1 Process for surface treating silicon wafers comprises preparing a treatment device, producing a foam by blowing a gas into a liquid containing a surfactant
04/19/2001DE10050577A1 Production of semiconductor component used in solar cells comprises forming first semiconductor layer on substrate, producing second semiconductor layer on first layer and removing second layer by laser abrasion
04/19/2001DE10050413A1 Electrostatic clamp for supporting dielectric wafer, has wafer contact electrode which contacts wafer to create electrical current path leading to wafer
04/19/2001DE10049148A1 Metamorphic heterojunction bipolar transistor for high power transistor amplifier has heavily doped n type InGaAs layer which represents ohmic contact for emitter
04/19/2001DE10047136A1 Electrical property testing method of ICs, obtains laser and reference interference signals by enabling overlapping of primary and secondary laser signals and reference signals within given time respectively
04/19/2001DE10012124A1 Semiconductor device with static random access memory has high concentration doping material region formed in contact with lower surface of contact plugs in source-drain areas of transistors
04/19/2001DE10008683A1 Semiconductor device comprises a semiconductor substrate, low concentration doping regions, a gate electrode with a protective layer, an intermediate insulating layer, a high concentration doping region and a conducting layer
04/19/2001DE10006638A1 Semiconductor component formed for combination with substrate or support, with array substrate containing first surface with preset conductive tracks
04/19/2001CA2404832A1 Molecular scale electronic devices
04/19/2001CA2386329A1 Single step pendeo- and lateral epitaxial overgrowth of group iii-nitride layers
04/18/2001EP1093328A2 Laser imaging of thin layer electronic circuitry material
04/18/2001EP1093322A1 Organic electroluminescence device and its manufacturing method
04/18/2001EP1093228A1 Delay interpolator circuit and semiconductor integrated circuit having same
04/18/2001EP1093169A1 Method of manufacturing semiconductor device, semicondutor device, narrow pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device
04/18/2001EP1093168A2 Field-effect transistor
04/18/2001EP1093167A2 Electro-optical device and manufacturing method thereof
04/18/2001EP1093165A1 Integrated circuit assembly
04/18/2001EP1093164A1 Lateral high-Q inductor for semiconductor devices
04/18/2001EP1093163A2 Electronic interconnect structure
04/18/2001EP1093161A1 Method and composite arrangement inhibiting corrosion of a metal layer following chemical mechanical polishing
04/18/2001EP1093160A2 Connecting material for anisotropically electroconductive connection
04/18/2001EP1093159A1 Method for encapsulating electronic components
04/18/2001EP1093158A1 Self-planarizing process for shallow trench isolation
04/18/2001EP1093157A2 Substrate processing method and apparatus
04/18/2001EP1093155A2 Device and method for loading substrates of different sizes on a substrate holder
04/18/2001EP1093154A2 Magnetron with cooling system for substrate processing system
04/18/2001EP1093153A2 Device and method for introducing different transparent substrates in a high-precision measuring apparatus
04/18/2001EP1093023A1 Photoresist developer compositions containing alkylated aminoalkylpiperazine surfactants
04/18/2001EP1093017A2 Method and apparatus for reticle inspection using aerial imaging
04/18/2001EP1092974A2 Detector for large wafers areas
04/18/2001EP1092946A1 High precision mask holder for measuring thickness
04/18/2001EP1092755A1 Coating composition
04/18/2001EP1092505A2 Method of controlling a polishing machine
04/18/2001EP1092504A1 Apparatus and method for polishing workpiece
04/18/2001EP1092474A2 Chemical delivery system with ultrasonic fluid sensors
04/18/2001EP1092338A1 Assembly of an electronic component with spring packaging
04/18/2001EP1092240A1 Fast luminescent silicon
04/18/2001EP1092239A1 Field effect transistors, integrated circuitry, methods of forming field effect transistor gates, and methods of forming integrated circuitry
04/18/2001EP1092238A1 Universal semiconductor wafer for high-voltage semiconductor components
04/18/2001EP1092237A1 Method of severing electrically conductive links with ultraviolet laser output
04/18/2001EP1092236A1 Ulsi mos with high dielectric constant gate insulator
04/18/2001EP1092235A1 Integrated capacitor and method of fabricating the same
04/18/2001EP1092234A1 Porous insulating compounds and method for making same
04/18/2001EP1092233A1 Method of forming a thin film
04/18/2001EP1092229A1 Multiple coil antenna for inductively-coupled plasma generation systems
04/18/2001EP1092228A2 Electrode for plasma processes and method for manufacture and use thereof
04/18/2001EP1092201A1 Method for storing multiple levels of design data in a common database
04/18/2001EP1092175A1 Lighting system for microlithography, comprising a depolarizer
04/18/2001EP1092173A1 Silver based photomasks
04/18/2001EP1092145A1 A system and method for analyzing topological features on a surface
04/18/2001EP1091965A1 Precursors for growth of heterometal-oxide films by mocvd
04/18/2001EP1091831A1 Improved polishing pad with reduced moisture absorption
04/18/2001EP1091829A2 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
04/18/2001EP1091811A1 Selective treatment of the surface of a microelectronic workpiece
04/18/2001EP1084001A4 Accurate positioning of a wafer
04/18/2001EP0946980A4 Improved integrated circuit structures and methods to facilitate accurate measurement of the ic devices
04/18/2001EP0929841A4 Method for forming photoresist features having reentrant profiles using a basic agent
04/18/2001EP0909341B1 Process for the production of metallic coatings on semiconductor structures
04/18/2001CN1292149A Methods of fabricating gallium nitride semiconductor layers by lateral overgrowth through masks, and gallium nitride semiconductor structures fabricated thereby
04/18/2001CN1292148A Slip free vertical rack design having rounded horizontal arms
04/18/2001CN1292110A Protection circuit for integrated circuit
04/18/2001CN1292103A Improved pattern generator
04/18/2001CN1292102A Pattern generator with EUV
04/18/2001CN1292040A Method of coating and annealing large area glass substrates
04/18/2001CN1291921A Methods of wet processing electronic components using process liquids with controlled levels of gases
04/18/2001CN1291793A Method of making semi conductor device
04/18/2001CN1291791A Metal wire fused wire structure possessing cavity body
04/18/2001CN1291790A Crack baffle plate between adjecent fuse wires to prevent burning break of fuse wire
04/18/2001CN1291789A Manufacturing method of lead-wire frame and resin sealing type semiconductor device
04/18/2001CN1291787A Cleaning agent for semiconductor device and manufacturing method of semiconductor device
04/18/2001CN1291786A Electro optical device and its making method
04/18/2001CN1291785A Manufacturing method of semiconductor device
04/18/2001CN1064780C Bottom lead semiconductor chip stack package
04/18/2001CN1064779C Isolation method for use in semiconductor device
04/17/2001US6219627 Architecture of a chip having multiple processors and multiple memories
04/17/2001US6219400 X-ray optical system and X-ray exposure apparatus
04/17/2001US6219367 Method for determining life of laser light source
04/17/2001US6219275 Magnetic thin film element, memory element using the same, and method for recording and reproducing using the memory element
04/17/2001US6219271 Semiconductor memory device
04/17/2001US6219253 Molded electronic package, method of preparation using build up technology and method of shielding
04/17/2001US6219219 Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system
04/17/2001US6219130 Position detecting apparatus
04/17/2001US6219118 LCD with shield film formed at overlapping portion of bus lines and pixel electrode
04/17/2001US6218889 Semiconductor integrated circuit device, and method of manufacturing the same
04/17/2001US6218888 Insulated gate bipolar transistor device with a current limiting circuit
04/17/2001US6218886 Device for compensating process and operating parameter variations in CMOS integrated circuits
04/17/2001US6218883 Semiconductor integrated circuit for electric microphone
04/17/2001US6218881 Semiconductor integrated circuit device
04/17/2001US6218877 Semiconductor device with delay locked loop
04/17/2001US6218867 Pass transistor circuit
04/17/2001US6218865 Semiconductor device having function blocks with obliquely arranged signal terminals connected through two-dimensionally extensible signal lines
04/17/2001US6218861 Functional block and semiconductor integrated circuit architected by a plurality of functional blocks in combination
04/17/2001US6218847 Test pattern for use in measuring thickness of insulating layer and method for using the same
04/17/2001US6218736 Circuit board and semiconductor device, and method of manufacturing the same
04/17/2001US6218735 Process to improve adhesion of cap layers in intergrated circuits